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    PACKAGE STRUCTURES INCLUDING DISCRETE ANTENNAS ASSEMBLED ON A DEVICE
    1.
    发明申请
    PACKAGE STRUCTURES INCLUDING DISCRETE ANTENNAS ASSEMBLED ON A DEVICE 有权
    包装结构包括在装置上组装的离散天线

    公开(公告)号：US20140176368A1

    公开(公告)日：2014-06-26

    申请号：US13721245

    申请日：2012-12-20

    申请人： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

    发明人： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

    IPC分类号： H01Q1/38 ,  H01P11/00

    CPC分类号： H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

    摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

    摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

    INTEGRATED INDUCTOR FOR INTEGRATED CIRCUIT DEVICES
    5.
    发明申请
    INTEGRATED INDUCTOR FOR INTEGRATED CIRCUIT DEVICES 有权
    集成电路集成电路

    公开(公告)号：US20140027880A1

    公开(公告)日：2014-01-30

    申请号：US13976439

    申请日：2011-12-29

    申请人： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

    发明人： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

    IPC分类号： H01L49/02

    CPC分类号： H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

    摘要： A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

    摘要翻译： 使用导电贯穿体通孔在集成电路管芯中形成三维电感器，该穿通体通孔穿过管芯的主体并与管芯前侧上的一个或多个金属互连层接触并终止在管芯的背面 死。 在另一个实施例中，通孔通孔可以穿过设置在管芯主体中的插塞中的电介质材料。 另一方面，变压器可以通过耦合使用通孔通孔形成的多个电感器来形成。 在另一方面，三维电感器可以包括由片上金属化层的堆叠形成的导体和设置在金属化层之间的绝缘层中的导电贯通层通孔。 描述其他实施例。