公开(公告)号：US08893642B2

公开(公告)日：2014-11-25

申请号：US12730868

申请日：2010-03-24

申请人： Eric H. Lenz

发明人： Eric H. Lenz

IPC分类号： C23C14/00 ,  H01L21/67 ,  H01L21/677

CPC分类号： B01D46/446 ,  H01L21/67017 ,  H01L21/67155 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10T137/0396 ,  Y10T137/86002 ,  Y10T137/863 ,  Y10T137/87169

摘要： In various exemplary embodiments described herein, a system and related method to provide airflow management system in a substrate production tool includes a housing to couple the substrate production tool to a fan filter unit to provide filtered air to the housing, a facility connection to couple the substrate production tool to a reduced pressure exhaust mechanism, a substrate transfer section coupled below the housing and in airflow communication with the facility connection, and a substrate process area coupled to the substrate transfer section by one or more substrate transfer slots. A chamber substantially containing the substrate transfer section and the substrate process area is coupled to the housing to receive the filtered air and to the facility connection to provide an exhaust for excess gas flow. The chamber maintains a low pressure in the substrate process area relative to the substrate transfer section.

摘要翻译： 在这里描述的各种示例性实施例中，在衬底生产工具中提供气流管理系统的系统和相关方法包括：将衬底生产工具耦合到风扇过滤器单元以将过滤的空气提供给壳体的壳体， 衬底生产工具到减压排气机构，耦合在壳体下方并与设备连接气流连通的衬底传送部分以及通过一个或多个衬底传送槽耦合到衬底传送部分的衬底处理区域。 基本上包含衬底转移部分和衬底处理区域的室耦合到壳体以接收经过滤的空气和设备连接以提供用于过量气体流动的排气。 该腔室在衬底处理区域中保持相对于衬底传送部分的低压。

公开(公告)号：US20110236159A1

公开(公告)日：2011-09-29

申请号：US12730880

申请日：2010-03-24

申请人： Eric H. Lenz

发明人： Eric H. Lenz

IPC分类号： H01L21/677

CPC分类号： H01L21/67754 ,  H01L21/67742

摘要： In various exemplary embodiments described herein, a system and related method to reduce particle contamination on substrates is disclosed. The system includes a substrate traverser mechanism having tracks to transport substrate carriers with one or more traverser ducts arranged to surround, at least partially, the tracks. The one or more ducts have slits along at least a substantial portion of a length of the tracks. A traverser exhaust fan is coupled to one end of each of the one or more traverser ducts. The fan provides sufficient volumetric airflow such that a velocity of the volumetric airflow through the slits is greater than a terminal settling velocity of a predetermined particle size. The fan draws particles less than approximately the predetermined particle size generated by the substrate traverser mechanism into the one or more traverser ducts.

摘要翻译： 在本文描述的各种示例性实施例中，公开了一种减少基板上的颗粒污染的系统和相关方法。 该系统包括具有轨道以运送基板载体的基板横移机构，其具有设置成至少部分地围绕轨道的一个或多个横向通道。 一个或多个管道沿着轨道的长度的至少大部分具有狭缝。 横动器排气风扇联接到一个或多个横向通道中的每一个的一端。 风扇提供足够的体积气流，使得通过狭缝的体积气流的速度大于预定粒度的终点沉降速度。 风扇将小于由基板横移机构产生的大约预定粒度的颗粒吸入一个或多个横向通道。

公开(公告)号：US20110200415A1

公开(公告)日：2011-08-18

申请号：US12706397

申请日：2010-02-16

申请人： Eric H. Lenz

发明人： Eric H. Lenz

IPC分类号： H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67196 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67778

摘要： In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot.

摘要翻译： 在本文描述的各种示例性实施例中，系统包括多个承载臂，每个承载臂在承载臂的相对端之间具有同心安装的中点，其中晶片载体安装在承载臂的每个相对端上。 集线器包括多个同心安装的驱动器，其中多个驱动器中的每一个驱动器在多个承载臂中的相应一个的臂的中点附近耦合。 多个驱动器中的每一个被配置为独立于剩余的多个同心安装的驱动器被控制。 相应的电动机联接到每个同心安装的驱动器并且被配置成以旋转方式移动联接的行星架臂。 线性晶片传送机构将晶片移动到多个载体臂上的或从选定的晶片载体上移动到用于装载/卸载机器人的简单的切换位置。

