公开(公告)号：US20120097523A1

公开(公告)日：2012-04-26

申请号：US13266631

申请日：2010-04-27

申请人： Nobuyuki Mori ,  Hiroshi Yano ,  Toshiyuki Shiroishi ,  Takashi Ushida ,  Nobuhiro Shimizu ,  Noriyuki Takahashi ,  Toshihiro Mitsuzuka

发明人： Nobuyuki Mori ,  Hiroshi Yano ,  Toshiyuki Shiroishi ,  Takashi Ushida ,  Nobuhiro Shimizu ,  Noriyuki Takahashi ,  Toshihiro Mitsuzuka

IPC分类号： C01B33/037 ,  B01J19/08

CPC分类号： C01B33/037

摘要： [Objects] To improve productivity and reduce thermal energy consumption in manufacturing of high purity silicon as a raw material for metallurgical grade pure silicon.[Means to Solve]After conducting a first treatment of either removing boron by water-vapor added plasma arc heating or low-pressure oxygen plasma arc heating upon raw silicon contained in a hearth in a chamber to thereby putting the raw silicon into a high temperature molten state to thereby oxidizing and removing boron by evaporation, or removing phosphorus by electron beam irradiation to thereby putting the raw silicon into a high temperature molten state to thereby remove phosphorus by evaporation in an atmosphere suitable to the treatment; the atmosphere of the chamber is then changed to a vacuum atmosphere suitable to the remaining second treatment, while maintaining the silicon contained in the hearth in its molten state, and the second purification treatment is conducted; whereafter end(s) enriched in impurities is cut off by way of one-way coagulation method to obtain a high purity refined silicon ingot highly free from phosphorus, boron and other impurities.

摘要翻译： [对象]提高生产率，降低冶金级纯硅原料的高纯度硅制造中的热能消耗。 [解决方法]在室内的原料硅中，通过水蒸汽添加等离子体电弧加热或低压氧等离子体电弧加热进行第一次处理之后，将原料硅置于高温 从而通过蒸发氧化和除去硼，或通过电子束照射除去磷，从而将原料硅置于高温熔融状态，从而通过在适于处理的气氛中蒸发除去磷; 然后将室的气氛变成适合于剩余的第二处理的真空气氛，同时将包含在炉床中的硅保持在其熔融状态，并且进行第二净化处理; 然后通过单向凝结法切断富集杂质的末端，得到高度无磷，硼等杂质的高纯度精制硅锭。

公开(公告)号：US08560784B2

公开(公告)日：2013-10-15

申请号：US13238190

申请日：2011-09-21

申请人： Noriyuki Takahashi ,  Mikio Hondou

发明人： Noriyuki Takahashi ,  Mikio Hondou

IPC分类号： G06F12/00 ,  G06F13/00 ,  G06F13/28

CPC分类号： G06F13/1642 ,  G06F13/1663

摘要： A priority control register 104 dynamically controls the internal transition state based on the issuability state of a memory request obtained in the memory request issuability signal generation unit 106 and retaining state of the memory request in the REQ_BUF 102 obtained by each of determination circuits 105 #2 through #5. Thus, the jump control of the priorities corresponding to the access regulation of the DRAM module 109 can be realized.

摘要翻译： 优先级控制寄存器104基于在存储器请求发布信号生成单元106中获得的存储器请求的可发行性状态来动态地控制内部转换状态，并且在由每个确定电路105＃2获得的REQ_BUF 102中保持存储器请求的状态 通过＃5。 因此，可以实现与DRAM模块109的访问调节相对应的优先级的跳转控制。

公开(公告)号：US08189888B2

公开(公告)日：2012-05-29

申请号：US12212863

申请日：2008-09-18

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： G06K9/00

CPC分类号： G06F19/321 ,  A61B5/055 ,  A61B6/03 ,  A61B6/463 ,  A61B6/468 ,  G06F19/00 ,  G16H15/00

摘要： A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note.

摘要翻译： 医疗报告系统包括用于显示多个CT图像的显示面板。 ROI设置单元指定CT图像中的感兴趣区域。 组设定单元在CT图像之间设置具有感兴趣区域的一组特定CT图像，以生成组的组信息。 报告编辑器显示用于输入与特定CT图像有关的音符的音符区域。 存储器存储分配给组信息的笔记区域的文本位置，并将感兴趣区域的位置信息存储在特定CT图像中。 此外，第一终端装置具有报告编辑器，ROI设置单元和组设置单元。 第二终端设备在线上与第一终端设备通信。 报告显示面板至少显示特定的CT图像和音符。

公开(公告)号：US07986641B2

公开(公告)日：2011-07-26

申请号：US11852618

申请日：2007-09-10

申请人： Seiichiro Tani ,  Toshiaki Miyazaki ,  Noriyuki Takahashi ,  Takahiro Murooka ,  Shinya Ishihara ,  Takeru Inoue

