公开(公告)号：US20050239120A1

公开(公告)日：2005-10-27

申请号：US11114070

申请日：2005-04-26

Applicant: Tae-sik Park ,  Jung-ho Kang ,  Jong-hwa Won ,  Young-il Kim ,  Moon-chul Lee

Inventor： Tae-sik Park ,  Jung-ho Kang ,  Jong-hwa Won ,  Young-il Kim ,  Moon-chul Lee

IPC: G01N22/00 ,  C12M1/00 ,  C12M1/34 ,  C12N15/09 ,  C12Q1/68 ,  G01N27/02 ,  G01N27/22 ,  G01N27/327 ,  G01N33/543 ,  G01R33/00

CPC classification number: G01N27/3275 ,  G01N33/48792

Abstract: An apparatus and method of detecting bio molecular by measuring a variation of an electrical characteristic of a circuit having an inductance device and a capacitance device. The bio molecular detection method comprises providing a signal converting unit having at least one inductance device and at least one capacitance device connected with each other, disposing a biochip, which has capturing probe biomolecules attached to a substrate, at a location in the signal converting unit, and measuring an electrical characteristic of the signal converting unit, performing a coupling reaction of the biochip and a sample to be analyzed; and measuring an electrical characteristic of the signal converting unit after the coupling reaction.

Abstract translation: 通过测量具有电感器件和电容器件的电路的电特性的变化来检测生物分子的装置和方法。 所述生物分子检测方法包括提供信号转换单元，所述信号转换单元具有至少一个电感器件和至少一个电容器件，所述至少一个电容器件彼此连接，在所述信号转换单元中的位置处设置生物芯片，所述生物芯片具有连接到衬底的捕获探针生物分子 测量信号转换单元的电特性，进行生物芯片与待分析样品的偶联反应; 并测量耦合反应后的信号转换单元的电特性。

公开(公告)号：US06835594B2

公开(公告)日：2004-12-28

申请号：US10686769

申请日：2003-10-17

Applicant: Ci-moo Shong ,  Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jong-seok Kim ,  Chan-bong Jun ,  Seog-woo Hong ,  Jung-ho Kang

Inventor： Ci-moo Shong ,  Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jong-seok Kim ,  Chan-bong Jun ,  Seog-woo Hong ,  Jung-ho Kang

IPC: H01L2144

CPC classification number: B81B7/0006 ,  H01L21/76877 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-mealing the deposited thin metal film. By the ion-mealing, the method is capable of connecting a metal wiring to a via hole having an undercut.

公开(公告)号：US09246468B2

公开(公告)日：2016-01-26

申请号：US13592821

申请日：2012-08-23

Applicant: Sang Uk Son ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

Inventor： Sang Uk Son ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

IPC: H03H9/02 ,  H03H9/17 ,  H03H9/10 ,  H03H9/56 ,  H03H9/58

CPC classification number: H03H9/02102 ,  H03H9/02149 ,  H03H9/1014 ,  H03H9/173 ,  H03H9/564 ,  H03H9/587 ,  Y10T29/42

Abstract: Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include a first electrode, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer. In various aspects, at least one of the first electrode, the piezoelectric layer, and the second electrode are formed of a carbon-based material.

Abstract translation: 提供了一种体声波谐振器（BAWR）。 BAWR可以包括第一电极，设置在第一电极上的压电层，设置在压电层上的第二电极。 在各个方面，第一电极，压电层和第二电极中的至少一个由碳基材料形成。

公开(公告)号：US20130140959A1

公开(公告)日：2013-06-06

申请号：US13691114

申请日：2012-11-30

Applicant: Jea Shik SHIN ,  Duck Hwan KIM ,  Chul Soo KIM ,  Sang Uk SON ,  In Sang SONG ,  Moon Chul LEE

Inventor： Jea Shik SHIN ,  Duck Hwan KIM ,  Chul Soo KIM ,  Sang Uk SON ,  In Sang SONG ,  Moon Chul LEE

IPC: H03H9/17 ,  H03H3/02

CPC classification number: H03H9/173 ,  H03H3/02 ,  H03H9/02118 ,  H03H2003/021 ,  Y10T29/42

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract translation: 公开了一种体声波谐振器（BAWR）。 BAWR包括具有第一电极，第二电极和压电层的体声波谐振单元。 压电层设置在第一电极和第二电极之间。 空气边缘形成在距离体声波谐振单元的中心一定距离处。

公开(公告)号：US08282196B2

公开(公告)日：2012-10-09

申请号：US12058946

申请日：2008-03-31

Applicant: Il Woo Kim ,  Byung Ha Park ,  Moon Chul Lee ,  Dong Sik Shim ,  Kyong Il Kim

Inventor： Il Woo Kim ,  Byung Ha Park ,  Moon Chul Lee ,  Dong Sik Shim ,  Kyong Il Kim

IPC: B41J2/05

CPC classification number: B41J2/1601 ,  B33Y80/00 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639

Abstract: A MEMS (Micro Electro Mechanical System) device and a method of manufacturing the same, in which an detection indicator is formed on a chamber layer stacked on a substrate such that a user easily inspects whether the chamber layer has a required thickness. The MEMS device can include two detection indicators that are formed on the chamber layer and have different depth from each other, or an detection indicator which is formed on the chamber layer and has a tapered sectional shape in which an upper surface of the detection indicator is gradually narrowed in a downward direction such that a user can easily inspect whether the chamber layer has a required thickness. The user can precisely determine whether the chamber layer is planarized to a required thickness by planarizing the detection indicator formed on the chamber layer, and inspecting the detection indicator by using an optical microscope, thereby facilitating inspection for a thickness of the chamber layer.

