公开(公告)号：US20210214838A1

公开(公告)日：2021-07-15

申请号：US16316164

申请日：2017-06-23

申请人： Siemens Aktiengesellschaft ,  Oerlikon Surface Solutions AG, Pfäffikon

发明人： Jürgen Ramm ,  Werner Stamm

IPC分类号： C23C14/08 ,  C23C28/00 ,  C23C14/32 ,  F01D5/28 ,  C23C14/34 ,  C23C14/14

摘要： Provided is a method for arranging a protective coating for a thermally stressed structure, having at least one layer of alpha-aluminium oxide or of element-modified alpha-aluminium oxide, and wherein the protective coating is applied by reactive cathodic arc vaporization. A protective coating produced by the method and a component having a protective coating is also provided.

公开(公告)号：US20210191215A1

公开(公告)日：2021-06-24

申请号：US17249641

申请日：2021-03-08

申请人： View, Inc.

发明人： Anshu A. Pradhan ,  Robert T. Rozbicki

IPC分类号： G02F1/1506 ,  C23C14/08 ,  C23C14/56 ,  C09K9/00 ,  G02F1/1523 ,  C23C14/34 ,  G02F1/155 ,  C23C14/14

摘要： Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices.

公开(公告)号：US11041982B2

公开(公告)日：2021-06-22

申请号：US16228184

申请日：2018-12-20

申请人： VIAVI Solutions Inc.

发明人： Georg J. Ockenfuss

IPC分类号： G02B5/20 ,  G02B5/28 ,  C23C14/06 ,  C23C14/35 ,  C23C14/58 ,  C23C14/14

摘要： An optical filter may include a substrate. An optical filter may include a set of optical filter layers disposed onto the substrate. The set of optical filter layers including a first subset of optical filter layers. The first subset of optical filter layers may include a silicon-germanium (SiGe) with a first refractive index. An optical filter may include a second subset of optical filter layers. The second subset of optical filter layers may include a material with a second refractive index. The second refractive index being less than the first refractive index.

公开(公告)号：US20210147989A1

公开(公告)日：2021-05-20

申请号：US17061165

申请日：2020-10-01

申请人： Lawrence Livermore National Security, LLC

发明人： Juergen Biener ,  Sneha Akhade ,  Monika Biener ,  Zhen Qi ,  Joel Varley ,  Stephen Weitzner ,  Vedasri Vedharathinam

IPC分类号： C25B11/04 ,  C23C14/35 ,  C23C14/30 ,  C25D3/58 ,  B05D1/02 ,  C23C14/14 ,  C25B1/00 ,  C22C9/01 ,  C22C9/04 ,  C22C9/02

摘要： A product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal. A method includes forming a product on a cathode. The product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal.

公开(公告)号：US10978699B2

公开(公告)日：2021-04-13

申请号：US16067075

申请日：2017-01-16

申请人： Applied Materials, Inc.

发明人： Subramanya P. Herle ,  Dieter Haas

IPC分类号： H01M4/36 ,  H01M4/38 ,  H01M4/587 ,  H01M4/62 ,  B32B27/08 ,  H01M4/13 ,  H01M4/139 ,  C23C14/56 ,  B32B27/28 ,  C23C14/14 ,  B32B15/08 ,  B32B7/04 ,  B32B27/34 ,  B32B15/09 ,  B32B27/30 ,  B32B15/082 ,  B32B27/36 ,  B32B7/06 ,  B32B15/04 ,  B32B27/40 ,  B32B15/085 ,  B32B27/32 ,  B32B15/088 ,  H01M4/04 ,  H01M4/133 ,  H01M4/134 ,  H01M4/1393 ,  H01M4/1395 ,  H01M10/0525 ,  H01M4/02

摘要： In one implementation, an integrated processing tool for the deposition and processing of lithium metal in energy storage devices. The integrated processing tool may be a web tool. The integrated processing tool may comprises a reel-to-reel system for transporting a continuous sheet of material through the following chambers: a chamber for depositing a thin film of lithium metal on the continuous sheet of material and a chamber for depositing a protective film on the surface of the thin film of lithium metal. The chamber for depositing a thin film of lithium metal may include a PVD system, such as an electron-beam evaporator, a thin film transfer system, or a slot-die deposition system. The chamber for depositing a protective film on the lithium metal film may include a chamber for depositing an interleaf film or a chamber for depositing a lithium-ion conducting polymer on the lithium metal film.

