MOS transistor having combined-source structure with low power consumption and method for fabricating the same
    41.
    发明授权
    MOS transistor having combined-source structure with low power consumption and method for fabricating the same 有权
    具有低功耗的组合源结构的MOS晶体管及其制造方法

    公开(公告)号:US08710557B2

    公开(公告)日:2014-04-29

    申请号:US13501241

    申请日:2011-10-14

    IPC分类号: H01L29/76

    CPC分类号: H01L29/7839

    摘要: The present invention discloses a MOS transistor having a combined-source structure with low power consumption, which relates to a field of field effect transistor logic devices and circuits in CMOS ultra-large-scaled integrated circuits. The MOS transistor includes a control gate electrode layer, a gate dielectric layer, a semiconductor substrate, a Schottky source region, a highly-doped source region and a highly-doped drain region. An end of the control gate extends to the highly-doped source region to form a T shape, wherein the extending region of the control gate is an extending gate and the remaining region of the control gate is a main gate. The active region covered by the extending gate is a channel region, and material thereof is the substrate material. A Schottky junction is formed between the Schottky source region and the channel under the extending gate. The combined-source structure according to the invention combines a Schottky barrier and a T-shaped gate, improves the performance of the device, and the fabrication method thereof is simple. Thus, a higher turn-on current, a lower leakage current, and a steeper subthreshold slope can be obtained, and the present application can be applied in the field of low power consumption and have a higher practical value.

    摘要翻译: 本发明公开了一种具有低功耗的组合源结构的MOS晶体管,其涉及CMOS超大规模集成电路中的场效应晶体管逻辑器件和电路领域。 MOS晶体管包括控制栅极电极层,栅极电介质层,半导体衬底,肖特基源区,高掺杂源极区和高掺杂漏极区。 控制栅极的一端延伸到高掺杂源极区域以形成T形,其中控制栅极的延伸区域是延伸栅极,控制栅极的其余区域是主栅极。 由延伸栅极覆盖的有源区是沟道区,其材料是衬底材料。 在肖特基源区域和延伸栅极下方的通道之间形成肖特基结。 根据本发明的组合源结构组合了肖特基势垒和T形门,提高了器件的性能,其制造方法简单。 因此,可以获得更高的导通电流,较低的漏电流和更陡的亚阈值斜率,并且本申请可以应用于低功耗领域并具有较高的实用价值。

    Method for Inhibiting Programming Disturbance of Flash Memory
    42.
    发明申请
    Method for Inhibiting Programming Disturbance of Flash Memory 审中-公开
    禁止闪存编程故障的方法

    公开(公告)号:US20140017870A1

    公开(公告)日:2014-01-16

    申请号:US13510618

    申请日:2011-10-28

    申请人: Yimao Cai Ru Huang

    发明人: Yimao Cai Ru Huang

    IPC分类号: H01L21/265

    摘要: Disclosed herein is a method for inhibiting a programming disturbance of a flash memory, which relates to a technical field of a non-volatile memory in ultra-large-scale integrated circuit fabrication technologies. In the present invention, an dopant gradient of a PN junction between a substrate and a drain is reduced by adding a step of performing an angled ion implantation of donor dopants into a standard process for a flash memory, so that an electric field of the PN junction between the substrate and the drain is reduced, and consequently the programming disturbance is inhibited. Meanwhile, a dopant gradient of the PN junction between a channel and the drain is maintained, so that an electric field of the PN junction between the channel and the drain, which is necessary for programming, is maintained, and thus the programming efficiency and the programming speed can be ensured. The programming disturbance can be effectively inhibited without increasing numbers of masks used for photolithography according to the invention, thus the present invention is significantly advantageous to the improvement of the flash memory reliability.

