Abstract:
Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.
Abstract:
The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself.
Abstract:
The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer disposed on the lower magnetic body and including at least one conductor pattern; input and output stud terminals electrically connected to the conductor pattern for electrical input and output of the conductor pattern; and an upper magnetic body consisting of an inner upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer surface of the lower magnetic body.According to the present invention, it is possible to implement a coil part with high performance and characteristics by increasing permeability and improving impedance characteristics through simple structure and process.
Abstract:
The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same.According to the present invention, it is possible to improve productivity of coil parts and reduce manufacturing costs by simplifying manufacturing processes of a conductor line and a via and implement a fine line width of the conductor line.
Abstract:
A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
Abstract:
A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.
Abstract:
An antenna device includes: an antenna wiring including a spiral wiring having a ring shape, wherein the spiral wiring includes a linear part formed as a straight line or a curved line, and a bent part formed as a meandering line.
Abstract:
An electrostatic discharge protection device includes a base, a plurality of electrodes arranged on the base separated from each other, a function layer supplied on a separation space between the electrodes and a composite insulating layer disposed on the base and composed of inorganic particles dispersed in a resin, the composite insulating layer covering the electrodes and the function layer.
Abstract:
Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.
Abstract:
The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.