公开(公告)号：US12189280B2

公开(公告)日：2025-01-07

申请号：US17612834

申请日：2020-03-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Frank Singer

IPC: G03B21/20 ,  G02B27/01 ,  G02B27/30 ,  H01L25/075 ,  H01L27/15

Abstract: The invention relates to an illumination arrangement comprising a light-emitting optoelectronic element and an optical device for beam conversion of electromagnetic radiation generated by the light-emitting optoelectronic element. The light emitting optoelectronic element comprises a plurality of emission areas arranged in matrix form; and each emission region is associated with a main beam direction. At least a portion of the emission areas is arranged such that the centers of the emission areas lie on a curved surface.

公开(公告)号：US11264550B2

公开(公告)日：2022-03-01

申请号：US16606538

申请日：2018-04-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Rudolf Behringer ,  Alexander F. Pfeuffer ,  Andreas Plößl ,  Georg Bogner ,  Berthold Hahn ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  A41D13/01 ,  A62B17/00

Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

公开(公告)号：US11101249B2

公开(公告)日：2021-08-24

申请号：US16322069

申请日：2017-08-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Lutz Hoeppel ,  Matthias Sabathil

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58 ,  H01L33/54

Abstract: In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.

公开(公告)号：US10923640B2

公开(公告)日：2021-02-16

申请号：US15771827

申请日：2016-10-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Listl ,  Björn Hoxhold ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/54 ,  G09F9/302 ,  G09F9/33

Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

公开(公告)号：US10916686B2

公开(公告)日：2021-02-09

申请号：US15033664

申请日：2014-11-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Alexander Linkov ,  Stefan Illek ,  Wolfgang Moench

IPC: H01L33/58

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the radiation-emitting face, wherein the optical element includes a material in which light-scattering particles are embedded, and a concentration of the embedded light-scattering particles has a gradient forming an angle not equal to 90° with the radiation emission face.

公开(公告)号：US10553148B2

公开(公告)日：2020-02-04

申请号：US15775574

申请日：2016-11-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Martin ,  Thomas Schwarz ,  Frank Singer ,  Andreas Plössl

IPC: G09G3/32 ,  G06F3/14 ,  H01L25/075 ,  H01L33/62

Abstract: A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.

公开(公告)号：US10424565B2

公开(公告)日：2019-09-24

申请号：US15303436

申请日：2015-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Weimar ,  Frank Singer ,  Anna Kasprzak-Zablocka ,  Sabine vom Dorp

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/62 ,  H01L23/60 ,  H01L23/48 ,  H01L27/02 ,  H01S5/068

Abstract: A semiconductor chip, an optoelectronic device including a semiconductor chip, and a method for producing a semiconductor chip are disclosed. In an embodiment the chip includes a semiconductor body with a first main surface and a second main surface arranged opposite to the first main surface, wherein the semiconductor body includes a p-doped sub-region, which forms part of the first main surface, and an n-doped sub-region, which forms part of the second main surface and a metallic contact element that extends from the first main surface to the second main surface and that is electrically isolated from one of the sub-regions.

公开(公告)号：US20190123238A1

公开(公告)日：2019-04-25

申请号：US16090635

申请日：2017-04-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Matthias Sabathil ,  Frank Singer

IPC: H01L33/02 ,  H01L27/15 ,  H01L21/66 ,  H01L33/00 ,  H01L33/38

Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.

公开(公告)号：US10256380B2

公开(公告)日：2019-04-09

申请号：US15524413

申请日：2015-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Wolfgang Moench ,  Frank Singer ,  Thomas Schwarz ,  Jürgen Moosburger ,  Stefan Illek

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H02N1/00

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

公开(公告)号：US10253950B2

公开(公告)日：2019-04-09

申请号：US15035384

申请日：2014-11-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ion Stoll ,  Frank Singer ,  Georg Dirscherl

IPC: H01J1/62 ,  F21V9/08 ,  H01L33/50 ,  H05B33/10 ,  H05B33/14 ,  C25D13/00 ,  G02B5/02 ,  H01S5/00

Abstract: A method for producing a multifunctional layer, a method for producing an electrophoresis substrate, and a method for producing a converter plate and an optoelectronic component are disclosed. In an embodiment the method includes providing an electrophoresis substrate comprising a carrier having a front side and a back side, wherein a first electrically conductive layer and a second electrically conductive layer are located on the front side, electrophoretically depositing a first material onto the first electrically conductive layer, electrophoretically depositing a second material onto the second electrically conductive layer and arranging a filler material between the first material and the second material, wherein the filler material forms a common boundary surface with the first material and the second material.