    摘要翻译: 本文公开了一种用于抑制闪存的编程干扰的方法,其涉及超大规模集成电路制造技术中的非易失性存储器的技术领域。 在本发明中,通过添加将供体掺杂剂成角度离子注入到闪速存储器的标准工艺中的步骤来减小衬底和漏极之间的PN结的掺杂剂梯度,使得PN的电场 衬底和漏极之间的接合被减小,因此编程干扰被抑制。 同时,保持沟道和漏极之间的PN结的掺杂剂梯度,从而保持编程所需的沟道和漏极之间的PN结的电场,从而编程效率和 可以确保编程速度。 在不增加根据本发明的用于光刻的掩模数量的情况下,可以有效地抑制编程干扰,因此本发明对于提高闪速存储器可靠性是显着有利的。

    METHOD FOR FABRICATING RESISTIVE MEMORY DEVICE
    43.
    发明申请
    METHOD FOR FABRICATING RESISTIVE MEMORY DEVICE 审中-公开
    用于制造电阻式存储器件的方法

    公开(公告)号:US20130217199A1

    公开(公告)日:2013-08-22

    申请号:US13580952

    申请日:2012-04-16

    IPC分类号: H01L21/02

    摘要: The present invention discloses a method for fabricating a resistive memory, including: fabricating a bottom electrode over a substrate; partially oxidizing a metal of the bottom electrode through dry-oxygen oxidation or wet-oxygen oxidation to form a metal oxide with a thickness of 3 nm to 50 nm as a resistive material layer; finally fabricating a top electrode over the resistive material layer. The present invention omits a step of depositing a resistive material layer in a conventional method, so as to greatly reduce the process complexity. Meanwhile, a self alignment between the resistive material layer and the bottom electrode can be realized. A full isolation between devices may be ensured so as to obviate the parasite effects occurred in the conventional process methods. Meanwhile, the actual area and designed area of the device are ensured to be consistent.

    摘要翻译: 本发明公开了一种制造电阻式存储器的方法,包括:在衬底上制造底电极; 通过干氧氧化或湿氧氧化部分氧化底部电极的金属,形成厚度为3nm至50nm的金属氧化物作为电阻材料层; 最后在电阻材料层上制造顶部电极。 本发明省略了以常规方法沉积电阻材料层的步骤,从而大大降低了工艺的复杂性。 同时,可以实现电阻材料层和底部电极之间的自对准。 可以确保器件之间的完全隔离,以便消除常规工艺方法中发生的寄生效应。 同时,确保设备的实际面积和设计面积一致。

    Fabrication method for surrounding gate silicon nanowire transistor with air as spacers
    44.
    发明授权
    Fabrication method for surrounding gate silicon nanowire transistor with air as spacers 有权
    围绕栅极硅纳米线晶体管的制造方法,其中空气为间隔物

    公开(公告)号:US08513067B2

    公开(公告)日:2013-08-20

    申请号:US13266791

    申请日:2011-07-15

    IPC分类号: H01L21/84

    摘要: The invention discloses a fabrication method for a surrounding gate silicon nanowire transistor with air as spacers. The method comprises: performing isolation, and depositing a material A which has a higher etch selectivity ratio with respect to Si; performing photolithography to define a Fin hard mask; etching the material A to form the Fin hard mask; performing source and drain implantation; performing photolithography to define a channel region and large source/drain regions; forming the Si Fin and the large source/drains; removing the hard mask of the material A; forming a nanowire; etching the SiO2 to form a floating nanowire; forming a gate oxide layer; depositing a polysilicon; performing polysilicon injection; performing annealing to activate dopants; etching the polysilicon; depositing SiN; performing photolithography to define a gate pattern; etching the SiN and the polysilicon to form the gate pattern; separating the gate and the source/drain with a space in between filled with air; depositing SiO2 to form air sidewalls; performing annealing to densify the SiO2 layer; using subsequent processes to complete the device fabrication. The invention is compatible with the CMOS process flow. The introduction of the air sidewalls can effectively reduce the parasitic capacitance of the device, and improve the transient response of the device, so that the method is applicable for a logic circuit with high performance.

