Method for forming fins in a FinFET device using sacrificial carbon layer
    42.
    发明授权
    Method for forming fins in a FinFET device using sacrificial carbon layer 有权
    在使用牺牲碳层的FinFET器件中形成翅片的方法

    公开(公告)号:US06645797B1

    公开(公告)日:2003-11-11

    申请号:US10310926

    申请日:2002-12-06

    IPC分类号: H01L2184

    CPC分类号: H01L29/785 H01L29/66795

    摘要: A method for forming a fin in a semiconductor device that includes a substrate, an insulating layer formed on the substrate, and a conductive layer formed on the insulating layer, includes forming a carbon layer over the conductive layer and forming a mask over the carbon layer. The method further includes etching the mask and carbon layer to form at least one structure, where the structure has a first width, reducing the width of the carbon layer in the at least one structure to a second width, depositing an oxide layer to surround the at least one structure, removing a portion of the oxide layer and the mask, removing the carbon layer to form an opening in a remaining portion of the oxide layer for each of the at least one structure, filling the at least one opening with conductive material, and removing the remaining portion of the oxide layer and a portion of the conductive layer to form the fin.

    摘要翻译: 一种在半导体器件中形成翅片的方法,包括:衬底,形成在衬底上的绝缘层和形成在绝缘层上的导电层,包括在导电层上形成碳层,并在碳层上形成掩模 。 该方法还包括蚀刻掩模和碳层以形成至少一种结构,其中结构具有第一宽度,将至少一个结构中的碳层的宽度减小到第二宽度,沉积氧化物层以围绕 至少一个结构,去除所述氧化物层和所述掩模的一部分,除去所述碳层以在所述至少一个结构中的每一个结构的氧化物层的剩余部分中形成开口,用导电材料填充所述至少一个开口 并且去除氧化物层的剩余部分和导电层的一部分以形成翅片。

    Tri-gate and gate around MOSFET devices and methods for making same
    44.
    发明授权
    Tri-gate and gate around MOSFET devices and methods for making same 有权
    围绕MOSFET器件的三栅极和栅极及其制造方法

    公开(公告)号:US07259425B2

    公开(公告)日:2007-08-21

    申请号:US10348911

    申请日:2003-01-23

    IPC分类号: H01L29/72

    摘要: A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.

    摘要翻译: 三栅极金属氧化物半导体场效应晶体管(MOSFET)包括翅片结构,邻近翅片结构的第一侧形成的第一栅极,与第一侧相对的翅片结构的第二侧附近形成的第二栅极,以及 形成在鳍结构顶部的顶门。 MOSFET周围的栅极包括多个散热片,邻近其中一个翅片形成的第一侧壁栅极结构,邻近另一个鳍片形成的第二侧壁栅极结构,形成在一个或多个翅片上的顶部栅极结构,以及底部栅极 在一个或多个翅片下形成的结构。

    Double gate semiconductor device having a metal gate
    45.
    发明授权
    Double gate semiconductor device having a metal gate 有权
    具有金属栅极的双栅极半导体器件

    公开(公告)号:US07256455B2

    公开(公告)日:2007-08-14

    申请号:US10720166

    申请日:2003-11-25

    摘要: A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.

    摘要翻译: 半导体器件可以包括衬底,形成在衬底上的绝缘层和形成在绝缘层上的导电鳍。 导电翅片可以包括多个侧表面和顶表面。 半导体器件还可以包括形成在与导电鳍片的第一端相邻的绝缘层上的源极区域和形成在与导电鳍片的第二端相邻的绝缘层上的漏极区域。 半导体器件还可以包括在半导体器件的沟道区域中形成在与绝缘层相邻的导电鳍片上的金属栅极。

    Narrow-body damascene tri-gate FinFET
    46.
    发明授权
    Narrow-body damascene tri-gate FinFET 有权
    窄体镶嵌三栅极FinFET

    公开(公告)号:US07186599B2

    公开(公告)日:2007-03-06

    申请号:US10754540

    申请日:2004-01-12

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method of forming a fin field effect transistor includes forming a fin and forming a source region on a first end of the fin and a drain region on a second end of the fin. The method further includes forming a dummy gate with a first semi-conducting material in a first pattern over the fin and forming a dielectric layer around the dummy gate. The method also includes removing the first semi-conducting material to leave a trench in the dielectric layer corresponding to the first pattern, thinning a portion of the fin exposed within the trench, and forming a metal gate within the trench.

    摘要翻译: 形成鳍状场效应晶体管的方法包括:在鳍片的第一端上形成翅片并形成源极区域,在鳍片的第二端部形成漏极区域。 该方法还包括在鳍上形成具有第一图案的第一半导体材料的虚拟栅极,并在虚拟栅极周围形成介电层。 该方法还包括去除第一半导体材料以在对应于第一图案的电介质层中留下沟槽,使在沟槽内暴露的鳍片的一部分变薄,并在沟槽内形成金属栅极。

    Germanium MOSFET devices and methods for making same
    47.
    发明授权
    Germanium MOSFET devices and methods for making same 有权
    锗MOSFET器件及其制造方法

    公开(公告)号:US07148526B1

    公开(公告)日:2006-12-12

    申请号:US10348758

    申请日:2003-01-23

    IPC分类号: H01L29/72

    摘要: A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

    摘要翻译: 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍

    Narrow body raised source/drain metal gate MOSFET
    48.
    发明授权
    Narrow body raised source/drain metal gate MOSFET 有权
    窄体凸起源极/漏极金属栅极MOSFET

    公开(公告)号:US07034361B1

    公开(公告)日:2006-04-25

    申请号:US10653234

    申请日:2003-09-03

    IPC分类号: H01L27/01

    摘要: A semiconductor device includes a fin, a source region formed adjacent the fin and having a height greater than that of the fin, and a drain region formed adjacent the a second side of the fin and having a height greater than that of the fin. A metal gate region is formed at a top surface and at least one side surface of the fin. A width of the source and drain region may be greater than that of the fin. The semiconductor device may exhibit a reduced series resistance and an improved transistor drive current.

    摘要翻译: 半导体器件包括鳍状物,邻近翅片形成的源极区域,其高度大于鳍状物的高度;以及漏极区域,其形成在翅片的第二侧附近并且具有高于翅片的高度。 金属栅极区域形成在翅片的顶表面和至少一个侧表面处。 源极和漏极区域的宽度可以大于鳍片的宽度。 半导体器件可以呈现减小的串联电阻和改进的晶体管驱动电流。

    Damascene tri-gate FinFET
    50.
    发明申请
    Damascene tri-gate FinFET 有权
    大马士革三栅极FinFET

    公开(公告)号:US20050153492A1

    公开(公告)日:2005-07-14

    申请号:US10754559

    申请日:2004-01-12

    摘要: A method of forming a fin field effect transistor includes forming a fin and forming a source region adjacent a first end of the fin and a drain region adjacent a second end of the fin. The method further includes forming a dummy gate over the fin and forming a dielectric layer around the dummy gate. The method also includes removing the dummy gate to form a trench in the dielectric layer and forming a metal gate in the trench.

    摘要翻译: 形成鳍状场效应晶体管的方法包括形成鳍片并形成与鳍片的第一端相邻的源极区域和与鳍片的第二端部相邻的漏极区域。 该方法还包括在鳍上方形成虚拟栅极,并在虚拟栅极周围形成电介质层。 该方法还包括去除伪栅极以在电介质层中形成沟槽并在沟槽中形成金属栅极。