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公开(公告)号：US09614584B2
公开(公告)日：2017-04-04
申请号：US14846672
申请日：2015-09-04
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Benjamin Stassen Cook
Abstract: A device is configured for transmitting multiple channels of information through a dielectric waveguide (DWG). The device generates at least a first radio frequency signal (RF) and a second RF signal. The first RF signal is launched into the DWG using a launching structure formed within a multilayer substrate to excite a first transmission mode of the DWG. The second RF signal is launched into the DWG using a launching structure formed within the multilayer substrate to excite a second transmission mode of the DWG, in which the second transmission mode is orthogonal to the first transmission mode.
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公开(公告)号：US20170093009A1
公开(公告)日：2017-03-30
申请号：US14865552
申请日：2015-09-25
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Robert Floyd Payne
CPC classification number: H01P5/087 , H01P1/042 , H01P3/026 , H01P3/16 , H01Q1/2283 , H01Q13/085 , H01R24/64
Abstract: A dielectric waveguide socket is provided with a dielectric waveguide (DWG) stub having a dielectric core member surrounded by dielectric cladding, the DWG stub having an interface end and an opposite mating end. A socket body is coupled to the DWG stub, such that a mounting surface of the socket body is configured to mount the socket body on a substrate such that the core member of DWG stub forms an angle of inclination with the substrate. The socket body is configured to couple with the end of a DWG cable, such that the end of the DWG cable is held in alignment with the mating end of the DWG stub.
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43.发明申请Simultaneous Launching of Multiple Signal Channels in a Dielectric Waveguide Using Different Electromagnetic Modes 有权使用不同的电磁模式在介质波导中同时启动多个信号通道公开(公告)号：US20160344448A1
公开(公告)日：2016-11-24
申请号：US14846672
申请日：2015-09-04
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Benjamin Stassen Cook
Abstract: A device is configured for transmitting multiple channels of information through a dielectric waveguide (DWG). The device generates at least a first radio frequency signal (RF) and a second RF signal. The first RF signal is launched into the DWG using a launching structure formed within a multilayer substrate to excite a first transmission mode of the DWG. The second RF signal is launched into the DWG using a launching structure formed within the multilayer substrate to excite a second transmission mode of the DWG, in which the second transmission mode is orthogonal to the first transmission mode.
Abstract translation: 一种器件被配置为通过介质波导（DWG）发送多个信道信道。 该设备至少产生第一射频信号（RF）和第二RF信号。 第一RF信号使用形成在多层基板内的发射结构发射到DWG中，以激发DWG的第一传输模式。 第二RF信号使用形成在多层基板内的发射结构发射到DWG中，以激发DWG的第二传输模式，其中第二传输模式与第一传输模式正交。
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44.发明授权Interface between an integrated circuit and a dielectric waveguide using a carrier substrate with a dipole antenna and a reflector 有权使用具有偶极天线和反射器的载体衬底的集成电路和介质波导之间的接口公开(公告)号：US09300025B2
公开(公告)日：2016-03-29
申请号：US13854958
申请日：2013-04-02
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
IPC: H01P5/107 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
Abstract translation: 一种系统包括具有顶表面和底表面的基底的集成电路。 半导体电路包括被配置为产生RF信号的射频（RF）放大器或被配置为接收RF信号的RF接收器，该RF接收器被形成在衬底的顶表面上。 穿通基板通孔耦合到RF放大器的输出端。 形成在基板的底表面上的金属化天线与穿通基板通孔相连。 当DWG耦合到衬底的底侧时，金属化天线被配置为将代表RF信号的电磁波发射到电介质波导（DWG）中。
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45.发明授权Interface between an integrated circuit and a dielectric waveguide using a dipole antenna, a reflector and a plurality of director elements 有权使用偶极子天线，反射器和多个导向器元件的集成电路和电介质波导之间的接口公开(公告)号：US09300024B2
公开(公告)日：2016-03-29
申请号：US13854957
申请日：2013-04-02
Applicant: Texas Instruments Incorporated
Inventor： Gerd Schuppener , Juan Alejandro Herbsommer , Robert Floyd Payne
IPC: H01P5/107 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A system includes an electronic device coupled to a mating end of a dielectric wave guide (DWG). The electronic device has a multilayer substrate that has an interface surface configured for interfacing to the mating end of the DWG. A conductive layer is etched to form a dipole antenna disposed adjacent the interface surface. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface. A set of director elements is embedded in the mating end of the DWG. Specific spacing is maintained between the dipole antenna and the set of director elements.