    摘要翻译: 本发明公开了一种具有空气作为间隔物的周围栅极硅纳米线晶体管的制造方法。 该方法包括:执行隔离和沉积相对于Si具有较高蚀刻选择比的材料A; 执行光刻以限定Fin硬掩模; 蚀刻材料A以形成Fin硬掩模; 进行源极和漏极植入; 执行光刻以限定沟道区和大的源极/漏极区; 形成Si Fin和大源/排水; 去除材料A的硬掩模; 形成纳米线; 蚀刻SiO 2以形成浮动的纳米线; 形成栅氧化层; 沉积多晶硅; 执行多晶硅注入; 执行退火以激活掺杂剂; 蚀刻多晶硅; 沉积SiN; 执行光刻以限定栅极图案; 蚀刻SiN和多晶硅以形成栅极图案; 分离门和源/排水管之间的空间填充空气之间; 沉积SiO 2以形成空气侧壁; 进行退火以使SiO 2层致密化; 使用后续过程来完成器件制造。 本发明与CMOS工艺流程兼容。 空气侧壁的引入可以有效降低器件的寄生电容,提高器件的瞬态响应,使其适用于具有高性能的逻辑电路。

    Combined-source MOS transistor with comb-shaped gate, and method for manufacturing the same
    45.
    发明授权
    Combined-source MOS transistor with comb-shaped gate, and method for manufacturing the same 有权
    具有梳形门的组合源MOS晶体管及其制造方法

    公开(公告)号:US08507959B2

    公开(公告)日:2013-08-13

    申请号:US13318333

    申请日:2011-04-01

    摘要: The present invention discloses a combined-source MOS transistor with a Schottky Barrier and a comb-shaped gate structure, and a method for manufacturing the same. The combined-source MOS transistor includes: a control gate electrode layer, a gate dielectric layer, a semiconductor substrate, a highly-doped source region and a highly-doped drain region, wherein a Schottky source region is connected to a side of the highly-doped source region which is far from a channel, one end of the control gate extends to the highly-doped source region, the extended gate region is an extension gate in a form of a comb-shaped and the original control gate region is a main gate; an active region covered by the extension gate is also a channel region, and is a substrate material; the highly-doped source region which is formed by highly doping is located on both sides of each comb finger of the extension gate; and a Schottky junction is formed at a location where the Schottky source region and the channel under the extension gate are located. As compared with an existing MOSFET, in the invention, a higher turn-on current, a lower leakage current and a steeper subthreshold slope may be obtained under the same process condition and the same active region size.

    摘要翻译: 本发明公开了一种具有肖特基势垒和梳状栅极结构的组合源MOS晶体管及其制造方法。 组合源MOS晶体管包括:控制栅极电极层,栅极电介质层,半导体衬底,高掺杂源极区域和高掺杂漏极区域,其中肖特基源极区域连接到高度 远离通道的掺杂源极区域,控制栅极的一端延伸到高掺杂源极区域,延伸栅极区域是梳状形式的延伸栅极,并且原始控制栅极区域是 大门; 由延伸栅极覆盖的有源区域也是沟道区域,并且是衬底材料; 通过高掺杂形成的高掺杂源区位于延伸门的每个梳齿的两侧; 并且在肖特基源区域和延伸门下方的沟道所在的位置处形成肖特基结。 与现有的MOSFET相比,在本发明中,在相同的工艺条件和相同的有源区域尺寸下可以获得较高的导通电流,较低的漏电流和更陡的亚阈值斜率。

    Floating Gate Structure of Flash Memory Device and Method for Fabricating the Same
    46.
    发明申请
    Floating Gate Structure of Flash Memory Device and Method for Fabricating the Same 有权
    闪存设备的浮动门结构及其制造方法

