Abstract:
Provided is a method for tracking a lost mobile station. The method includes, when a replacement Subscriber Identity Module (SIM) card is installed, determining whether the replacement SIM card is registered as a licensed replacement SIM card; when the SIM card is not registered, transmitting a previously stored tracking short message to a preset destination; and upon receipt of a tracking response short message, setting a tracking lock mode for limiting use of some functions of the mobile station.
Abstract:
The present invention relates to a high voltage transistor and method of manufacturing the same. The high voltage transistor includes: a channel region which is formed in a semiconductor substrate; a gate insulating film which is formed on the channel region of the semiconductor substrate; a low concentration source region and a low concentration drain region having the channel region interposed therebetween and each being formed in the semiconductor substrate; a high concentration source region which is formed to be spaced away from the channel region by a first distance; a high concentration drain region which is formed to be spaced away from the channel region by a second distance that is larger than the first distance; a gate electrode which has a gate bottom portion interfacing with the gate insulating film over the channel region, and a gate top portion integrated with the gate bottom portion and protruding by a predetermined length from a top of the gate bottom portion to extend over the low concentration drain region; a first metal silicide layer which is formed on the high concentration source region; and a second metal silicide layer which is formed on the high concentration drain region.
Abstract:
An electrically erasable and programmable read only memory (EEPROM) is fabricated by forming isolation patterns defining active regions in predetermined regions of a semiconductor substrate including a memory transistor region and a selection transistor region. A gate insulating layer having tunnel regions is formed on the active regions. A first conductive layer is formed on the resultant structure having the gate insulating layer. The first conductive layer is patterned to form openings exposing top surfaces of the isolation patterns. The patterning takes place such that a distance between a selected opening and the active region adjacent the opening varies depending on the width of the isolation pattern disposed under the opening. Related EEPROM devices are also disclosed.
Abstract:
The present invention discloses a home network system using a living network control protocol. The home network system includes: an electric device having at least two heterogeneous function means; a network based on a predetermined protocol; and a network manager for controlling and/or monitoring the electric device through the network, the electric device including a packet processing device having one node address provided by the network manager, generating a packet having the node address, transmitting the packet to the network manager, address from the network manager, and enabling the heterogeneous function means corresponding to a command included in the packet to execute the command.
Abstract:
In a local-length nitride SONOS device and a method for forming the same, a local-length nitride floating gate structure is provided for mitigating or preventing lateral electron migration in the nitride floating gate. The structure includes a thin gate oxide, which leads to devices having a lower threshold voltage. In addition, the local-length nitride layer is self-aligned, which prevents nitride misalignment, and therefore leads to reduced threshold voltage variation among the devices.
Abstract:
Provided is a phase-change RAM containing a substrate, a lower electrode, a phase-change material, an upper electrode and a thermal dissipation layer, wherein the thermal dissipation layer contains an aluminum-nitride thermal dissipation layer having a high heat conductivity, and the lower electrode contains a titanium-nitride electrode which generates a great amount of heat generated using a small amount of current and has a low heat conductivity, whereby heat generated between the phase-change material and the electrode is not transferred to the interior of a device but fast dissipated to the exterior thereof, so as to enable a high speed operation using low current and improve reliability of the device.
Abstract:
A method of manufacturing an EEPROM cell includes growing a first oxide layer on a semiconductor substrate; forming a first conductive layer on the first oxide layer; forming a first conductive pattern and a tunneling oxide layer by patterning the first conductive layer and the first oxide layer, the tunneling oxide layer being disposed under the first conductive pattern; forming a gate oxide layer on sidewalls of the first conductive pattern and the substrate and forming a second conductive pattern on both sides of the first conductive pattern; forming a conductive layer for a floating gate by electrically connecting the first conductive pattern to the second conductive pattern; forming a coupling oxide layer on the conductive layer for the floating gate; forming a third conductive layer on the coupling oxide layer; and forming a select transistor and a control transistor by patterning the third conductive layer, the coupling oxide layer, and the conductive layer for the floating gate. The select transistor is spaced apart from the control transistor. The select transistor, which is formed on the tunneling oxide layer, includes a gate stack formed of a select gate, a first coupling oxide pattern, and a first floating gate, and the control transistor includes a gate stack formed of a control gate, a second coupling oxide pattern, and a second floating gate.
Abstract:
A flash memory device including a tunnel dielectric layer, a floating gate layer, an interlayer dielectric layer and at least two mold layers formed on a semiconductor substrate and a method of manufacturing the same are provided. By sequentially patterning the layers, a first mold layer pattern and a floating gate layer pattern aligned with each other are formed. Exposed portions of side surfaces of the first mold layer pattern are selectively lateral etched, thereby forming a first mold layer second pattern having grooves in its sidewalls. A gate dielectric layer is formed on the semiconductor substrate adjacent to the floating gate layer pattern. A control gate having a width that is determined by the grooves in the second mold layer pattern is formed on the gate dielectric layer. By removing the first mold layer second pattern, spacers are formed on sidewalls of the control gate. Exposed portions of the interlayer dielectric layer and the floating gate layer pattern are selectively etched, using the spacer as an etch mask to form a floating gate having a width defined by the widths of the groove and spacer.
Abstract:
A semiconductor memory device having a self-aligned charge trapping layer and a method of manufacturing the same in which a consistent length of an ONO layer is ensured. Here, an insulating stacked structure is self-aligned to a bottom surface of conductive spacers.
Abstract:
A semiconductor memory device included in a system-on-chip (SOC) or a microcomputer chip. The semiconductor memory device may include a flash memory cell array unit and a mask read-only memory (ROM) cell array unit which are formed in a single memory block without an isolation layer for separating the two units. Transistors included in the flash memory unit and the mask ROM unit are the same type and may have two threshold voltages. The transistor in each memory cell unit may be a split gate transistor, a metal-oxide-nitride-oxide-silicon, or silicon-oxide-nitride-oxide-silicon transistor. Further, the transistor included in the mask ROM unit in the semiconductor memory device may include enhancement transistors or depletion transistors in which a dopant ion-implanted region is formed at channel portions.