公开(公告)号：US20210102286A1

公开(公告)日：2021-04-08

申请号：US17099602

申请日：2020-11-16

申请人： FABRIC8LABS, INC.

发明人： David PAIN ,  Andrew EDMONDS ,  Jeffrey HERMAN ,  Charles PATEROS ,  Kareemullah SHAIK ,  Edward WHITE

IPC分类号： C23C16/04 ,  C23C14/04 ,  C23C16/27 ,  C25D17/00 ,  C25D5/10 ,  B33Y30/00 ,  C23C14/08 ,  C23C14/14

摘要： 3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US20210093322A1

公开(公告)日：2021-04-01

申请号：US17029385

申请日：2020-09-23

申请人： Ethicon LLC

发明人： Shane R. Adams ,  David C. Yates ,  Frederick E. Shelton, IV ,  Jason L. Harris

IPC分类号： A61B17/072 ,  A61L31/08 ,  A61B18/14 ,  C23C14/06 ,  C23C14/14 ,  C23C14/34

摘要： A method of coating a slip ring for use with a surgical instrument is disclosed. The method includes the steps of providing a slip ring including a plurality of conductive elements, and depositing a material less conductive than the conductive elements onto the conductive elements of the slip ring.

公开(公告)号：US20210062321A1

公开(公告)日：2021-03-04

申请号：US16632805

申请日：2019-04-19

申请人： SHENZHEN ACCOMTECH COMMUNICATION ELECTRONICS CO., LTD.

发明人： Tienan GUO ,  Tielong GUO ,  Guanglin XU ,  Yonggang TAN

IPC分类号： C23C14/24 ,  H01Q1/02 ,  H01Q1/36 ,  C23C14/14

摘要： The present disclosure discloses a manufacturing method of a wireless communication antenna, including: step S10, forming a surface metal layer on one side surface of a flexible thin film; step S20, patterning the surface metal layer to form a spiral type antenna; and step S30, vacuum depositing a metal on the other side surface of the flexible thin film to form an inner surface metal layer. The present disclosure realizes heat dissipation for various components in a portable terminal while realizing a better near field wireless communication.

公开(公告)号：US10914000B1

公开(公告)日：2021-02-09

申请号：US16926598

申请日：2020-07-10

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Edward White

IPC分类号： C23C16/04 ,  C23C14/14 ,  C23C14/04 ,  C23C16/27 ,  C23C14/08 ,  B33Y30/00 ,  C25D17/00 ,  C25D5/10 ,  B29C64/112 ,  B29C64/209

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US10900118B2

公开(公告)日：2021-01-26

申请号：US16261516

申请日：2019-01-29

申请人： IonQuest Corp.

发明人： Bassam Hanna Abraham ,  Roman Chistyakov

IPC分类号： C23C14/35 ,  C23C14/34 ,  H01J37/34 ,  H01L21/285 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01J37/32 ,  C23C14/00 ,  C23C14/06 ,  C23C14/14

摘要： A magnetically enhanced low temperature high density plasma chemical vapor deposition (LT-HDP-CVD) source has a hollow cathode target and an anode, which form a gap. A cathode target magnet assembly forms magnetic field lines substantially perpendicular to the cathode surface. A gap magnet assembly forms a magnetic field in the gap that is coupled with the cathode target magnetic field. The magnetic field lines cross the pole piece electrode positioned in the gap. The pole piece is isolated from ground and can be connected to a voltage power supply. The pole piece can have negative, positive, floating, or RF electrical potentials. By controlling the duration, value, and sign of the electric potential on the pole piece, plasma ionization can be controlled. Feed gas flows through the gap between the hollow cathode and anode. The cathode can be connected to a pulse power or RF power supply, or cathode can be connected to both power supplies. The cathode target and substrate can be inductively grounded.