公开(公告)号：US07094315B2

公开(公告)日：2006-08-22

申请号：US11022396

申请日：2004-12-22

申请人： Jian J. Chen ,  Mukund Srinivasan ,  Eric H. Lenz

发明人： Jian J. Chen ,  Mukund Srinivasan ,  Eric H. Lenz

IPC分类号： H01L21/306 ,  C23C16/00

CPC分类号： H01J37/32871 ,  H01J37/32082 ,  H01J37/32623

摘要： A plasma confining assembly for minimizing unwanted plasma formations in regions outside of a process region in a process chamber is disclosed. The plasma confining assembly includes a first confining element and second confining element positioned proximate the periphery of the process region. The second confining element is spaced apart from the first confining element. The first confining element includes an exposed conductive surface that is electrically grounded and the second confining element includes an exposed insulating surface, which is configured for covering a conductive portion that is electrically grounded. The first confining element and the second confining element substantially reduce the effects of plasma forming components that pass therebetween. Additionally, the plasma confining assembly may include a third confining element, which is formed from an insulating material and disposed between the first confining element and the second confining element, and proximate the periphery of the process region. The third confining element further reduces the effects of plasma forming components that pass between the first confining element and the second confining element.

摘要翻译： 公开了一种用于最小化处理室中的处理区域外的区域中的不需要的等离子体形成的等离子体封闭组件。 等离子体限制组件包括靠近处理区域的周边定位的第一限制元件和第二约束元件。 第二限制元件与第一限制元件间隔开。 第一限制元件包括电接地的暴露的导电表面，并且第二限制元件包括暴露的绝缘表面，其被配置为覆盖电接地的导电部分。 第一限制元件和第二限制元件大大减少了通过它们的等离子体形成部件的影响。 另外，等离子体限制组件可以包括由绝缘材料形成并且设置在第一限制元件和第二限制元件之间以及靠近处理区域的周边的第三限制元件。 第三限制元件进一步降低了在第一限制元件和第二限制元件之间通过的等离子体形成元件的影响。

公开(公告)号：US06602381B1

公开(公告)日：2003-08-05

申请号：US09846172

申请日：2001-04-30

申请人： Eric H. Lenz

发明人： Eric H. Lenz

IPC分类号： H05H100

CPC分类号： H01J37/32623 ,  H01J37/32642

摘要： A confinement assembly for confining a discharge within an interaction space of a plasma processing apparatus comprising a stack of rings and at least one electrically conductive member. The rings are spaced apart from each other to form slots therebetween and are positioned to surround the interaction space. At least one electrically conductive member electrically couples each ring. The electrically conductive member contacts each ring at least at a point inside of the outer circumference of each ring.

摘要翻译： 一种用于将放电限制在包括一叠环和至少一个导电构件的等离子体处理装置的相互作用空间内的限制组件。 环彼此间隔开以在它们之间形成槽，并且定位成围绕相互作用空间。 至少一个导电构件电耦合每个环。 导电构件至少在每个环的外周的内侧接触每个环。

公开(公告)号：US06536777B2

公开(公告)日：2003-03-25

申请号：US09283827

申请日：1999-03-31

申请人： Fangli J. Hao ,  Eric H. Lenz ,  Keith E. Dawson

发明人： Fangli J. Hao ,  Eric H. Lenz ,  Keith E. Dawson

IPC分类号： F16L2105

CPC分类号： H01L21/67017 ,  H01L21/67126 ,  Y10S277/913

摘要： The invention relates to a fluid connector for sealing an interface between first and second fluid passages in a plasma processing apparatus. The fluid connector includes a first end member having a first geometry. The first geometry is arranged to substantially seal a first mating region of the first fluid passage. The fluid connector further includes a second end member having a second geometry. The second geometry is arranged to substantially seal a second mating region of the second fluid passage and the second geometry is configured differently than the first geometry. The fluid connector additionally includes an opening that extends through the first end member and the second end member through which a fluid may pass for use by the, semiconductor processing apparatus so as to fluidly couple the first fluid passage to the second fluid passage.