    公开(公告)号:US20130099300A1

    公开(公告)日:2013-04-25

    申请号:US13498585

    申请日:2011-11-30

    IPC分类号: H01L29/788 H01L21/283

    CPC分类号: H01L21/28273

    摘要: The present invention discloses a floating gate structure of a flash memory device and a method for fabricating the same, which relates to a nonvolatile memory in a manufacturing technology of an ultra-large-scaled integrated circuit. In the invention, by modifying a manufacturing of a floating gate in the a standard process for the flash memory, that is, by adding three steps of deposition, two steps of etching and one step of CMP, an I-shaped floating gate is formed. In addition to these steps, all the other steps are the same as those of the standard process for the flash memory process. By the invention, a coupling ratio may be improved effectively and a crosstalk between adjacent devices may be lowered, without adding additional photomasks and barely increasing a process complexity, which are very important to improve programming speed and reliability.

    摘要翻译: 本发明公开了一种闪存器件的浮动栅极结构及其制造方法,涉及超大规模集成电路的制造技术中的非易失性存储器。 在本发明中,通过在闪速存储器的标准处理中,即通过添加三个步骤的沉积,两个步骤的蚀刻和CMP的一个步骤来修改浮动栅极的制造,形成I形的浮动栅极 。 除了这些步骤之外,所有其他步骤与闪存过程的标准过程相同。 通过本发明,可以有效地改善耦合比,并且可以降低相邻器件之间的串扰,而不增加额外的光掩模,并且几乎不增加工艺复杂性,这对于提高编程速度和可靠性非常重要。

    PROGRAMMABLE ARRAY OF SILICON NANOWIRE FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    47.
    发明申请
    PROGRAMMABLE ARRAY OF SILICON NANOWIRE FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME 有权
    硅纳米管场效应晶体管的可编程阵列及其制造方法

    公开(公告)号:US20130075701A1

    公开(公告)日:2013-03-28

    申请号:US13503240

    申请日:2011-11-18

    IPC分类号: H01L29/66

    摘要: The present invention discloses a hexagonal programmable array based on a silicon nanowire field effect transistor and a method for fabricating the same. The array includes a nanowire device, a nanowire device connection region and a gate connection region, wherein, the nanowire device has a cylinder shape, and includes a silicon nanowire channel, a gate dielectric layer, and a gate region, the nanowire channel being surrounded by the gate dielectric layer, and the gate dielectric layer being surrounded by the gate region; the nanowire devices are arranged in a hexagon shape to form programming unit, the nanowire device connection region is a connection node of three nanowire devices and secured to a silicon supporter. The present invention can achieve a complex control logic of interconnections and is suitable for a digital/analog and a mixed-signal circuit having a high integration degree and a high speed.

    摘要翻译: 本发明公开了一种基于硅纳米线场效应晶体管的六边形可编程阵列及其制造方法。 阵列包括纳米线器件,纳米线器件连接区域和栅极连接区域,其中纳米线器件具有圆筒形状,并且包括硅纳米线通道,栅极介电层和栅极区域,纳米线通道被包围 通过所述栅极介电层,并且所述栅极介电层被所述栅极区域包围; 纳米线器件以六边形形式布置以形成编程单元,纳米线器件连接区域是三个纳米线器件的连接节点并且固定到硅支撑体。 本发明可以实现互连的复杂控制逻辑,并且适用于具有高集成度和高​​速度的数字/模拟和混合信号电路。

    FLASH MEMORY AND METHOD FOR FABRICATING THE SAME
    48.
    发明申请
    FLASH MEMORY AND METHOD FOR FABRICATING THE SAME 审中-公开
    闪存及其制造方法

