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公开(公告)号：US20130199767A1
公开(公告)日：2013-08-08
申请号：US13364907
申请日：2012-02-02
申请人： John P. Karidis , Mark D. Schultz
发明人： John P. Karidis , Mark D. Schultz
CPC分类号： H01L23/473 , B23K1/0014 , B23K31/02 , B23K2101/14 , H01L21/4882 , H01L21/4885 , H01L23/3677 , H01L23/467 , H01L24/72 , H01L2924/01322 , H01L2924/00
摘要： A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
摘要翻译： 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。
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公开(公告)号：US20110203108A1
公开(公告)日：2011-08-25
申请号：US12708774
申请日：2010-02-19
申请人： Mark D. Schultz
发明人： Mark D. Schultz
CPC分类号： G01R1/06716 , G01R1/06744 , Y10T29/49224
摘要： A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.
摘要翻译： 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。
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公开(公告)号：US20090151907A1
公开(公告)日：2009-06-18
申请号：US11956024
申请日：2007-12-13
申请人： John P. Karidis , Mark D. Schultz
发明人： John P. Karidis , Mark D. Schultz
CPC分类号： H01L23/473 , H01L21/4882 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.
摘要翻译： 用于制造用于冷却集成电路的柔性热接口装置的方法包括以下步骤：根据至少一个选定图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件，使得所述片材包括平坦区域和弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合将所述堆叠片材中的至少一个的至少一部分结合。
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公开(公告)号：US20080247165A1
公开(公告)日：2008-10-09
申请号：US11696265
申请日：2007-04-04
申请人： Mark D. Schultz
发明人： Mark D. Schultz
摘要： A method and apparatus for increasing the visibility in the visible spectrum of a laser pointer on a target. The laser pointer provides a laser source or sources of at least two distinct visible colors. The visibility of at least one of the laser source colors on the target is determined. The laser source color is selected from the given colors based on the determined visibility. The selected laser source color is directed to the target.
摘要翻译： 一种用于增加激光指示器在目标上的可见光谱中的可视性的方法和装置。 激光指示器提供至少两种不同可见颜色的激光源或源。 确定目标上的至少一种激光源颜色的可视性。 基于所确定的可视性，从给定的颜色中选择激光源颜色。 所选择的激光源颜色指向目标。
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公开(公告)号：US07362582B2
公开(公告)日：2008-04-22
申请号：US11151905
申请日：2005-06-14
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的可压缩顶层。 该结构还包括设置在顶层和电子设备之间的多个刚性元件，用于提供来自电子设备的热路径，并且其中多个刚性元件提供机械顺应性。 在另一替代方案中，结构还包括设置在电子设备上的适形导热层，其中多个刚性元件的底端联接到适形导热层。
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公开(公告)号：US08746000B2
公开(公告)日：2014-06-10
申请号：US13587912
申请日：2012-08-16
申请人： Mark D. Schultz
发明人： Mark D. Schultz
IPC分类号： F25D23/12
CPC分类号： H05K7/20836 , G05D23/00 , H05K7/20281
摘要： According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.
摘要翻译： 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。
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公开(公告)号：US20140022725A1
公开(公告)日：2014-01-23
申请号：US13587912
申请日：2012-08-16
申请人： Mark D. Schultz
发明人： Mark D. Schultz
IPC分类号： G06F1/20
CPC分类号： H05K7/20836 , G05D23/00 , H05K7/20281
摘要： According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.
摘要翻译： 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。
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48.发明授权公开(公告)号：US08286855B2
公开(公告)日：2012-10-16
申请号：US13442322
申请日：2012-04-09
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 提供了一种将导电接合材料沉积在模具中的空腔中的方法。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。
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公开(公告)号：US07931249B2
公开(公告)日：2011-04-26
申请号：US11670080
申请日：2007-02-01
申请人： Mark D. Schultz
发明人： Mark D. Schultz
CPC分类号： H05K3/3457 , H05K2203/0113
摘要： A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.
摘要翻译： 一种降低摩擦的方法，其在注射成型，焊接加工中使用的模具中遇到，并且其中玻璃模板在其中蚀刻有模具凹坑。 对模具进行热处理，以沿着模具凹坑的周边平滑或圆形的锐利边缘。
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50.发明授权Management of data cartridges in multiple-cartridge cells in an automated data storage library 失效在自动数据存储库中管理多盒式单元格中的数据盒式磁带公开(公告)号：US07751141B2
公开(公告)日：2010-07-06
申请号：US12116175
申请日：2008-05-06
申请人： German A. Chamorro , Michael P. McIntosh , Shawn M. Nave , Mark D. Schultz , Harley C. Witt , Raymond Yardy
发明人： German A. Chamorro , Michael P. McIntosh , Shawn M. Nave , Mark D. Schultz , Harley C. Witt , Raymond Yardy
IPC分类号： G11B19/02
CPC分类号： G11B15/682 , G11B15/689 , G11B17/22 , G11B17/225 , G11B17/228
摘要： In an automated library, data cartridges, such as magnetic tape cartridges, are stored in storage cells and accessed by data storage drives. An accessor with a gripper transports cartridges between storage cells and storage drives. Cartridges are prioritized according to their relative importance. A processor manages the placement of the cartridges in cells by having higher priority cartridges stored closer to the front of multi-cartridge cells than cartridges with a lower priority. Cartridges with a higher priority may also be stored closer to a storage drive than cartridges with a lower priority. A pusher may be used to push cartridges towards the front of multi-cartridge cells with an empty position to enable the gripper to reach the front cartridge.
摘要翻译： 在自动化库中，数据盒式磁带（如磁带盒）存储在存储单元中，并由数据存储驱动器访问。 具有夹持器的存取器在存储单元和存储驱动器之间传送墨盒。 墨盒根据其相对重要性进行优先排序。 处理器通过将较高优先级的存储盒存储在比多盒单元的前面更靠近具有较低优先级的盒，来管理盒中的盒的放置。 具有较高优先级的墨盒也可以比具有较低优先级的墨盒更靠近存储驱动器。 可以使用推动器将空盒朝向多盒单元的前部推送，以使夹具能够到达前盒。
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