发明人： Seiichiro Tani ,  Toshiaki Miyazaki ,  Noriyuki Takahashi ,  Takahiro Murooka ,  Shinya Ishihara ,  Takeru Inoue

IPC分类号： H04L12/28 ,  H04L12/56 ,  G06F15/173 ,  G06F15/16

CPC分类号： H04L12/185 ,  H04L12/1854

摘要： A multicast data communication system is provided that has high security, and prevents problems such as an attack by a malicious user creating a great number of meaningless tables at nodes in the network. Clients regularly transmit request packets toward a server; a node receives the request packet, and subsequently receives a delivery-table-creation packet or a delivery packet from the server; if the node has no delivery table corresponding to the server, the node creates the delivery table, registers the addresses of the clients, and their request packet arrival times, and regularly transmits the request packet toward the server; when the node has received a delivery packet from the server, the node duplicates and delivers the delivery packet only to those clients whose request packet arrival times, registered in the delivery table, are within a fixed period from the arrival of the delivery packet.

摘要翻译： 提供了具有高安全性的组播数据通信系统，并且防止了恶意用户在网络中的节点处创建大量无意义表的攻击等问题。 客户端定期向服务器发送请求数据包; 节点接收请求分组，随后从服务器接收传送表创建分组或传送分组; 如果节点没有与服务器对应的传送表，则节点创建传送表，注册客户端的地址及其请求包到达时间，并定期向服务器发送请求包; 当节点已经从服务器接收到传送分组时，节点将传送分组复制并传送到那些登记在传送表中的请求分组到达时间在从传送分组到达的固定时间段内的那些客户端。

公开(公告)号：US20080135992A1

公开(公告)日：2008-06-12

申请号：US12014313

申请日：2008-01-15

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of making a semiconductor device including a semiconductor chip having a plurality of pads, and a lead frame having a plurality of leads. Each of the plurality of leads has a mounting surface for mounting the semiconductor device, a wire connection surface having a thick portion, and a thin portion whose thickness is thinner than the thick portion. The length of each wire connection surface was furthermore formed shorter than the mounting surface, by arranging so that the thin portion of each lead dives below the semiconductor chip, securing the length of the mounting surface of each lead, a distance from the side face of the semiconductor chip to the side face of a molded body of the semiconductor device being shortened as much as possible, and the package size is brought close to chip size, with miniaturization of QFN.

摘要翻译： 一种制造包括具有多个焊盘的半导体芯片的半导体器件的方法，以及具有多个引线的引线框架。 多个引线中的每一个具有用于安装半导体器件的安装表面，具有厚壁部分的电线连接表面，以及厚度比厚壁部分薄的薄部分。 此外，每个电线连接表面的长度进一步形成为比安装表面短，通过这样布置，使得每个引线的薄部分潜入到半导体芯片的下方，确保每个引线的安装表面的长度， 尽可能地缩短半导体器件的成型体的侧面的半导体芯片，并且随着QFN的小型化，封装尺寸接近芯片尺寸。

公开(公告)号：US07374970B2

公开(公告)日：2008-05-20

申请号：US11058237

申请日：2005-02-16

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： H01L21/00

CPC分类号： G01R31/2867 ,  B65D2585/86 ,  H01L21/67333 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/02331 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05562 ,  H01L2224/05644 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/01014 ,  H01L2224/05552 ,  H01L2924/00

摘要： The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved.

摘要翻译： 要提高半导体器件的产量。 托盘设置有多个能够容纳晶片级CSP的凹部，并且每个凹部设置有用于支撑晶片级CSP的多个凸起的基部和围绕基部形成的侧壁。 在制造晶片级CSP的后期制作过程中，在同样的场合下，基座不支持有机膜而是支持多个焊料凸点。 因此，能够防止有机膜发生瑕疵或脱落，作为异物附着在产品上，结果可以提高晶片级CSP（半导体器件）的质量和产率。

公开(公告)号：US20080069099A1

公开(公告)日：2008-03-20

申请号：US11852618

申请日：2007-09-10

申请人： Seiichiro Tani ,  Toshiaki Miyazaki ,  Noriyuki Takahashi ,  Takahiro Murooka ,  Shinya Ishihara ,  Takeru Inoue

发明人： Seiichiro Tani ,  Toshiaki Miyazaki ,  Noriyuki Takahashi ,  Takahiro Murooka ,  Shinya Ishihara ,  Takeru Inoue

IPC分类号： H04L12/56

CPC分类号： H04L12/185 ,  H04L12/1854

摘要： A multicast data communication system is provided that has high security, and prevents problems such as an attack by a malicious user creating a great number of meaningless tables at nodes in the network. Clients regularly transmit request packets toward a server; a node receives the request packet, and subsequently receives a delivery-table-creation packet or a delivery packet from the server; if the node has no delivery table corresponding to the server, the node creates the delivery table, registers the addresses of the clients, and their request packet arrival times, and regularly transmits the request packet toward the server; when the node has received a delivery packet from the server, the node duplicates and delivers the delivery packet only to those clients whose request packet arrival times, registered in the delivery table, are within a fixed period from the arrival of the delivery packet.

