Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device
    43.
    发明授权
    Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device 有权
    接合基板的方法,密封结构的制造方法以及发光装置的制造方法

    公开(公告)号:US09362522B2

    公开(公告)日:2016-06-07

    申请号:US14059660

    申请日:2013-10-22

    CPC classification number: H01L51/5246 C03C8/24

    Abstract: An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween.

    Abstract translation: 目的在于提高使用玻璃料的基板的接合技术中与激光照射工序相关的生产率。 提供了一种高密度密封结构或可高效生产的高密度发光装置。 当通过用玻璃料烧结玻璃料熔融玻璃料或烧结体的玻璃层用激光照射时,为了提高效率,将光吸收材料附着在玻璃层的表面上。 在光吸收材料和玻璃层上进行激光照射。 基板之间固定有玻璃层。

    Touch panel and method for manufacturing touch panel

    公开(公告)号:US12229358B2

    公开(公告)日:2025-02-18

    申请号:US18648823

    申请日:2024-04-29

    Abstract: A touch panel capable of performing display and sensing along a curved surface or a touch panel that maintains high detection sensitivity even when it is curved along a curved surface is provided. A flexible display panel is placed along a curved portion included in a surface of a support. A first film layer is attached along a surface of the display panel by a bonding layer. Second to n-th film layers (n is an integer of 2 or more) are sequentially attached along a surface of the first film layer by bonding layers. A flexible touch sensor is attached along a surface of the n-th film layer by a bonding layer.

    Display device and manufacturing method thereof

    公开(公告)号:US12219867B2

    公开(公告)日:2025-02-04

    申请号:US18388899

    申请日:2023-11-13

    Abstract: When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an environmental change such as temperature due to difference in linear expansion coefficient before and after a thermal shock. A buffer plate that is thin enough to be bent is provided between the base film used in a flexible display panel and the resin member. With the use of heat dissipation effect and heat equalization effect of the buffer plate, a structure around the panel capable of resisting the environmental change can be provided.

    Semiconductor device with second electrode provided below top surface of first electrode

    公开(公告)号:US11997904B2

    公开(公告)日:2024-05-28

    申请号:US17587048

    申请日:2022-01-28

    CPC classification number: H10K59/1315 H10K50/844 H10K59/124

    Abstract: A display panel or a display device with high display quality is provided. The display panel includes a light-emitting element, an insulating layer, a protective layer, and a conductive layer. The light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. The light-emitting element emits light to the protective layer side. The insulating layer includes a first opening overlapping with the first electrode. The insulating layer covers an end portion of the first electrode. The light-emitting layer overlaps with the first electrode through the first opening. The second electrode is positioned over the light-emitting layer. The protective layer is over and in contact with the second electrode. The protective layer functions as a protective layer of the light-emitting element. The protective layer includes a second opening overlapping with the insulating layer. The conductive layer is connected to the second electrode through the second opening. The conductive layer functions as an auxiliary wiring of the second electrode.

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