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公开(公告)号:US20130228739A1
公开(公告)日:2013-09-05
申请号:US13884263
申请日:2010-12-06
申请人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Akio Shima , Kenzo Kurotsuchi , Takashi Kobayashi
发明人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Akio Shima , Kenzo Kurotsuchi , Takashi Kobayashi
IPC分类号: H01L45/00
CPC分类号: H01L45/1608 , G11C13/0004 , G11C2213/75 , H01L27/0688 , H01L27/1021 , H01L27/11578 , H01L27/11582 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L27/249 , H01L29/7926 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1253 , H01L45/144 , H01L45/16 , H01L45/1675
摘要: When a thin channel semiconductor layer formed on a side wall of a stacked film in which insulating films and gate electrodes are alternately stacked together is removed on the stacked film, a contact resistance between a vertical transistor including the channel semiconductor layer and the gate electrode, and a bit line formed on the stacked film is prevented from rising. As its means, a conductive layer electrically connected to the channel semiconductor layer is disposed immediately above the stacked film.
摘要翻译: 当在叠层薄膜上除去形成在绝缘膜和栅电极交替层叠在一起的叠层膜的侧壁上的薄沟道半导体层时,包括沟道半导体层的垂直晶体管与栅电极之间的接触电阻, 并且防止形成在层叠膜上的位线上升。 作为其手段,电连接到沟道半导体层的导电层设置在堆叠膜的正上方。
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公开(公告)号:US09153774B2
公开(公告)日:2015-10-06
申请号:US13884263
申请日:2010-12-06
申请人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Akio Shima , Kenzo Kurotsuchi , Takashi Kobayashi
发明人: Yoshitaka Sasago , Masaharu Kinoshita , Mitsuharu Tai , Akio Shima , Kenzo Kurotsuchi , Takashi Kobayashi
IPC分类号: H01L27/06 , H01L45/00 , H01L27/102 , H01L29/792 , H01L27/24 , H01L27/115 , G11C13/00
CPC分类号: H01L45/1608 , G11C13/0004 , G11C2213/75 , H01L27/0688 , H01L27/1021 , H01L27/11578 , H01L27/11582 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L27/249 , H01L29/7926 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1253 , H01L45/144 , H01L45/16 , H01L45/1675
摘要: When a thin channel semiconductor layer formed on a side wall of a stacked film in which insulating films and gate electrodes are alternately stacked together is removed on the stacked film, a contact resistance between a vertical transistor including the channel semiconductor layer and the gate electrode, and a bit line formed on the stacked film is prevented from rising. As its means, a conductive layer electrically connected to the channel semiconductor layer is disposed immediately above the stacked film.
摘要翻译: 当在叠层薄膜上除去形成在绝缘膜和栅电极交替层叠在一起的叠层膜的侧壁上的薄沟道半导体层时,包括沟道半导体层的垂直晶体管与栅电极之间的接触电阻, 并且防止形成在层叠膜上的位线上升。 作为其手段,电连接到沟道半导体层的导电层设置在堆叠膜的正上方。
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公开(公告)号:US08228724B2
公开(公告)日:2012-07-24
申请号:US13345231
申请日:2012-01-06
IPC分类号: G11C11/00
CPC分类号: H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
摘要翻译: 例如,一个存储单元被配置为使用两个存储单元晶体管和一个相变元件,通过将多个扩散层与位线平行地布置,在扩散层之间设置栅极以跨越位线,布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层,以及在源极触点上提供相变元件。 此外,相位元件可以设置在位线触点上而不是源极触点。 通过这种方式,例如,可以实现存储单元晶体管的驱动性的提高和面积的减小。
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公开(公告)号:US20150213889A1
公开(公告)日:2015-07-30
申请号:US14415706
申请日:2012-07-19
申请人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
发明人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
IPC分类号: G11C13/00
CPC分类号: G11C13/0069 , G06F12/0246 , G06F2212/1008 , G11C13/0004 , G11C13/004 , G11C13/0061 , G11C16/0483 , G11C29/24 , G11C2029/0411 , G11C2213/72 , G11C2213/74 , G11C2213/75
摘要: A semiconductor device including a nonvolatile memory cell realizes enhancement of reliability and convenience. The semiconductor device includes a nonvolatile memory unit that includes plural overwritable memory cells (CL), and a control circuit that controls access to the nonvolatile memory unit. The control circuit allocates one physical address to a chain memory array CY in the nonvolatile memory unit, for example. The control circuit performs writing to a memory cell (for example, CL0) that is apart of the chain memory array CY according to a first write command with respect to the physical address, and performs writing to a memory cell (for example, CL1) that is another part thereof according to a second write command with respect to the physical address.
