公开(公告)号：US07224050B2

公开(公告)日：2007-05-29

申请号：US11138203

申请日：2005-05-25

Applicant: James C. Matayabas, Jr. ,  Leonel R. Arana ,  Stephen E. Lehman, Jr.

Inventor： James C. Matayabas, Jr. ,  Leonel R. Arana ,  Stephen E. Lehman, Jr.

IPC: H01L23/29

CPC classification number: H01L23/293 ,  C08L101/005 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10S430/128 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.

Abstract translation: 描述了集成电路封装及其制造，其中封装包括树状聚合物或超支化聚合物。 在一些实施方案中，树枝状聚合物或超支化聚合物包括具有一个或多个环结构并具有与塑料的一种或多种组分反应的表面基团的重复单元。 在一些实施方案中，树枝状聚合物或超支化聚合物具有小于集成电路的工作温度的玻璃化转变温度并且形成至少部分分离的相。

公开(公告)号：US06841867B2

公开(公告)日：2005-01-11

申请号：US10334241

申请日：2002-12-30

Applicant: James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

Inventor： James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

IPC: H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L23/10 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

Abstract translation: 包含至少一种乙烯基封端的聚合物的组合物; 至少一个包含末端Si-H单元的交联剂的量; 一定量的至少一种导热第一填料和至少一种导热第二填料，其中第一填料的熔点大于第二填料的熔点。 一种包括被配置为与印刷电路板匹配的封装的设备; 耦合到所述封装的半导体器件; 热元件; 以及设置在所述热元件和所述半导体器件之间的可固化热敏材料。

公开(公告)号：US06469379B1

公开(公告)日：2002-10-22

申请号：US09823106

申请日：2001-03-30

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: H01L2330

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02 ,  C08L83/04 ,  H01L2224/32245 ,  H01L2924/3011 ,  C08L83/00

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil; at least one conductive filler; and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.

Abstract translation: 可用作热物质的可固化材料包括至少一种乙烯基封端的硅油; 至少一种导电填料; 和至少一种氢封端的硅油。 氢封端的硅油用于降低固化的热界面材料的剪切模量G'。

公开(公告)号：US5652328A

公开(公告)日：1997-07-29

申请号：US489091

申请日：1995-08-17

Applicant: Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

Inventor： Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

IPC: C08G65/28 ,  C08G65/02 ,  C08G65/12 ,  C08G65/14 ,  C08G65/26

CPC classification number: C08G65/269 ,  C08G65/12 ,  C08G65/14

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an onium iodide compound such as an ammonium or phosphonium iodide, an organotin compound such as a trihydrocarbyltin iodide, and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.75 and up to 0.98, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了通过在碘鎓化合物如碘化铵或碘化鏻，有机锡化合物如三烃基碘化物和亲核起始物的存在下，通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物 复合。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2-70，m /（n + m）大于0.75，最高为0.98， 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）

公开(公告)号：USH1669H

公开(公告)日：1997-07-01

申请号：US742396

申请日：1996-11-04

Applicant: James C. Matayabas, Jr. ,  James T. Tanner, III ,  Robert M. Finch

Inventor： James C. Matayabas, Jr. ,  James T. Tanner, III ,  Robert M. Finch

IPC: C08G63/672 ,  C08G63/66

CPC classification number: C08G63/672

Abstract: A segmented copolyester-ether polymer comprises 9.5 to 33 percent by weight hard segment residues of polybutylene terephthalate and 0.5 to 67 percent by weight soft segment residues of a polyether polyol comprised of n units of residue (1) and m units of residue (2), wherein the total value of n+m is in the range 2 to 70, m/(n+m) is in the range 0.05 to 0.98, and residues (1) and (2) have the structures: ##STR1## The polyether polyol is further characterized in that at least 95 percent of the hydroxyl groups are primary hydroxyl groups.

Abstract translation: 分段的共聚酯 - 醚聚合物包含9.5至33重量％的聚对苯二甲酸丁二醇酯的硬链段残基和0.5至67重量％的由n个残基（1）单元和m个残基（2）组成的聚醚多元醇的软链段残基， ，其中n + m的总值在2〜70的范围内，m /（n + m）在0.05〜0.98的范围内，残基（1）和（2）的结构如下：聚醚 多元醇的特征还在于至少95％的羟基是伯羟基。

公开(公告)号：US5536809A

公开(公告)日：1996-07-16

申请号：US554999

申请日：1995-11-13

Applicant: James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

Inventor： James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

IPC: C08G65/14 ,  C08G65/20 ,  C08G65/28 ,  C08G65/322 ,  C08G65/08

CPC classification number: C08G65/14 ,  C08G65/20 ,  C08G65/322

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of tetrahydrofuran, an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise m units of residue (1), n units of residue (2), and p units of residue (3) wherein (i) residues (1), (2) and (3) have the structures: ##STR1## (ii) the total value of m+n+p is 5 to 70; (iii) the value of n/(m+n+p) is in the range of 0.2 to 0.4, i.e., residue (2) constitutes from 20 to 40 mole percent of the total moles of residues (1), (2) and (3); and (iv) at least 98 percent of the terminal groups have the structure: ##STR2##

Abstract translation: 公开了在四氢呋喃，酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合得到的新型聚醚化合物。 聚醚化合物包括m个残基（1），n个残基（2）单元和p个残基（3）单元，其中（i）残基（1），（2）和（3）具有以下结构：