利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

1543 条记录 (耗时 0.028 秒)

    Display device
    46.
    发明授权
    Display device 有权

    公开(公告)号：US11683958B2

    公开(公告)日：2023-06-20

    申请号：US17340236

    申请日：2021-06-07

    申请人： Samsung Display Co., LTD.

    发明人： Seung Chan Lee ,  Beom Soo Park ,  Wang Jo Lee ,  Jae Bum Cho ,  Jae Ik Lim

    IPC分类号： H01L27/14 ,  H10K59/121 ,  H10K59/131 ,  H01L27/12 ,  H01L29/786

    CPC分类号： H10K59/1213 ,  H10K59/1216 ,  H10K59/131 ,  H01L27/124 ,  H01L27/1225 ,  H01L27/1251 ,  H01L27/1255 ,  H01L29/7869 ,  H01L29/78675

    摘要： A display device includes: a substrate; a polycrystalline semiconductor layer which includes a first electrode, a channel, and a second electrode of a driving transistor disposed on the substrate; a first gate insulating layer disposed on the polycrystalline semiconductor layer; a gate electrode of the driving transistor which is disposed on the first gate insulating layer and overlaps the channel; a lower first scan line disposed on the first gate insulating layer; a second gate insulating layer disposed on the gate electrode and on the lower first scan line; a first lower boost electrode disposed on the second gate insulating layer; a first interlayer-insulating layer disposed on the first lower boost electrode; an oxide semiconductor layer disposed on the first interlayer-insulating layer and including a first upper boost electrode overlapping the first lower boost electrode; and a first connection electrode connecting the gate electrode and the first upper boost electrode.

    ELECTRONIC DEVICE ALLOWING LIGHT TO PASS THROUGH, ELECTRONIC MODULE
    48.
    发明公开
    ELECTRONIC DEVICE ALLOWING LIGHT TO PASS THROUGH, ELECTRONIC MODULE 审中-公开

    公开(公告)号：US20230170357A1

    公开(公告)日：2023-06-01

    申请号：US17976865

    申请日：2022-10-30

    申请人： InnoLux Corporation

    发明人： Chandra LIUS ,  Kuan-Feng LEE

    IPC分类号： H01L27/12 ,  H01L27/32

    CPC分类号： H01L27/1251 ,  H01L27/3234 ,  H01L27/3262 ,  H01L27/3272 ,  G06V40/1318

    摘要： An electronic device allowing a light to pass through and an electronic module are disclosed. The electronic device includes a substrate, a silicon semiconductor disposed on the substrate, a first conductive layer disposed on the silicon semiconductor, an oxide semiconductor disposed on the substrate, and a second conductive layer disposed on the oxide semiconductor. One of the first conductive layer and the second conductive layer comprises a first opening through which the light is allowed to pass. The electronic module includes the electronic device and a fingerprint sensor or an image sensor disposed underneath the electronic device and configured to receive the light.

    SUBSTRATE ASSEMBLY
    49.
    发明公开
    SUBSTRATE ASSEMBLY 审中-公开

    公开(公告)号：US20230169927A1

    公开(公告)日：2023-06-01

    申请号：US18155336

    申请日：2023-01-17

    申请人： InnoLux Corporation

    发明人： Kuan-Feng LEE ,  Yuan-Lin WU

    IPC分类号： G09G3/3266 ,  H01L27/12 ,  H01L23/544 ,  G06F3/041 ,  G06F3/044

    CPC分类号： G09G3/3266 ,  H01L27/124 ,  H01L23/544 ,  G06F3/0412 ,  H01L27/1225 ,  H01L27/1251 ,  G06F3/04164 ,  G06F3/044 ,  G09G2310/0297 ,  H01L2223/54426

    摘要： A substrate assembly includes a substrate having a first surface and a second surface opposite to the first surface. The substrate assembly includes a first conductive portion disposed on the first surface, and a second conductive portion disposed on the second surface. The substrate assembly includes a connective portion that is at least partially disposed in the substrate and penetrates from the first surface to the second surface. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The substrate assembly includes a processing unit disposed on the first surface, and an electronic element disposed on the second surface. The first conductive portion, the second conductive portion and the connective portion are overlapped with either of the processing unit or the electronic element, and the other of the processing unit or the electronic element is electrically connected to the first conductive portion.