摘要翻译： 提供了具有高安全性的组播数据通信系统，并且防止了恶意用户在网络中的节点处创建大量无意义表的攻击等问题。 客户端定期向服务器发送请求数据包; 节点接收请求分组，随后从服务器接收传送表创建分组或传送分组; 如果节点没有与服务器对应的传送表，则节点创建传送表，注册客户端的地址及其请求包到达时间，并定期向服务器发送请求包; 当节点已经从服务器接收到传送分组时，节点将传送分组复制并传送到那些登记在传送表中的请求分组到达时间在从传送分组到达的固定时间段内的那些客户端。

公开(公告)号：US20060079028A1

公开(公告)日：2006-04-13

申请号：US11222959

申请日：2005-09-12

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： H01L21/50

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： The package size of a semiconductor device is brought close to chip size, and a miniaturization is aimed at. Including a semiconductor chip having a plurality of pads, a plurality of leads having a mounting surface and a wire connection surface, having a thick portion, and the thin portion whose thickness is thinner than a thick portion, and with which the length of each wire connection surface was furthermore formed shorter than a mounting surface, a plurality of wires connecting leads with a semiconductor chip, and a molded body formed with resin, by arranging so that the thin portion of each lead dives into the lower part of a semiconductor chip and connecting the lead and the semiconductor chip with the wire by reverse bonding, securing the length of the mounting surface of each lead, distance from the side face of a semiconductor chip to the side face of a molded body is shortened as much as possible, package size is brought close to chip size, and the miniaturization of QFN 5 is aimed at.

摘要翻译： 半导体器件的封装尺寸接近芯片尺寸，并且旨在实现小型化。 包括具有多个焊盘的半导体芯片，具有安装表面和导线连接表面的多个引线，具有厚壁部分，其厚度比厚度部分薄，并且每根导线的长度 此外，连接表面还形成为比安装表面更短，通过半导体芯片连接引线的多条电线和通过树脂形成的成型体，使得每个引线的薄部分潜入半导体芯片的下部，并且 通过反向接合将引线和半导体芯片与导线连接，确保每个引线的安装面的长度，半导体芯片的侧面的距离与成形体的侧面的距离尽可能地缩短 尺寸接近芯片尺寸，并且QFN 5的小型化是针对的。

公开(公告)号：US20050202597A1

公开(公告)日：2005-09-15

申请号：US11058237

申请日：2005-02-16

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： G01R31/26 ,  B65D21/02 ,  B65D85/86 ,  H01L21/44 ,  H01L21/66 ,  H01L21/673 ,  H01L21/68

CPC分类号： G01R31/2867 ,  B65D2585/86 ,  H01L21/67333 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/02331 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05562 ,  H01L2224/05644 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/01014 ,  H01L2224/05552 ,  H01L2924/00

摘要： The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved.

摘要翻译： 要提高半导体器件的产量。 托盘设置有多个能够容纳晶片级CSP的凹部，并且每个凹部设置有用于支撑晶片级CSP的多个凸起的基部和围绕基部形成的侧壁。 在制造晶片级CSP的后期制作过程中，在同样的场合下，基座不支持有机膜而是支持多个焊料凸点。 因此，能够防止有机膜发生瑕疵或脱落，作为异物附着在产品上，结果可以提高晶片级CSP（半导体器件）的质量和产率。

公开(公告)号：US5375237A

公开(公告)日：1994-12-20

申请号：US102709

申请日：1993-08-05

申请人： Kazuaki Tanaka ,  Noriyuki Takahashi ,  Toshio Akiba

发明人： Kazuaki Tanaka ,  Noriyuki Takahashi ,  Toshio Akiba

IPC分类号： G06F9/06 ,  G06F12/00 ,  G06F17/30 ,  G06F7/00

CPC分类号： G06F17/30952 ,  Y10S707/99943 ,  Y10S707/99945 ,  Y10S707/99953

摘要： A computer system comprises program products represented by a database management system, a first dictionary for registering and managing the definition data required for executing each of the program products and a second dictionary for storing and managing the structure definition data of the first dictionary. Each of the program products, for example a database system and a system development support tool, has added thereto in advance their structure definition data relating to all the definition data including the data required for executing each of the program products. The computer system creates the first dictionary on the basis of the structure definition data held by the program products in response to the demand for creating the first dictionary.

摘要翻译： 计算机系统包括由数据库管理系统表示的程序产品，用于注册和管理执行每个程序产品所需的定义数据的第一字典和用于存储和管理第一字典的结构定义数据的第二字典。 每个程序产品（例如数据库系统和系统开发支持工具）预先向其添加了与包括执行每个程序产品所需的数据的所有定义数据相关的结构定义数据。 计算机系统基于由程序产品保存的结构定义数据，响应于创建第一个字典的需求而创建第一个字典。