Abstract translation: 一种MEMS（微机电系统）装置及其制造方法，其中在层叠在基板上的室层上形成检测指示器，使得用户容易地检查室层是否具有所需的厚度。 MEMS器件可以包括形成在室层上并具有彼此不同深度的两个检测指示器，或者形成在腔室层上并具有锥形截面形状的检测指示器，其中检测指示器的上表面是 在向下的方向上逐渐变窄，使得使用者可以容易地检查腔室层是否具有所需的厚度。 用户可以通过平坦化形成在室层上的检测指示器，并且通过使用光学显微镜检查检测指示器来精确地确定室层是否被平坦化到所需厚度，从而便于检查室层的厚度。

公开(公告)号：US07810911B2

公开(公告)日：2010-10-12

申请号：US11742816

申请日：2007-05-01

Applicant: Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

Inventor： Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

IPC: B41J2/05

CPC classification number: B41J2/14129 ,  B41J2/14072

Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.

Abstract translation: 热喷墨打印头包括分别施加有外部电压的多个接合焊盘，分别连接到每个接合焊盘的多个公共电线，分别连接到每个公共电线的多个单独电线，以及 加热器分别连接到各个电线，以通过加热墨水来产生墨水气泡，其中每个公共电线包括形成在第一金属层上的第一金属层和第一金属凸块。

公开(公告)号：US07795011B2

公开(公告)日：2010-09-14

申请号：US11188000

申请日：2005-07-25

Applicant: Tae-sik Park ,  Sung-hee Lee ,  Jung-ho Kang ,  Young-il Kim ,  Moon-chul Lee

Inventor： Tae-sik Park ,  Sung-hee Lee ,  Jung-ho Kang ,  Young-il Kim ,  Moon-chul Lee

IPC: C12M1/34 ,  C12M3/00 ,  C02F9/00

CPC classification number: B01L3/50273 ,  B01L3/502715 ,  B01L2200/10 ,  B01L2300/049 ,  B01L2400/049 ,  B01L2400/06

Abstract: A bio sample processing apparatus and method using vacuum chambers in which a bio sample is injected into a first vacuum chamber connected with one end of a bio processor and, after processing, is ejected into a second vacuum chamber connected with the other end of the bio processor. The vacuum chambers and bio processor are connected with each other to form an environment with a pressure lower than atmospheric pressure, and the bio sample moves toward the second vacuum chamber due to the pressure difference created by the injection of the bio sample into the first vacuum chamber.

Abstract translation: 一种使用真空室的生物样品处理装置和方法，其中将生物样品注入与生物处理器的一端连接的第一真空室中，并且在处理之后被喷射到与生物的另一端连接的第二真空室中 处理器。 真空室和生物处理器彼此连接以形成压力低于大气压的环境，并且生物样品由于将生物样品注入第一真空产生的压差而向第二真空室移动 房间。

公开(公告)号：US07755151B2

公开(公告)日：2010-07-13

申请号：US11415099

申请日：2006-05-02

Applicant: Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

Inventor： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

IPC: H01L29/82 ,  H01L23/04 ,  H01L21/00

CPC classification number: H03H9/1092

Abstract: A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

Abstract translation: 用于声表面波器件的晶片级封装及其制造方法包括在器件晶片的上表面上形成有SAW元件的SAW器件; 接合在所述SAW元件的上部的盖晶片; 在所述盖晶片和所述SAW器件之间容纳所述SAW元件的空腔部; 帽盖，形成在盖晶片的上表面上; 以及金属线，其形成为穿透盖晶片以电连接帽垫和SAW元件，器件晶片和盖晶片由相同的材料制成。

公开(公告)号：US20100171793A1

公开(公告)日：2010-07-08

申请号：US12544422

申请日：2009-08-20

Applicant: Yong-won JEONG ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

Inventor： Yong-won JEONG ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

IPC: B41J2/14

CPC classification number: B41J2/14129 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631

Abstract: An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.

Abstract translation: 喷墨打印头的供墨孔及其形成方法包括穿透基板并具有在基板的上方向上变窄的宽度的供墨孔，其中，墨供给孔的至少一个内壁具有多个 相对于基板的表面的台阶和倾斜。

公开(公告)号：US20090273647A1

公开(公告)日：2009-11-05

申请号：US12274456

申请日：2008-11-20

Applicant: Myong Jong KWON ,  Sung Joon Park ,  Moon Chul Lee

Inventor： Myong Jong KWON ,  Sung Joon Park ,  Moon Chul Lee

IPC: B41J2/05 ,  B23P17/00

CPC classification number: B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2002/14387 ,  Y10T29/49401

Abstract: An inkjet print head includes a substrate formed with a feed hole through which ink is transferred, and a notch prevention layer covering an area on the substrate where the feed hole is to be formed. Plasma electrons flown into the feed hole while the hole is formed on the substrate through dry etching can move through the notch prevention layer. As a result, corrosion of the substrate around the feed hole by the electrons can be prevented, thereby achieving a uniform width of the feed hole.

Abstract translation: 喷墨打印头包括形成有用于传送油墨的进料孔的基板和覆盖基板上要形成进料孔的区域的缺口防止层。 等离子体电子通过干蚀刻在衬底上形成孔时流入进料孔，可以通过缺口防止层移动。 结果，可以防止通过电子对馈电孔周围的基板的腐蚀，从而实现进给孔的均匀宽度。