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    SUBSTRATE PROCESSING
    41.
    发明申请
    SUBSTRATE PROCESSING 有权

    公开(公告)号：US20250046635A1

    公开(公告)日：2025-02-06

    申请号：US18666563

    申请日：2024-05-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangchul Han ,  Yihwan Kim ,  Youngbok Lee ,  Junho Lee ,  SeokJun Hong

    IPC: H01L21/67 ,  H01J37/32 ,  H01L21/687

    Abstract: A method of processing a substrate includes locating a substrate in a substrate processing apparatus, fixing the substrate in the substrate processing apparatus, processing the substrate, and checking a fixed state of the substrate. The substrate processing apparatus includes a process chamber, a stage supporting the substrate, a plasma induction electrode used to generate plasma and located in the stage, a first power source configured to supply RF power to the plasma induction electrode, a heater located in the stage and used to heat the stage, a second power source configured to supply AC power to the heater, and a monitoring unit electrically connected to the plasma induction electrode. The checking of the fixed state of the substrate includes measuring AC-2 power of the AC power, which is transferred to the monitoring unit through the heater and the plasma induction electrode.

    SEMICONDUCTOR PACKAGE
    42.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240258224A1

    公开(公告)日：2024-08-01

    申请号：US18421440

    申请日：2024-01-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seungryong Oh ,  Seunghoon Yeon ,  Junho Lee

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

    CPC classification number: H01L23/49827 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49838 ,  H01L24/08 ,  H01L25/0657 ,  H01L2224/08146 ,  H01L2225/06541

    Abstract: A semiconductor package includes a package-bottom redistribution structure at a lower side of a package and including a conductive line, an upper semiconductor chip at an upper side of the package, an upper back end of line (BEOL) layer, at a lower side of the upper semiconductor chip, and including a conductive line, a lower semiconductor chip below the upper semiconductor chip, where a horizontal width of the lower semiconductor chip is less than a horizontal width of the upper semiconductor chip, and where the upper semiconductor chip overlaps at least a portion of the lower semiconductor chip, a lower BEOL layer at a lower side of the lower semiconductor chip and including a conductive line, a passivation layer on an upper surface of the lower semiconductor chip, and a through silicon via (TSV) structure penetrating the passivation layer and the lower semiconductor chip.

    METHOD AND DEVICE FOR PREVENTING FALSE PMI REPORT IN WIRELESS COMMUNICATION SYSTEM
    44.
    发明公开
    METHOD AND DEVICE FOR PREVENTING FALSE PMI REPORT IN WIRELESS COMMUNICATION SYSTEM 审中-公开

    公开(公告)号：US20230300646A1

    公开(公告)日：2023-09-21

    申请号：US18186580

    申请日：2023-03-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinwoo Oh ,  Hongsik Yoon ,  Junho Lee

    IPC: H04W24/08 ,  H04B7/06

    CPC classification number: H04W24/08 ,  H04B7/0632 ,  H04B7/0639

    Abstract: A wireless communication device includes a communication circuit configured to receive a channel state information reference signal (CSI-RS), a processor, which includes an angle of departure (AoD) monitoring circuit configured to extract AoD values corresponding to the received CSI-RS and an interference cancellation circuit configured to cancel second AoD values corresponding to an interfering cell adjacent to a serving cell other than first AoD values corresponding to the serving cell among the AoD values, and a memory storing the first AoD values corresponding to the serving cell and antenna array information of the serving cell.

    Electronic device and method of providing notification by electronic device
    49.
    发明授权
    Electronic device and method of providing notification by electronic device 有权

    公开(公告)号：US10187872B2

    公开(公告)日：2019-01-22

    申请号：US16002178

    申请日：2018-06-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Eunbi Cho ,  Hyunjung Park ,  Junho Lee ,  Jihwa Park ,  Daehyung Jo ,  Dongjin Choi

    IPC: H04W68/02 ,  H04M1/725

    Abstract: A method and electronic device are disclosed herein. The electronic device includes a display and at least one processor. The at least one processor is configured to implement the method, including receiving a first notification for a first application, generating, by at least one processor, a first notification page including at least a part of the first notification, generating an abstract page including a first object related to the first notification and displaying the abstract page on a display, and switching from displaying the abstract page to displaying the first notification page in response to detecting an input signal selecting the first object, wherein the abstract page and the first notification page are generated and displayed based on a same application or home application.

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