摘要:
Multi-gate devices and methods of their fabrication are disclosed. A multi-gate device can include a gate structure and a plurality of fins. The gate structure envelops a plurality of surfaces of the fins, which are directly on a substrate that is composed of a semiconducting material. Each of the fins provides a channel between a respective source and a respective drain, is composed of the semiconducting material and is doped. A first fin of the plurality of fins has a first height that is different from a second height of a second fin of the plurality of fins such that drive currents of the first and second fins are different. Further, the first and second fins form a respective cohesive structure of the semiconducting material with the substrate. In addition, surfaces of the substrate that border the fins are disposed at a same vertical position.
摘要:
A method of forming a semiconductor structure includes forming a stress inducing layer over one or more partially completed field effect transistor (FET) devices disposed over a substrate, the one or more partially completed FET devices including sacrificial dummy gate structures; planarizing the stress inducing layer and removing the sacrificial dummy gate structures; and following the planarizing the stress inducing layer and removing the sacrificial dummy gate structures, performing an ultraviolet (UV) cure of the stress inducing layer so as to enhance a value of an initial applied stress by the stress inducing layer on channel regions of the one or more partially completed FET devices.
摘要:
A field effect transistor device includes a substrate including a source region, a drain region, and a channel region disposed between the source region and the drain region, wherein the source region is connected to the channel region with a source extension portion, and the drain region is connected to the channel region with a drain extension portion, wherein the channel region includes a source transition portion including n-type and p-type ions and a drain transition portion including n-type and p-type ions, and a gate stack portion disposed on the channel region.
摘要:
A field effect transistor device includes a substrate including a source region, a drain region, and a channel region disposed between the source region and the drain region, wherein the source region is connected to the channel region with a source extension portion, and the drain region is connected to the channel region with a drain extension portion, a first spacer portion disposed on the source region, the drain region and a first portion of the source extension portion, and a first portion of the drain extension portion, a second spacer portion disposed on a second portion of the source extension portion, and a second portion of the drain extension portion, a gate stack portion disposed on the channel region.
摘要:
A method of forming fin field effect transistor (finFET) devices includes forming a plurality of semiconductor fins over a buried oxide (BOX) layer; performing a nitrogen implant so as to formed nitrided regions in a upper portion of the BOX layer corresponding to regions between the plurality of semiconductor fins; forming a gate dielectric layer over the semiconductor fins and the nitrided regions of the upper portion of the BOX layer; and forming one or more gate electrode materials over the gate dielectric layer; wherein the presence of the nitrided regions of upper portion of the BOX layer prevents oxygen absorption into the gate dielectric layer as a result of thermal processing.