摘要:
The invention provides methods for treating and/or preventing headaches by administering to patients therapeutically effective amounts of 1,2-dihydropyridine compounds, and, optionally, cholinesterase inhibitors and/or anti-migraine agents. The headaches may be primary headaches, such as migraines, or secondary headaches. The invention also provides combinations, commercial packages, and pharmaceutical compositions comprising therapeutically effective amounts of 1,2-dihydropyridine compounds and, optionally, cholinesterase inhibitors and/or anti-migraine agents. The 1,2-dihydropyridine compound may be, for example, 3-(2-cyanophenyl)-5-(2-pyridyl)-1-phenyl-1,2-dihydropyridin-2-one. The cholinesterase inhibitor may be, for example, 1-benzyl-4-((5,6-dimethoxy-1-indanon)-2-yl)methylpiperidine.
摘要:
The invention provides methods for treating and/or preventing cognitive impairments, dementia, or neurodegenerative diseases and disorders (e.g., Alzheimer's disease, Parkinson's disease, Huntington's disease, amyotrophic lateral sclerosis) in patients by administering therapeutically effective amounts of an AMPA receptor antagonist (e.g., 1,2-dihydropyridine compounds) and therapeutically effective amounts of nootropics (e.g., cholinesterase inhibitors) to patients. The invention also provides combinations, commercial packages, and pharmaceutical compositions comprising therapeutically effective amounts of AMPA receptor antagonists (e.g., 1,2-dihydropyridine compounds) and therapeutically effective amounts nootropics (e.g., cholinesterase inhibitors). The 1,2-dihydropyridine compound may be, for example, 3-(2-cyanophenyl)-5-(2-pyridyl)-1-phenyl-1,2-dihydropyridin-2-one. The cholinesterase inhibitor may be, for example, donepezil.
摘要:
A martensitic stainless steel pipe, which comprises specified quantities of C, Si, Mn, P, S, Cr, Ni, Al, N, Cu, Ti, V, Mo, Nb, B and Ca, and the balance being Fe and impurities, has satisfactory toughness at a high strength of 650 MPa or more by yield strength and also excellent hot workability. Therefore, it can be used as a high-strength martensitic stainless steel pipe for carbon dioxide gas corrosion resistant use, to be used in oil and/or gas well environments containing no hydrogen sulfide but carbon dioxide gas. This high-strength martensitic stainless steel pipe is an inexpensive martensitic stainless steel pipe, which does not require an addition of large quantities of expensive elements such as Ni and Mo, and moreover does not require the control of the content of P to a value less than 0.010% by mass.
摘要:
An object of the present invention is to provide air cooling equipment for a heat treatment process for a martensitic stainless steel pipe, which is capable of shortening the time required for the heat treatment process by enhancing the cooling efficiency at the time when the inner surface of steel pipe is air cooled in the heat treatment ent process.Air cooling equipment 100 for a heat treatment process for a martensitic stainless steel pipe P in accordance with the present invention comprises: a conveying device 10 for intermittently conveying the steel pipe P in the direction substantially at right angles to the longitudinal direction of the steel pipe P; and an air cooling device 20 provided with a nozzle 21 for spraying air Bi toward the inner surface of the steel pipe P, the nozzle 21 being arranged along the longitudinal direction of the steel pipe P at a stop position of the steel pipe P intermittently conveyed by the conveying device 10 so as to face to an end of the steel pipe P.
摘要:
Display unevenness is suppressed. A display device includes pixels (22) arranged in matrix, each including a current-driven type light emitting element (EL) and a drive transistor (Tr3) for supplying a current to the current-driven type light emitting element (EL). The current-driven type light emitting element (EL) is driven by dividing each frame period into a plurality of sub-frame periods for lighting time. The drive transistor is controlled under current write driving using two write currents having a ratio of 1:1/2N and a sum of the two write currents.
摘要:
To compensate for voltage drop on a power supply line. In a display device, pixel data is supplied to each of a plurality of pixels arranged in a matrix form and display is performed. Each pixel has a self-emissive element. A horizontal direction power supply line (horizontal direction PVDD) which supplies a power supply to each pixel is provided, and one end of the horizontal PVDD line is connected to a vertical power supply line (vertical PVDD line) that is connected to an external power supply terminal. Correction data corresponding to a voltage drop to the horizontal PVDD line due to a resistance in the vertical PVDD line is then obtained through a calculation based on pixel data, and the input pixel data is corrected using the correction data so as to reduce the influence of the voltage drop on the pixel current.
摘要:
Noise on a current to be measured is removed. Horizontal power supply lines (PVDD) are arranged in a horizontal direction and supply a current to pixels in respective corresponding horizontal lines. A switch (8) connects a group of the horizontal power supply lines (PVDD) to a first power supply line (PVDDa) or a second power supply line (PVDDb) disposed outside a pixel region in a switchable manner. Only the horizontal power supply lines (PVDD) in a group to which a pixel to be measured belongs are supplied with power from the second power supply line (PVDDb) so as to measure a current of each pixel in the group, and a current flowing into a power source (PVDDa) connected to a group to which other pixels than the pixel to be measured belong is measured, to thereby calculate a pixel current based on a difference between the two measured currents.
摘要:
[Objects] To improve productivity and reduce thermal energy consumption in manufacturing of high purity silicon as a raw material for metallurgical grade pure silicon.[Means to Solve]After conducting a first treatment of either removing boron by water-vapor added plasma arc heating or low-pressure oxygen plasma arc heating upon raw silicon contained in a hearth in a chamber to thereby putting the raw silicon into a high temperature molten state to thereby oxidizing and removing boron by evaporation, or removing phosphorus by electron beam irradiation to thereby putting the raw silicon into a high temperature molten state to thereby remove phosphorus by evaporation in an atmosphere suitable to the treatment; the atmosphere of the chamber is then changed to a vacuum atmosphere suitable to the remaining second treatment, while maintaining the silicon contained in the hearth in its molten state, and the second purification treatment is conducted; whereafter end(s) enriched in impurities is cut off by way of one-way coagulation method to obtain a high purity refined silicon ingot highly free from phosphorus, boron and other impurities.
摘要:
An object of the present invention is to provide air cooling equipment for a heat treatment process for a martensitic stainless steel pipe, which is capable of shortening the time required for the heat treatment process by enhancing the cooling efficiency at the time when the inner surface of steel pipe is air cooled in the heat treatment ent process.Air cooling equipment 100 for a heat treatment process for a martensitic stainless steel pipe P in accordance with the present invention comprises: a conveying device 10 for intermittently conveying the steel pipe P in the direction substantially at right angles to the longitudinal direction of the steel pipe P; and an air cooling device 20 provided with a nozzle 21 for spraying air Bi toward the inner surface of the steel pipe P, the nozzle 21 being arranged along the longitudinal direction of the steel pipe P at a stop position of the steel pipe P intermittently conveyed by the conveying device 10 so as to face to an end of the steel pipe P.
摘要:
The present invention relates to a shaping method of a thin film layer and a manufacturing method of a perpendicular recording magnetic head using the same. In the thin film layer shaping method according to the present invention, since a second thin film of a lower etching rate is etched by a preliminary etching amount allowing for a difference between the etching rate of the second thin film and an etching rate of a first thin film in side-by-side relationship with each other, both the first and second thin films can be etched by the same etching amount through a subsequent etching step, so that the thin film layer can be shaped into a given shape. Thus, the surface of the thin film layer can be planarized.