    公开(公告)号:US20120261740A1

    公开(公告)日:2012-10-18

    申请号:US13389720

    申请日:2011-10-14

    IPC分类号: H01L29/788 H01L21/336

    摘要: The present invention discloses a flash memory and a method for fabricating the same, and relates to the technical field of the semiconductor memory. The flash memory includes a buried oxygen layer on which a source terminal, a channel, and a drain terminal are disposed, wherein the channel is between the source terminal and the drain terminal, and a tunneling oxide layer, a polysilicon floating gate, a blocking oxide layer, and a polysilicon control gate are sequentially disposed on the channel, and a thin silicon nitride layer is disposed between the source terminal and the channel. The method includes: 1) performing a shallow trench isolation on a SOI silicon substrate to form an active region; 2) sequentially forming a tunneling oxide layer and a first polysilicon layer on the SOI silicon substrate to form a polysilicon floating gate, and forming a blocking oxide layer and a second polysilicon layer to form a polysilicon control gate; 3) etching the resultant structure to form a gate stack structure; 4) forming a drain terminal at one side of the gate stack structure, etching the silicon film at the other side of the gate stack structure, growing a thin silicon nitride layer, and then refilling the hole structure with silicon material, to form a source terminal. The method has the advantages of high programming efficiency, low power consumption, effectively preventing source-drain punchthrough effect.

    摘要翻译: 本发明公开了一种闪速存储器及其制造方法,涉及半导体存储器的技术领域。 闪速存储器包括掩埋氧层,其上设置有源极端子,沟道和漏极端子,其中沟道位于源极端子和漏极端子之间,以及隧道氧化物层,多晶硅浮动栅极,阻塞层 氧化物层和多晶硅控制栅极依次设置在沟道上,并且在源极端子和沟道之间设置有薄的氮化硅层。 该方法包括:1)在SOI硅衬底上进行浅沟槽隔离以形成有源区; 2)在SOI硅衬底上依次形成隧道氧化物层和第一多晶硅层,以形成多晶硅浮栅,并形成阻挡氧化层和第二多晶硅层以形成多晶硅控制栅极; 3)蚀刻所得结构以形成栅叠层结构; 4)在栅极堆叠结构的一侧形成漏极端子,蚀刻栅极叠层结构的另一侧的硅膜,生长薄的氮化硅层,然后用硅材料再填充孔结构,以形成源极 终奌站。 该方法具有编程效率高,功耗低,有效防止源极漏极穿通效应的优点。

    LOW-POWER CONSUMPTION TUNNELING FIELD-EFFECT TRANSISTOR WITH FINGER-SHAPED GATE STRUCTURE
    49.
    发明申请
    LOW-POWER CONSUMPTION TUNNELING FIELD-EFFECT TRANSISTOR WITH FINGER-SHAPED GATE STRUCTURE 审中-公开
    具有手指形状结构的低功耗消耗隧道场效应晶体管

    公开(公告)号:US20120223361A1

    公开(公告)日:2012-09-06

    申请号:US13378920

    申请日:2011-05-19

    IPC分类号: H01L29/78

    摘要: The present invention discloses a low-power consumption tunnelling field-effect transistor (TFET). The TFET according to the invention includes a source, a drain and a control gate, wherein the control gate extends towards the source to form a finger-type control gate, which includes an extended gate region and an original control gate region, and an active region covered by the extended gate region is also an channel region and is made of the substrate material. The invention employs a finger-shaped gate structure, and the source region of the TFET surrounds the channel so that the on-state current of the device is improved. In comparison with the conventional planar TFET, a higher on-state current and a steeper subthreshold slope may be obtained under the same process conditions and with the same active region size.

    摘要翻译: 本发明公开了一种低功耗隧道场效应晶体管(TFET)。 根据本发明的TFET包括源极,漏极和控制栅极,其中控制栅极朝向源极延伸以形成指状型控制栅极,其包括扩展栅极区域和原始控制栅极区域,以及主动 由扩展栅极区域覆盖的区域也是沟道区域并且由衬底材料制成。 本发明采用指形栅极结构,并且TFET的源极区域围绕沟道,使得器件的导通电流得以改善。 与传统的平面TFET相比,可以在相同的工艺条件和相同的有源区域尺寸下获得更高的导通电流和更陡的亚阈值斜率。