摘要翻译: 包括非易失性存储单元的半导体器件实现了可靠性和便利性的提高。 半导体器件包括包括多个可重写存储单元(CL)的非易失性存储器单元和控制对非易失性存储器单元的访问的控制电路。 例如,控制电路将一个物理地址分配给非易失性存储器单元中的链式存储器阵列CY。 控制电路根据关于物理地址的第一写入命令,对链存储器阵列CY的分开的存储单元(例如CL0)进行写入,并对存储单元(例如CL1)进行写入, 这是根据关于物理地址的第二写命令的另一部分。
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公开(公告)号:US08587995B2
公开(公告)日:2013-11-19
申请号:US13719961
申请日:2012-12-19
IPC分类号: G11C11/00
CPC分类号: H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
摘要翻译: 例如,一个存储单元被配置为使用两个存储单元晶体管和一个相变元件,通过将多个扩散层与位线平行地布置,在扩散层之间设置栅极以跨越位线,布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层,以及在源极触点上提供相变元件。 此外,相位元件可以设置在位线触点上而不是源极触点。 通过这种方式,例如,可以实现存储单元晶体管的驱动性的提高和面积的减小。
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公开(公告)号:US08363464B2
公开(公告)日:2013-01-29
申请号:US13528132
申请日:2012-06-20
IPC分类号: G11C11/00
CPC分类号: H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
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公开(公告)号:US20100214833A1
公开(公告)日:2010-08-26
申请号:US12774476
申请日:2010-05-05
CPC分类号: H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
摘要翻译: 例如,一个存储单元被配置为使用两个存储单元晶体管和一个相变元件,通过将多个扩散层与位线平行地布置,在扩散层之间设置栅极以跨越位线,布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层,以及在源极触点上提供相变元件。 此外,相位元件可以设置在位线触点上而不是源极触点。 通过这种方式,例如,可以实现存储单元晶体管的驱动性的提高和面积的减小。
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公开(公告)号:US07742330B2
公开(公告)日:2010-06-22
申请号:US11596705
申请日:2005-05-19
IPC分类号: G11C11/00
CPC分类号: H01L47/00 , G11C13/0004 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L2924/0002 , H01L2924/00
摘要: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
摘要翻译: 例如,一个存储单元被配置为使用两个存储单元晶体管和一个相变元件,通过将多个扩散层与位线平行地布置,在扩散层之间设置栅极以跨越位线,布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层,以及在源极触点上提供相变元件。 此外,相位元件可以设置在位线触点上而不是源极触点。 通过这种方式,例如,可以实现存储单元晶体管的驱动性的提高和面积的减小。
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公开(公告)号:US09355719B2
公开(公告)日:2016-05-31
申请号:US14415706
申请日:2012-07-19
申请人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
发明人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
CPC分类号: G11C13/0069 , G06F12/0246 , G06F2212/1008 , G11C13/0004 , G11C13/004 , G11C13/0061 , G11C16/0483 , G11C29/24 , G11C2029/0411 , G11C2213/72 , G11C2213/74 , G11C2213/75
摘要: A semiconductor device including a nonvolatile memory cell realizes enhancement of reliability and convenience. The semiconductor device includes a nonvolatile memory unit that includes plural overwritable memory cells (CL), and a control circuit that controls access to the nonvolatile memory unit. The control circuit allocates one physical address to a chain memory array CY in the nonvolatile memory unit, for example. The control circuit performs writing to a memory cell (for example, CL0) that is apart of the chain memory array CY according to a first write command with respect to the physical address, and performs writing to a memory cell (for example, CL1) that is another part thereof according to a second write command with respect to the physical address.
摘要翻译: 包括非易失性存储单元的半导体器件实现了可靠性和便利性的提高。 半导体器件包括包括多个可重写存储单元(CL)的非易失性存储器单元和控制对非易失性存储器单元的访问的控制电路。 例如,控制电路将一个物理地址分配给非易失性存储器单元中的链式存储器阵列CY。 控制电路根据关于物理地址的第一写入命令,对链存储器阵列CY的分开的存储单元(例如CL0)进行写入,并对存储单元(例如CL1)进行写入, 这是根据关于物理地址的第二写命令的另一部分。
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公开(公告)号:US20150186056A1
公开(公告)日:2015-07-02
申请号:US14423384
申请日:2012-09-07
申请人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
发明人: Seiji Miura , Hiroshi Uchigaito , Kenzo Kurotsuchi
IPC分类号: G06F3/06
CPC分类号: G06F3/0616 , G06F3/0652 , G06F3/0653 , G06F3/0659 , G06F3/0688 , G06F11/108
摘要: In a storage device system having a plurality of memory modules including a non-volatile memory, improved reliability and a longer life or the like is to be realized. To this end, a plurality of memory modules (STG) notifies a control circuit DKCTL0 of a write data volume (Wstg) that is actually written in an internal non-volatile memory thereof. The control circuit DKCTL0 finds a predicted write data volume (eWd) for each memory module on the basis of the write data volume (Wstg), a write data volume (Wh2d) involved in a write command that is already issued to the plurality of memory modules, and a write data volume (ntW) involved in a next write command. Then, a next write command is issued to the memory module having the smallest predicted write data volume.
摘要翻译: 在具有包括非易失性存储器的多个存储器模块的存储设备系统中,将实现提高的可靠性和更长的使用寿命等。 为此,多个存储器模块(STG)向控制电路DKCTL0通知实际写入其内部非易失性存储器的写入数据量(Wstg)。 控制电路DKCTL0根据写入数据量(Wstg),已经发给多个存储器的写命令所涉及的写入数据量(Wh2d),找出每个存储器模块的预测写数据量(eWd) 模块和下一个写命令中涉及的写数据卷(ntW)。 然后,向具有最小预测写入数据量的存储器模块发出下一个写入命令。
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