MICROFLUIDIC DEVICE AND METHOD USING DOUBLE ANODIC BONDING

    公开(公告)号:US20210254207A1

    公开(公告)日:2021-08-19

    申请号:US17306665

    申请日:2021-05-03

    Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

    Microfluidic device and method using double anodic bonding

    公开(公告)号:US11021785B2

    公开(公告)日:2021-06-01

    申请号:US15841171

    申请日:2017-12-13

    Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

    Vapor jet printing
    48.
    发明授权

    公开(公告)号:US10916704B2

    公开(公告)日:2021-02-09

    申请号:US16292422

    申请日:2019-03-05

    Abstract: Embodiments of the disclosed subject matter provide systems and methods of depositing a film on a selective area of a substrate. A first jet of a first material may be ejected from a first nozzle assembly of a jet head having a plurality of nozzle assemblies to form a first portion of a film deposition on the substrate. A second jet of a second material may be ejected from a second nozzle assembly of the plurality of nozzle assemblies, the second nozzle assembly being aligned with the first nozzle assembly parallel to a direction of motion between the plurality of nozzle assemblies and the substrate, and the second material being different than the first material. The second material may react with the first portion of the film deposition to form a composite film deposition on the substrate when using reactive gas precursors.

    Valved micronozzle array for high temperature MEMS application

    公开(公告)号:US10654272B2

    公开(公告)日:2020-05-19

    申请号:US16243393

    申请日:2019-01-09

    Abstract: Embodiments of the disclosed subject matter provide a micronozzle array formed from monolithic silicon. The micronozzle array may have a plurality of nozzles, where each nozzle of the plurality of nozzles including an integrated plug valve that allows flow from the nozzle to be attenuated separately from each other nozzle of the plurality of nozzles. Each of the plurality of nozzles may include a microchannel, formed from the monolithic silicon, having a first channel portion and a second channel portion, where the first channel portion is narrower than the second channel portion, and where the first channel portion forms an aperture of the nozzle that is configured to eject vapor from the microchannel. Each of the plurality of nozzles may include a stem, formed from the monolithic silicon that includes the integrated plug valve is suspended in the microchannel to attenuate the flow from the nozzle.

Patent Agency Ranking