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公开(公告)号：US20200027693A1
公开(公告)日：2020-01-23
申请号：US16517390
申请日：2019-07-19
Applicant: ASML Netherlands B.V.
IPC: H01J37/22 , G01N21/95 , G01N21/956 , H01J37/28 , H01J37/14 , H01J37/147 , H01J37/244
Abstract: A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.
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公开(公告)号：US10534271B2
公开(公告)日：2020-01-14
申请号：US16477955
申请日：2017-12-04
Applicant: ASML NETHERLANDS B.V.
Inventor： Pieter Jeroen Johan Emanuel Hoefnagels , Ronald Frank Kox , John Maria Bombeeck , Johannes Cornelis Paulus Melman , Ruud Hendrikus Martinus Johannes Bloks , Patricius Jacobus Neefs
Abstract: A device manufacturing method includes: confining a liquid to an immersion space between a projection system and an object; starting application of an underpressure to an extraction unit to remove fluid from a position proximate an edge of the object before the immersion space moves onto the object; moving the support table along a route comprising a series of motions such that a plurality of target positions on the object pass under the projection system; projecting through the immersion space a beam onto the target portions as the target portions pass under the projection system, the projecting performed to account for a certain predetermined thermal profile in the object; and stopping application of the underpressure at a predetermined time after the immersion space moves off the object for the last time during the series of motions to at least partly induce the certain predetermined thermal profile in the object.
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公开(公告)号：US10534270B2
公开(公告)日：2020-01-14
申请号：US16269745
申请日：2019-02-07
Applicant: ASML Netherlands B.V.
Inventor： Norbertus Josephus Martinus Van den Nieuwelaar , Victor Manuel Blanco Carballo , Casper Roderik De Groot , Rolf Hendrikus Jacobus Custers , David Merritt Phillips , Frederik Antonius Van der Zanden , Pieter Lein Joseph Gunter , Erik Henricus Egidius Catharina Eummelen , Yuri Johannes Gabriël Van de Vijver , Bert Dirk Scholten , Marijn Wouters , Ronald Frank Kox , Jorge Alberto Vieyra Salas
Abstract: An immersion lithography apparatus has a controller configured to control a substrate table to move along an exposure route including in order: an entry motion in which the substrate moves from an off-substrate position at which the immersion space does not overlap the substrate to an on-substrate position at which the immersion space at least partially overlaps the substrate, a transfer motion in which the substrate table changes speed and/or direction and moves for at least a transfer time after the substrate moves to the on-substrate position, and an expose motion in which the substrate is scanned and the patterned beam is projected onto the substrate, wherein throughout the transfer motion at least a part of the immersion space overlaps the substrate and wherein the patterned beam is not projected onto the substrate during the entry motion and the transfer motion.
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公开(公告)号：US20200015343A1
公开(公告)日：2020-01-09
申请号：US16572131
申请日：2019-09-16
Applicant: ASML Netherlands B.V.
Inventor： Georgiy VASCHENKO , Peter BAUMGART , Chirag RAJYAGURU , Benjamin SAMS , Armin RIDINGER , Janine KARDOKUS
IPC: H05G2/00
Abstract: A deoxidation system for purifying target material for an EUV light source includes a furnace having a central region and a heater for heating the central region in a uniform manner. A vessel is inserted in the central region of the furnace, and a crucible is disposed within the vessel. A closure device covers an open end of the vessel to form a seal having vacuum and pressure capability. The system also includes a gas input tube, a gas exhaust tube, and a vacuum port. A gas supply network is coupled in flow communication with an end of the gas input tube and a gas supply network is coupled in flow communication with an end of the gas exhaust tube. A vacuum network is coupled in flow communication with one end of the vacuum port. A method and apparatus for purifying target material also are described.
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公开(公告)号：US20200012198A1
公开(公告)日：2020-01-09
申请号：US16575711
申请日：2019-09-19
Applicant: ASML NETHERLANDS B.V.
Inventor： Arie Jeffrey DEN BOEF , Kaustuve BHATTACHARYYA
IPC: G03F7/20 , G01N21/47 , G01N21/956
Abstract: A method including: obtaining a measurement of a metrology target on a substrate processed using a patterning process, the measurement having been obtained using measurement radiation; and deriving a parameter of interest of the patterning process from the measurement, wherein the parameter of interest is corrected by a stack difference parameter, the stack difference parameter representing an un-designed difference in physical configuration between adjacent periodic structures of the target or between the metrology target and another adjacent target on the substrate.
