III nitride compound semiconductor element an electrode forming method
    50.
    发明授权
    III nitride compound semiconductor element an electrode forming method 有权
    III族氮化物化合物半导体元件电极形成方法

    公开(公告)号:US06806571B2

    公开(公告)日:2004-10-19

    申请号:US10239895

    申请日:2003-02-19

    IPC分类号: H01L3300

    摘要: An AlN buffer layer 2; a silicon (Si)-doped GaN high-carrier-concentration n+ layer 3; an Si-doped n-type Al0.07Ga0.93N n-cladding layer 4; an Si-doped n-type GaN n-guide layer 5; an active layer 6 having a multiple quantum well (MQW) structure, and including a Ga0.9In0.1N well layer 61 (thickness: about 2 nm) and a Ga0.97In0.03N barrier layer 62 (thickness: about 4 nm), the layers 61 and 62 being laminated alternately; an Mg-doped GaN p-guide layer 7; an Mg-doped Al0.07Ga0.93N p-cladding layer 8; and an Mg-doped GaN p-contact layer 9 are successively formed on a sapphire substrate. A p-electrode 10 is formed of a film of titanium nitride (TiN) or tantalum nitride (TaN) (thickness: 50 nm). The contact resistance of this electrode is reduced through heat treatment.

    摘要翻译: AlN缓冲层2; 硅(Si)掺杂的GaN高载流子浓度n + 3层; Si掺杂n型Al0.07Ga0.93N n包层4; Si掺杂的n型GaN n引导层5; 具有多量子阱(MQW)结构的有源层6,并且包括Ga 0.9 In 0.1 N阱层61(厚度:约2nm)和Ga 0.97 In 0.03 N势垒层62(厚度:约4nm), 层61和62交替层压; Mg掺杂的GaN p引导层7; Mg掺杂的Al0.07Ga0.93N p型包层8; 并且在蓝宝石衬底上依次形成Mg掺杂的GaN p接触层9。 p电极10由氮化钛(TiN)或氮化钽(TaN)(厚度:50nm)的膜形成。 该电极的接触电阻通过热处理而降低。