摘要:
A micro-electromechanical optical inertial sensing device comprises a CMOS chip (3), comprising at least one integrated photodiode (6) and analog electronics; an elastically suspended proof mass (1); and a light source (4). A light beam from the light source casts a partial shadow of the proof mass over the photodiode when the proof mass is at rest. When subjected to an inertial movement, the proof mass swings causing the partial shadow to shift and modulate the illumination of the photodiode. An output current signal from the photodiode is processed by the analog electronics to generate measurement results.
摘要:
An apparatus for generating a frequency estimate of an output signal includes a reference signal generator configured to generate a reference clock signal. The apparatus includes frequency estimation circuitry configured to generate a cycle count based frequency estimation of the output signal based on the reference clock signal and a clock cycle count of the output signal. The frequency estimation circuitry further generates a fractional frequency estimation of the output signal based on the reference clock signal and a plurality of time-to-digital conversion phase samples of the output signal. The frequency estimation circuitry further generates the frequency estimate of the output signal using the cycle count based frequency estimation within a range and a frequency error determined from the fractional frequency estimation. The plurality of time-to-digital conversion phase samples and the cycle count based frequency estimation use a same number of reference clock cycles of the reference clock signal.
摘要:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
摘要:
An apparatus comprises a transmit network to transmit an input from a first amplifier to an antenna, a receive network to provide an input from an antenna to a second amplifier, a first switch to selectively decouple the transmit network from the antenna, and a second switch to selectively decouple the receive network from the antenna. Other embodiments may be described.
摘要:
An integrated CMOS power amplifier system to improve amplifier performance, the integrated CMOS power amplifier system including a plurality of differential main amplifier cores, a plurality of ground pads, and a plurality of routes to connect the plurality of differential main amplifier cores to the plurality of ground pads. Each differential main amplifier core includes a pair of collocated main amplifier core transistors. Each ground pad is connected to a subset of the differential main amplifier cores. Embodiments of the integrated CMOS power amplifier system decrease parasitic inductance to ground and increase the transconductance and amplification of the integrated CMOS power amplifier system, thus improving performance.