Abstract:
A semiconductor fabrication apparatus which includes a collimator made of a net type heating material which generates Joule heating when electric power is supplied thereto. The apparatus includes a negative electrode having a metallic target, a positive electrode arranged opposite the negative electrode, on which positive electrode a semiconductor substrate is mounted, and the collimator being mounted between the negative electrode and the positive electrode and near the semiconductor substrate, with the collimator being made of a net type heating material and designed so that Joule heating is generated therein when a current is applied thereto.
Abstract:
A process for the isolation of a semiconductor layer on an insulator. A process for isolating a semiconductor layer on an insulator is disclosed that includes the steps of: forming a first insulating layer on a semiconductor substrate, and opening a window by etching the first insulating layer which becomes an epitaxial growth seed; depositing a semiconductor layer and growing an epitaxial layer which has the same crystal structure as the semiconductor substrate under the window; forming an active area of the epitaxial layer by a photolithographic process; forming a second insulating layer on and at the side of the active area and on the first insulating layer; and isolating an active area from the semiconductor layer by forming a third insulator layer in the window by an oxidation process.
Abstract:
A metal wiring for semiconductor devices having a double-layer passivation film structure consisting of an intermetallic compound layer formed on a copper thin film and made of a metal reacting with copper to form an intermetallic compound and a metal nitride layer formed over the intermetallic compound. This double-layer passivation film structure is obtained by depositing a metal layer, capable of reacting with copper to form an intermetallic compound, over the copper wiring, and annealing the metal layer in a nitrogen atmosphere, thereby forming an intermetallic compound layer over the copper wiring. By virtue of the double-layer passivation film structure, the copper wiring has a great improvement in the reliability. A metal silicide layer is formed between a diffusion region and a diffusion barrier layer in the contact hole of the semiconductor device. The diffusion barrier layer, which is formed on an insulating layer doped with nitrogen ions, is changed into a metal nitride film. Accordingly, a reduced ohmic contact resistance and an improved passivation reliability are achieved.
Abstract:
A MOSFET in accordance with this invention includes: a metal silicide layer formed on a impurity region and on the upper surface of a gate electrode; a metal silicide nitride layer formed on the metal silicide layer; and a metal nitride layer formed on the metal silicide nitride layer. The process for formation of a conductive layer includes the steps of: (a) forming an impurity region in a semiconductor substrate; (b) forming a metal layer on the impurity region; (c) carrying out a heat treatment under an inert gas atmosphere to form a metal silicide of metastable phase; and (d) carrying out a heat treatment under an nitrogen gas atmosphere so as for the metal silicide of the metastable phase to be phase-transited to a stable phase.
Abstract:
A method for isolating semiconductor regions so that unit elements may be electrically insulated. A disclosed method includes the steps of: forming a pad oxide layer and a nitride layer on a silicon substrate, and forming an active region pattern; exposing the pad oxide to HF to remove a portion of the pad oxide, and depositing polysilicon so that pad oxide as the path for the diffusion of oxygen during the oxidation is not exposed to the oxidizing atmosphere; forming a nitride layer side wall on the side of field region to increase the distance between field oxide region and active region; and carrying out a field channel stop ion implantation after the completion of the first field oxidation and after removing the side wall of nitride layer and before a second field oxidation process.
Abstract:
A method for isolating elements in a silicon semiconductor device is disclosed. The invention discloses the steps of: (1) forming a thermal silicon oxide layer on a silicon substrate, depositing a layer of polysilicon, and depositing a first silicon nitride layer thereon, (2) patterning an active region and a field region, and etching the thermal oxidation layer, the polysilicon layer and the first silicon nitride layer on the field region to forth an active region pattern, (3) depositing a second silicon nitride layer, and, thereupon, depositing a silicon oxide layer, (4) etching back the oxide layer by application of a reactive ion etch technique, forming a silicon oxide side wall on the side of the active region pattern, and etching back the second silicon nitride layer using the oxide side wall as a mask to expose the silicon substrate, (5) removing the oxide side wall, and performing a channel stop field ion implantation, and (6) performing a field oxidation process to form a field oxide layer.
Abstract:
A dual modem device includes a first processor to communicate with a first network and a second processor to communicate with a second network. The first processor includes a USB module to transceive a signal with a computer side using a universal serial bus (USB) interface, a first packet control block to determine a type of the signal transceived via the USB module and to decide a communication path, and a first function block to process a signal associated with the first network. The second processor includes a first control block to process a control signal for the first processor, a second control block to process a control signal for the second processor, and a second function block to process a signal associated with the second network.
Abstract:
A method of indicating downlink traffic to a mobile subscriber station that is in a sleep mode includes transmitting a sleep request message to a base station (BS); entering the sleep mode in response to a sleep response message received from the BS, wherein the sleep response message includes a first SLPID; receiving a traffic indication message including a FMT field indicating formats for the traffic indication message from the BS during a listening interval of the sleep mode, wherein the FMT field indicates one of an SLPID bitmap based format and an SLPID based format, and the traffic indication message further includes a second SLPID when the SLPID based format is used; and terminating the sleep mode to receive the downlink traffic when the second SLPID in the traffic indication message is same as the first SLPID included in the sleep response message.
Abstract:
A method of indicating downlink traffic to a mobile subscriber station that is in a sleep mode includes transmitting a sleep request message to a base station (BS); entering the sleep mode in response to a sleep response message received from the BS, wherein the sleep response message includes a first SLPID; receiving a traffic indication message including a FMT field indicating formats for the traffic indication message from the BS during a listening interval of the sleep mode, wherein the FMT field indicates one of an SLPID bitmap based format and an SLPID based format, and the traffic indication message further includes a second SLPID when the SLPID based format is used; and terminating the sleep mode to receive the downlink traffic when the second SLPID in the traffic indication message is same as the first SLPID included in the sleep response message.
Abstract:
A method of supporting operation of sleep mode in a wideband radio access system is disclosed. More specifically, a mobile subscriber station (MSS) which determines a frame offset information for synchronizing listening windows of at least one MSS that is in sleep mode, and transmits the determined framed offset information to at least one MSS.