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公开(公告)号:US07133431B2
公开(公告)日:2006-11-07
申请号:US10629670
申请日:2003-07-30
申请人: Kazutoshi Onozawa , Tetsuzo Ueda , Daisuke Ueda
发明人: Kazutoshi Onozawa , Tetsuzo Ueda , Daisuke Ueda
IPC分类号: H01S5/00
CPC分类号: H01S5/02252 , G11B7/1275 , G11B7/22 , G11B2007/0006 , H01L24/95 , H01L2224/95085 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/10329 , H01L2924/10349 , H01L2924/12042 , H01L2924/14 , H01S5/02236 , H01S5/4031 , H01L2924/00
摘要: A semiconductor laser device includes a substrate which is made of, e.g., silicon and which has in its principal surface first and second recessed portions formed at a distance from each other. Disposed in the first recessed portion is a first semiconductor laser chip in the form of a function block, which emits an infrared laser beam. Disposed in the second recessed portion is a second semiconductor laser chip in the form of a function block, which emits a red laser beam.
摘要翻译: 半导体激光器件包括由例如硅制成并且在其主表面中形成有彼此间隔一定距离的第一和第二凹部的衬底。 设置在第一凹部中的是发射红外激光束的功能块形式的第一半导体激光器芯片。 设置在第二凹部中的是发射红色激光束的功能块形式的第二半导体激光器芯片。
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公开(公告)号:US20060203860A1
公开(公告)日:2006-09-14
申请号:US11352948
申请日:2006-02-13
IPC分类号: H01S3/10
CPC分类号: H01S5/02292 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/4012 , H01S5/4087
摘要: A laser module includes a substrate 1, a first laser element 2 placed on the substrate 1, a second laser element 3 placed with an output surface opposed to the first laser element 2 on the substrate 1, and a mirror 7 placed between the first laser element 2 and the second laser element 3. The mirror 7 has a reflective surface capable of reflecting output light from the first laser element 2 or the second laser element 3 in a predetermined direction, and is placed so as to move or rotate between a first position capable of reflecting the output light from the first laser element 2 and a second position capable of reflecting the output light from the second laser element 3. Thus, a laser module can be provided in which high precision, low cost, and miniaturization can be realized.
摘要翻译: 激光模块包括基板1,放置在基板1上的第一激光元件2,在基板1上设置有与第一激光元件2相对的输出面的第二激光元件3,以及配置在第一激光器 元件2和第二激光元件3。 反射镜7具有反射表面,该反射表面能够沿预定方向反射来自第一激光元件2或第二激光元件3的输出光,并且能够在能够反射来自第一激光元件2或第二激光元件3的输出光的第一位置之间移动或旋转 第一激光元件2和能够反射来自第二激光元件3的输出光的第二位置。 因此,可以提供可以实现高精度,低成本和小型化的激光模块。
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公开(公告)号:US07045446B2
公开(公告)日:2006-05-16
申请号:US10840422
申请日:2004-05-07
申请人: Kazutoshi Onozawa , Daisuke Ueda , Tomoaki Tojo
发明人: Kazutoshi Onozawa , Daisuke Ueda , Tomoaki Tojo
CPC分类号: H01L24/95 , H01L21/67121 , H01L25/50 , H01L2224/95085 , H01L2224/95136 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/10329 , H01L2924/10349 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要: In a semiconductor device fabrication method using a fluidic self-assembly technique in which in a liquid, a plurality of semiconductor elements are mounted in a self-aligned manner on a substrate with a plurality of recessed portions formed therein, protruding potions that are inserted in the respective recessed portions of the substrate are formed in the lower portions of the respective semiconductor elements, the liquid in which the semiconductor elements have been spread is poured over the substrate intermittently, and the substrate is rotated in a period of time in which the liquid is not poured.
摘要翻译: 在使用流体自组装技术的半导体器件制造方法中,其中在液体中,多个半导体元件以自对准的方式安装在其上形成有多个凹部的基板上,插入的突出的部分 基板的各凹部形成在各半导体元件的下部,将半导体元件已经被分散的液体间歇地注入到基板上,并且使基板在液体 不倒
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公开(公告)号:US07014798B2
公开(公告)日:2006-03-21
申请号:US10403941
申请日:2003-03-31
IPC分类号: B29D11/00
CPC分类号: G11B7/22 , B29C45/0053 , B29C45/14467 , G11B7/0932
摘要: To provide a manufacturing method for an optical pickup in which a movable member carrying an objective lens is supported by a fixed member through a pair of elastic support member groups, which are each made up of a plurality of parallel elastic support members, so as to be movable in focusing and tracking directions. In a suspension unit forming step, two holding members are formed from a synthetic resin by insert molding at different positions of each elastic support member group in a lengthwise direction of the elastic support members, thereby forming a pair of suspension units. In a connecting step, the pair of suspension units are opposed with an arrangement direction of the elastic support members being substantially the same as the focusing direction, and one holding member of each suspension unit is connected to the movable member and the other holding member to the fixed member.
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