摘要翻译： 本发明涉及用于密封等离子体处理装置中的第一和第二流体通道之间的界面的流体连接器。 流体连接器包括具有第一几何形状的第一端部构件。 第一几何形状布置成基本上密封第一流体通道的第一配合区域。 流体连接器还包括具有第二几何形状的第二端部构件。 第二几何形状布置成基本上密封第二流体通道的第二配合区域，并且第二几何形状与第一几何形状不同。 流体连接器还包括一个开口，该开口延伸穿过第一端部构件和第二端部构件，流体可以通过该第二端构件通过半导体处理装置使其流动地连接到第二流体通道。

公开(公告)号：US06305677B1

公开(公告)日：2001-10-23

申请号：US09281595

申请日：1999-03-30

申请人： Eric H. Lenz

发明人： Eric H. Lenz

IPC分类号： B25B100

CPC分类号： H01L21/6831 ,  Y10T29/49998

摘要： The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.

摘要翻译： 本发明涉及一种用于在处理步骤之后从卡盘的表面提起基底的装置。 该装置包括用于将基板从卡盘的表面提升到第一位置的周边销，其中基板在提升期间设置在周边销上。 周边销被配置为克服在基板和表面的界面处的保持力。 通常，在处理步骤期间，在基板和表面之间产生保持力。 该装置还包括一个用于将基板从第一位置移动到第二位置的中心销，其中基板在移动期间设置在中心销上。 第二位置比第一位置更远离卡盘的表面。

公开(公告)号：US5569356A

公开(公告)日：1996-10-29

申请号：US445292

申请日：1995-05-19

申请人： Eric H. Lenz ,  Michael L. Calvisi ,  Ivo A. Miller ,  Robert A. Frazier

发明人： Eric H. Lenz ,  Michael L. Calvisi ,  Ivo A. Miller ,  Robert A. Frazier

IPC分类号： H05H1/46 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/00

CPC分类号： H01J37/32009 ,  H01J37/3244 ,  H01J37/32532

摘要： An electrode clamping assembly for a plasma reaction chamber wherein processing of a single wafer can be carried out. The electrode assembly includes a support member, an electrode such as a silicon showerhead electrode in the form of a disk having uniform thickness and a clamping ring which provides a resilient clamping force pressing against the showerhead electrode. The clamping member can be a ring of elastically deformable material and the clamping member can be tightened by a plurality of elastic spaced-apart bolts such that the clamping member is compressed and provides the resilient clamping force throughout temperature cycling of the electrode assembly during wafer processing. Heat conduction between the showerhead electrode and the support member can be improved by supplying pressurized process gas to a gap therebetween. The clamping member also provides plasma confinement in an area between the electrode and the wafer being processed.

摘要翻译： 一种用于等离子体反应室的电极夹紧组件，其中可以执行单个晶片的处理。 电极组件包括支撑构件，诸如具有均匀厚度的盘形式的硅喷头电极的电极和提供弹压夹紧力压靠喷头电极的夹紧环。 夹紧构件可以是可弹性变形材料的环，并且夹紧构件可以被多个弹性间隔开的螺栓紧固，使得夹紧构件被压缩并且在晶片处理期间在电极组件的整个温度循环期间提供弹性夹紧力 。 可以通过向其间的间隙供给加压工艺气体来改善喷头电极和支撑构件之间的热传导。 夹持构件还在电极和被处理的晶片之间的区域中提供等离子体约束。

公开(公告)号：US5534110A

公开(公告)日：1996-07-09

申请号：US099314

申请日：1993-07-30

申请人： Eric H. Lenz ,  Henry Brumbach

发明人： Eric H. Lenz ,  Henry Brumbach

IPC分类号： C23F4/00 ,  C23C16/458 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H01L21/687 ,  H05H1/00 ,  B25B5/00

CPC分类号： H01L21/68721 ,  C23C16/4585 ,  H01L21/67069 ,  H01J2237/32 ,  Y10S269/903 ,  Y10S414/141

摘要： A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

摘要翻译： 一种用于将晶片夹持在等离子体反应室中的晶片夹紧构件。 夹紧构件具有最小化晶片的颗粒污染的设计，并且在需要从夹紧构件清洁积聚物之前允许更多的晶片被加工。 夹紧构件包括夹紧部分，其夹持晶片的外周抵靠底部电极和阴影部分，该阴影部分在夹持部件的内边缘和晶片的上表面之间提供间隙。 该间隙对等离子体反应室的内部是开放的，并且优选地具有等于激活以在等离子体反应室中形成等离子体的气体的平均自由程的大约的高度。