Flexible printed circuit cables with service loops and overbending prevention

    公开(公告)号:US09658648B2

    公开(公告)日:2017-05-23

    申请号:US14224892

    申请日:2014-03-25

    Applicant: Apple Inc.

    Abstract: An electronic device may have a signal cable formed from a flexible printed circuit. A service loop may be formed in the signal cable. The bend may be formed in a desired location on the flexible printed circuit by contraction of an elastic member having ends attached to the flexible printed circuit. The elastic member may be conductive to carry signals and provide shielding. Structures may be attached to the flexible printed circuit to promote bending in a desired location and direction. A crease or other bending promotion feature may be applied to the flexible printed circuit at a desired bend location. Overbending prevention structures such as overmolded elastomeric structures may be applied to the flexible printed circuit at the bend. Integral strain relief features may prevent overbending of the flexible printed circuit upon exiting the elastomeric structures. Overmolded structures may serve as protective bumpers.

    Methods for forming metallized dielectric structures
    56.
    发明授权
    Methods for forming metallized dielectric structures 有权
    形成金属化电介质结构的方法

    公开(公告)号:US09179537B2

    公开(公告)日:2015-11-03

    申请号:US13714186

    申请日:2012-12-13

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and patterned following deposition or may be patterned during deposition. A dielectric sheet having patterned metal may be shaped into a desired shape using molding equipment or other equipment that applies heat and pressure to the dielectric sheet and patterned metal. Metal on a dielectric sheet may also be patterned after the dielectric sheet is formed into a desired shape. Metal may be formed on opposing sides of the dielectric sheet.

    Abstract translation: 电子设备可以设置有用作电磁干扰屏蔽,天线结构或其它金属结构的金属涂覆的电介质结构。 金属涂覆的电介质结构可以由聚合物片形成。 可以使用沉积工具将金属沉积在聚合物片上,并且在沉积之后进行图案化,或者可以在沉积期间被图案化。 可以使用向电介质片和图案化金属施加热和压力的成型设备或其他设备,将具有图案化金属的电介质片材成形为期望的形状。 在电介质片形成为所需形状之后,电介质片上的金属也可以被图案化。 金属可以形成在电介质片的相对侧上。

    RETENTION OF MAGNETIC PROPERTIES
    57.
    发明申请
    RETENTION OF MAGNETIC PROPERTIES 有权
    磁性特性的保留

    公开(公告)号:US20140174607A1

    公开(公告)日:2014-06-26

    申请号:US13955996

    申请日:2013-07-31

    Applicant: Apple Inc.

    Abstract: Methods, systems, and apparatuses for retaining magnetic properties of magnetic elements while undergoing manufacturing processes are presented. In one embodiment, a manufacturing fixture includes a temperature controlled region suitable for retaining a magnetic element. The manufacturing fixture also includes a cooling mechanism configured to maintain the magnetic element at an acceptable temperature range during a thermally active manufacturing process. The temperature controlled or stabilized region can include a structure configured to receive the magnetic element and a sensor, or sensors. In one embodiment, the sensor can be configured to measure an ambient temperature of the temperature stabilized region. In another embodiment, the sensor can be a magnetic sensor configured to determine a magnetic property of the magnetic element.

    Abstract translation: 介绍了在制造过程中保持磁性元件磁性能的方法,系统和装置。 在一个实施例中,制造夹具包括适于保持磁性元件的温度控制区域。 制造夹具还包括冷却机构,其构造成在热活性制造过程期间将磁性元件保持在可接受的温度范围。 温度控制或稳定区域可以包括被配置为接收磁性元件和传感器或传感器的结构。 在一个实施例中,传感器可被配置成测量温度稳定区域的环境温度。 在另一个实施例中,传感器可以是被配置为确定磁性元件的磁性的磁传感器。

    Displays with minimized border regions having an apertured TFT layer for signal conductors

    公开(公告)号:US11137648B2

    公开(公告)日:2021-10-05

    申请号:US17080705

    申请日:2020-10-26

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry.

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