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公开(公告)号:USD864293S1
公开(公告)日:2019-10-22
申请号:US29648137
申请日:2018-05-18
Applicant: CompoSecure, LLC
Designer: Adam Lowe , Michele Logan , Dori Skelding , Syeda Hussain
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公开(公告)号:US20190286961A1
公开(公告)日:2019-09-19
申请号:US16427864
申请日:2019-05-31
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/077
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US10406734B2
公开(公告)日:2019-09-10
申请号:US16164322
申请日:2018-10-18
Applicant: COMPOSECURE, LLC
Inventor: Adam Lowe
IPC: B29C45/14 , G06K19/077 , H01Q13/10 , H05K1/18 , H05K3/28 , H05K3/30 , B22D19/00 , B29C45/17 , B29L17/00
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US20190050706A1
公开(公告)日:2019-02-14
申请号:US16164322
申请日:2018-10-18
Applicant: COMPOSECURE, LLC
Inventor: Adam Lowe
IPC: G06K19/077 , H05K3/30 , H05K3/28 , H05K1/18 , H01Q13/10
CPC classification number: B29C45/14647 , B22D19/00 , B29C45/14 , B29C45/14639 , B29C45/17 , B29L2017/006 , G06K19/077 , G06K19/07749 , G06K19/07777 , H01Q13/10 , H05K1/18 , H05K3/284 , H05K3/285 , H05K3/301 , H05K2201/1003 , H05K2203/1316 , H05K2203/1327
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US09898699B2
公开(公告)日:2018-02-20
申请号:US14977553
申请日:2015-12-21
Applicant: COMPOSECURE, LLC
Inventor: John Herslow , Adam Lowe , Luis Dasilva
CPC classification number: G06K19/07773 , G06K19/02 , G06K19/07771 , H01Q1/2225 , H01Q1/526 , H01Q7/06
Abstract: Ferrite material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient ferrite material is utilized to track and conform to the antenna.
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公开(公告)号:US12208599B2
公开(公告)日:2025-01-28
申请号:US17166080
申请日:2021-02-03
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: B32B3/30 , B32B15/00 , B32B15/20 , B32B33/00 , B42D25/00 , B42D25/373 , B44C1/14 , B44D5/00 , G06K19/02 , G06K19/077 , B42D25/415 , B42D25/445 , C23C22/52 , C23C22/63 , G06K19/04
Abstract: A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.
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公开(公告)号:US20240054311A1
公开(公告)日:2024-02-15
申请号:US18383996
申请日:2023-10-26
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/077
CPC classification number: G06K19/0772 , G06K19/07718
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
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58.
公开(公告)号:US20230419328A1
公开(公告)日:2023-12-28
申请号:US18037465
申请日:2021-11-17
Applicant: CompoSecure, LLC
Inventor: Adam Lowe , Todd Nuzum
CPC classification number: G06Q20/4018 , G06Q20/353 , G06Q20/3278 , G06Q20/023
Abstract: Systems, methods, transaction cards, mobile devices, processors, and computer memory programmed with machine-readable instructions, for providing a dynamic Card Verification Value (dCVV) to a user of a transaction card. A mobile device associated with the user and with the transaction card initiates a non-payment near field communication (NFC) with the transaction card, receives a message from the transaction card in the non-payment NFC communication, transmits a prompt to an IP address or web address over a global computer information network, and receives a secure communication from containing the dCVV from a server accessible from the IP address or web address in response to the prompt. The dCVV code is then provided to the user. In embodiments, the non-payment NFC may be initiated via a card tap, a user interface, or a communication from a website.
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公开(公告)号:US11842240B2
公开(公告)日:2023-12-12
申请号:US17502790
申请日:2021-10-15
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/06 , G06K19/07 , G06K19/077
CPC classification number: G06K19/0723 , G06K19/07773
Abstract: A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
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公开(公告)号:US11501128B2
公开(公告)日:2022-11-15
申请号:US17101092
申请日:2020-11-23
Applicant: CompoSecure, LLC
Inventor: Adam Lowe , Syeda Hussain
IPC: G06K19/077 , G06K19/06 , G06K19/02
Abstract: A transaction card is described. The transaction card includes a non-plastic layer, one or more embedded electronics, a fill layer, and one or more additional layers. The non-plastic layer has first and second faces and a thickness therebetween, and at least a first opening in the first face. The one or more embedded electronic components are disposed in or adjacent the first opening. The fill layer is in contact with the embedded electronic components, disposed in portions of the first opening not occupied by the embedded electronics. The one or more additional layers are disposed over the fill layer.
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