公开(公告)号：US20130277783A1

公开(公告)日：2013-10-24

申请号：US13918075

申请日：2013-06-14

Applicant: Allegro Microsystems, LLC

Inventor： Michael C. Doogue ,  William P. Taylor ,  Vijay Mangtani

IPC: H01L25/16

CPC classification number: H01L43/02 ,  B82Y25/00 ,  G01R15/08 ,  G01R15/207 ,  G01R33/02 ,  G01R33/06 ,  G01R33/07 ,  G01R33/09 ,  G01R33/093 ,  H01L23/49541 ,  H01L25/162 ,  H01L43/04 ,  H01L43/065 ,  H01L43/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

公开(公告)号：US20250067778A1

公开(公告)日：2025-02-27

申请号：US18944096

申请日：2024-11-12

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US11828819B2

公开(公告)日：2023-11-28

申请号：US18046222

申请日：2022-10-13

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul A. David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric G. Shoemaker ,  Michael C. Doogue

IPC: G01D5/14 ,  G01R33/07 ,  G01R15/20 ,  G01R33/00 ,  G01B7/30

CPC classification number: G01R33/0047 ,  G01B7/30 ,  G01D5/145 ,  G01R15/202 ,  G01R33/0011 ,  G01R33/072 ,  H01L2224/48247 ,  H01L2924/19105

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

公开(公告)号：US20230057390A1

公开(公告)日：2023-02-23

申请号：US18046222

申请日：2022-10-13

Applicant: Allegro MicroSystems, LLC

Inventor： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul A. David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric G. Shoemaker ,  Michael C. Doogue

IPC: G01R33/00 ,  G01B7/30

Abstract: A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

公开(公告)号：US20220137097A1

公开(公告)日：2022-05-05

申请号：US17648310

申请日：2022-01-19

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US11313899B2

公开(公告)日：2022-04-26

申请号：US16655657

申请日：2019-10-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  David J. Haas ,  Gregory Delmain ,  Michael Gaboury ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/02 ,  G01R31/3187 ,  G01R35/00 ,  G01R33/09 ,  G01R33/00 ,  G01R33/07

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

公开(公告)号：US10333055B2

公开(公告)日：2019-06-25

申请号：US15447320

申请日：2017-03-02

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R33/00 ,  G01R33/07 ,  G01R33/09 ,  H01L23/00 ,  H01L23/31 ,  H01L43/02 ,  H01L43/04 ,  H01L43/06 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L23/495 ,  H01L21/00

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

公开(公告)号：US20190025080A1

公开(公告)日：2019-01-24

申请号：US15655403

申请日：2017-07-20

Applicant: Allegro MicroSystems, LLC

Inventor： Michael C. Doogue ,  P. Karl Scheller

IPC: G01D5/14 ,  G01D5/244 ,  G01R31/02

CPC classification number: G01D5/14 ,  G01D5/244 ,  G01P3/487 ,  G01P3/489 ,  G01R31/024

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. A duty cycle percentage of the output signal indicates the speed and the direction or indicates a fault.

公开(公告)号：US10069063B2

公开(公告)日：2018-09-04

申请号：US15395083

申请日：2016-12-30

Applicant: Allegro MicroSystems, LLC

Inventor： Michael C. Doogue ,  William P. Taylor ,  Vijay Mangtani

IPC: H01L29/82 ,  H01L43/08 ,  H01L43/02 ,  H01L23/495

CPC classification number: H01L43/02 ,  B82Y25/00 ,  G01R15/08 ,  G01R15/207 ,  G01R33/02 ,  G01R33/06 ,  G01R33/07 ,  G01R33/09 ,  G01R33/093 ,  H01L23/49541 ,  H01L25/162 ,  H01L43/04 ,  H01L43/065 ,  H01L43/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

公开(公告)号：US09910088B2

公开(公告)日：2018-03-06

申请号：US14578813

申请日：2014-12-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  William P. Taylor

IPC: G01B7/30 ,  G01R27/02 ,  G01R31/02 ,  G01R31/28 ,  G01R33/00 ,  G01R31/3187 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R35/00

CPC classification number: G01R31/2884 ,  G01R31/2829 ,  G01R31/3187 ,  G01R33/00 ,  G01R33/0023 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R33/091 ,  G01R35/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.