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Patent Agency Ranking
公开(公告)号：US10527958B2
公开(公告)日：2020-01-07
申请号：US16132520
申请日：2018-09-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Patricius Aloysius Jacobus Tinnemans , Edo Maria Hulsebos , Henricus Johannes Lambertus Megens , Sudharshanan Raghunathan , Boris Menchtchikov , Ahmet Koray Erdamar , Loek Johannes Petrus Verhees , Willem Seine Christian Roelofs , Wendy Johanna Martina Van De Ven , Hadi Yagubizade , Hakki Ergün Cekli , Ralph Brinkhof , Tran Thanh Thuy Vu , Maikel Robert Goosen , Maaike Van't Westeinde , Weitian Kou , Manouk Rijpstra , Matthijs Cox , Franciscus Godefridus Casper Bijnen
Abstract: A method for determining one or more optimized values of an operational parameter of a sensor system configured to measure a property of a substrate is disclosed. The method includes: determining a quality parameter for a plurality of substrates; determining measurement parameter values for the plurality of substrates using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameter values; and determining the one or more optimized values of the operational parameter based on the comparing.
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公开(公告)号：US10527957B2
公开(公告)日：2020-01-07
申请号：US15778517
申请日：2016-10-27
Applicant: ASML NETHERLANDS B.V.
Inventor： Cayetano Sanchez-Fabres Cobaleda , Franciscus Godefridus Casper Bijnen , Edo Maria Hulsebos , Arie Jeffrey Den Boef , Marcel Hendrikus Maria Beems , Piotr Michał Stolarz
Abstract: A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.
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公开(公告)号：US10527953B2
公开(公告)日：2020-01-07
申请号：US15706625
申请日：2017-09-15
Applicant: ASML NETHERLANDS B.V.
Abstract: A method including evaluating a plurality of substrate measurement recipes for measurement of a metrology target processed using a patterning process, against stack sensitivity and overlay sensitivity, and selecting one or more substrate measurement recipes from the plurality of substrate measurement recipes that have a value of the stack sensitivity that meets or crosses a threshold and that have a value of the overlay sensitivity within a certain finite range from a maximum or minimum value of the overlay sensitivity.
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公开(公告)号：US20200004163A1
公开(公告)日：2020-01-02
申请号：US16558265
申请日：2019-09-02
Applicant: ASML NETHERLANDS B.V.
Inventor： Carolus Johannes Catharina SCHOORMANS , Petrus Franciscus VAN GILS , Johannes Jacobus Matheus BASELMANS
Abstract: A measurement method comprising using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders per illumination pole through the projection system, using the projection system to project the diffraction orders onto a grating on a wafer such that a pair of combination diffraction orders is formed by diffraction of the diffraction orders, coupling the combination diffraction orders back through the projection system to detectors configured to measure the intensity of the combination diffraction orders, and using the measured intensity of the combination diffraction orders to measure the position of the wafer grating.
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公开(公告)号：US20200004162A1
公开(公告)日：2020-01-02
申请号：US16570382
申请日：2019-09-13
Applicant: ASML NETHERLANDS B.V.
Inventor： Erik Henricus Egidius Catharina EUMMELEN , Giovanni Luca GATTOBIGIO , Johannes Cornelis Paulus MELMAN , Han Henricus Aldegonda LEMPENS , Miao YU , Cornelius Maria ROPS , Ruud OLIESLAGERS , Arturnç ULUCAN , Theodorus Wilhelmus POLET , Patrick Johannes Wilhelmus SPRUYTENBURG
IPC: G03F7/20 , H01L21/027
Abstract: An immersion lithographic apparatus having a fluid handling structure, the fluid handling structure configured to confine immersion fluid to a region and including: a meniscus controlling feature having an extractor exit on a surface of the fluid handling structure; and a gas knife system outwards of the extractor exit and including passages each having an exit, the passages having a plurality of first passages having a plurality of corresponding first exits on the surface, and a plurality of second passages having a plurality of corresponding second exits outwards of the first exits on the surface, wherein the surface faces and is substantially parallel to a top surface of a substrate during exposure, and the first exits and the second exits are arranged at a greater distance from the substrate than the extractor exit.
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