Abstract translation: 一种系统包括耦合到电介质波导（DWG）的配合端的电子装置。 电子设备具有多层基板，该多层基板具有被配置为与DWG的配合端对接的界面。 蚀刻导电层以形成邻近界面表面设置的偶极天线。 反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。 一组指导元素嵌入在DWG的配对端。 在偶极天线和导向器元件组之间保持特定的间隔。
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Patent Agency Ranking
公开(公告)号：US20150295307A1
公开(公告)日：2015-10-15
申请号：US14521443
申请日：2014-10-22
Applicant: Texas Instruments Incorporated
Inventor： Benjamin S. Cook , Juan Alejandro Herbsommer
Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and may have a cladding surrounding the dielectric core member. A radiated radio frequency (RF) signal may be received on a first portion of a radiating structure embedded in the end of a dielectric waveguide (DWG). Simultaneously, a derivative RF signal may be launched into the DWG from a second portion of the radiating structure embedded in the DWG.
Abstract translation: 数字系统具有介电芯波导，其具有纵向介质芯构件。 芯构件具有主体部分并且可以具有围绕介电芯构件的包层。 辐射射频（RF）信号可以在嵌入在介质波导（DWG）的端部中的辐射结构的第一部分上被接收。 同时，衍生RF信号可以从嵌入在DWG中的辐射结构的第二部分发射到DWG中。
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公开(公告)号：US09112253B2
公开(公告)日：2015-08-18
申请号：US13854956
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Robert Floyd Payne , Juan Alejandro Herbsommer , Gerd Schuppener
IPC: H01P11/00 , H01P3/16 , H01P5/08 , G02B6/44 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12 , H01P5/107
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A communication cable includes one or more conductive elements surrounded by a dielectric sheath. The sheath member has a first dielectric constant value. A dielectric core member is placed longitudinally adjacent to and in contact with an outer surface of the sheath member. The core member has a second dielectric constant value that is higher than the first dielectric constant value. A cladding surrounds the sheath member and the dielectric core member. The cladding has a third dielectric constant value that is lower than the second dielectric constant value. A dielectric wave guide is formed by the dielectric core member surrounded by the sheath and the cladding.
Abstract translation: 通信电缆包括由电介质护套包围的一个或多个导电元件。 护套构件具有第一介电常数值。 电介质芯构件被纵向地邻近鞘构件的外表面并与其接触。 芯构件具有比第一介电常数值高的第二介电常数值。 包层围绕护套构件和电介质芯构件。 包层具有低于第二介电常数值的第三介电常数值。 电介质波导由被护套和包层包围的介质芯构件形成。
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公开(公告)号：US20140287703A1
公开(公告)日：2014-09-25
申请号：US13854958
申请日：2013-04-02
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
Abstract translation: 一种系统包括具有顶表面和底表面的基底的集成电路。 半导体电路包括被配置为产生RF信号的射频（RF）放大器或被配置为接收RF信号的RF接收器，该RF接收器被形成在衬底的顶表面上。 穿通基板通孔耦合到RF放大器的输出端。 形成在基板的底表面上的金属化天线与穿通基板通孔相连。 当DWG耦合到衬底的底侧时，金属化天线被配置为将代表RF信号的电磁波发射到电介质波导（DWG）中。
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公开(公告)号：US20140285292A1
公开(公告)日：2014-09-25
申请号：US13854951
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
CPC classification number: H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
Abstract: A dielectric wave guide (DWG) has a longitudinal dielectric core member. The core member has a first dielectric constant value. A cladding surrounds the dielectric core member and has a second dielectric constant value that is lower than the first dielectric constant. A portion of the DWG is configured as a corner having a radius. A conductive layer formed on an outer radius of the corner.
Abstract translation: 电介质波导（DWG）具有纵向介质芯构件。 芯构件具有第一介电常数值。 包层围绕介质芯构件并具有低于第一介电常数的第二介电常数值。 DWG的一部分被配置为具有半径的角。 形成在拐角的外半径上的导电层。
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公开(公告)号：US20140240062A1
公开(公告)日：2014-08-28
申请号：US13854948
申请日：2013-04-01
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
IPC: H01P3/16
CPC classification number: H01P3/16 , H01L2223/6677 , H01L2224/16227 , H01L2924/15311 , H01P1/04 , H01P3/121 , H01Q13/00 , H05K1/0239 , H05K1/024 , H05K2201/0187 , H05K2201/0195 , H05K2201/09618 , H05K2201/10098 , Y10T29/49826 , Y10T29/49908
Abstract: A dielectric wave guide (DWG) has a dielectric core member that has a first dielectric constant value. A cladding surrounding the dielectric core member has a second dielectric constant value that is lower than the first dielectric constant. A mating end of the DWG is configured for mating with a second DWG having a matching non-planar shaped mating end. A deformable material is disposed on the surface of the mating end of the DWG, such that when mated to a second DWG, the deformable material fills a gap region between the mating ends of the DWG and the second DWG
Abstract translation: 电介质波导（DWG）具有第一介电常数值的介质芯构件。 围绕介电芯构件的包层具有低于第一介电常数的第二介电常数值。 DWG的配合端配置成与具有匹配的非平面形状配合端的第二DWG配合。 可变形材料设置在DWG的配合端的表面上，使得当与第二DWG配合时，可变形材料填充DWG的配合端和第二DWG之间的间隙区域
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