公开(公告)号：US12000038B2

公开(公告)日：2024-06-04

申请号：US17863272

申请日：2022-07-12

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Kareemullah Shaik ,  Edward White

IPC分类号： C23C16/04 ,  B33Y30/00 ,  C23C14/04 ,  C23C14/08 ,  C23C14/14 ,  C23C16/27 ,  C25D5/10 ,  C25D17/00 ,  B29C64/112 ,  B29C64/209

CPC分类号： C23C16/042 ,  B33Y30/00 ,  C23C14/042 ,  C23C14/08 ,  C23C14/14 ,  C23C16/278 ,  C25D5/10 ,  C25D17/00 ,  B29C64/112 ,  B29C64/209

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US20220349046A1

公开(公告)日：2022-11-03

申请号：US17863272

申请日：2022-07-12

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Kareemullah Shaik ,  Edward White

IPC分类号： C23C16/04 ,  B33Y30/00 ,  C25D17/00 ,  C23C14/04 ,  C23C14/14 ,  C23C14/08 ,  C25D5/10 ,  C23C16/27

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US11313036B2

公开(公告)日：2022-04-26

申请号：US17535485

申请日：2021-11-24

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Edward White

IPC分类号： C23C16/04 ,  B33Y30/00 ,  C25D17/00 ,  C23C14/04 ,  C23C14/14 ,  C23C14/08 ,  C25D5/10 ,  C23C16/27 ,  B29C64/209 ,  B29C64/112

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US20240304440A1

公开(公告)日：2024-09-12

申请号：US18468554

申请日：2023-09-15

申请人： Fabric8Labs, Inc.

发明人： Ryan Nicholl ,  David Pain ,  Andrew Edmonds ,  Kareemullah Shaik ,  Edward White

IPC分类号： H01L21/02 ,  H01L21/311 ,  H01L21/48 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01L21/02274 ,  H01L21/02532 ,  H01L21/31116 ,  H01L21/486 ,  H01L21/67063 ,  H01L21/67253 ,  H01L21/6835 ,  B33Y10/00

摘要： Described herein are protected electrode arrays and methods of fabricating thereof. Such electrode arrays can be used in electrochemical-additive manufacturing (ECAM) systems and other systems/applications. In some examples, a protected electrode array comprises an electrode-interface circuit and an interposer bonded to the circuit, e.g., using an adhesive layer. The interposer can include an interposer base formed from silicon, glass, and other like materials suitable for operating environments. The interposer base comprises vias, which are aligned with the circuit's electrode connectors, and interposer electrodes deposited within these vias and electrically coupled to the electrode connectors. In some examples, the interposer comprises a base cover and/or electrode covers positioned over the interposer base and the interposer electrodes, respectively. The interposer can be bonded to the electrode-interface circuit before forming the vias, after forming the vias but before depositing the interposer electrodes, or after depositing the interposer electrodes within the vias.

公开(公告)号：US20220081761A1

公开(公告)日：2022-03-17

申请号：US17535485

申请日：2021-11-24

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Edward White

IPC分类号： C23C16/04 ,  B33Y30/00 ,  C25D17/00 ,  C23C14/04 ,  C23C14/14 ,  C23C14/08 ,  C25D5/10 ,  C23C16/27

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

公开(公告)号：US10914000B1

公开(公告)日：2021-02-09

申请号：US16926598

申请日：2020-07-10

申请人： FABRIC8LABS, INC.

发明人： David Pain ,  Andrew Edmonds ,  Jeffrey Herman ,  Charles Pateros ,  Edward White

IPC分类号： C23C16/04 ,  C23C14/14 ,  C23C14/04 ,  C23C16/27 ,  C23C14/08 ,  B33Y30/00 ,  C25D17/00 ,  C25D5/10 ,  B29C64/112 ,  B29C64/209

摘要： Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.