Thermoelastic inkjet actuator with heat conductive pathways
    53.
    发明授权
    Thermoelastic inkjet actuator with heat conductive pathways 失效
    具有导热路径的热弹性喷墨执行器

    公开(公告)号:US06688719B2

    公开(公告)日:2004-02-10

    申请号:US10120359

    申请日:2002-04-12

    IPC分类号: B41J2936

    CPC分类号: B41J2/14427 Y10T29/49401

    摘要: A thermal inkjet actuator for use in an inkjet printer assembly includes heat conduction means arranged to realize a predetermined negative pressure profile to facilitate droplet formation. In a preferred embodiment the heat conduction means comprises a thin layer of very high thermally conductive material such as Aluminum located in the middle of a non-heat conductive passive bend layer. The overall cool-down speed of the actuator, and hence the speed with which the passive bend layer returns to its quiescent position can be controlled by controlling the proximity of the heat conductive layer to the actuator's heater during fabrication.

    摘要翻译: 用于喷墨打印机组件的热喷墨致动器包括热传导装置,其布置成实现预定的负压分布以便于液滴形成。 在优选实施例中,热传导装置包括非常高导热材料的薄层,例如位于不导热的被动弯曲层中间的铝。 致动器的整体冷却速度以及因此被动弯曲层返回到静止位置的速度可以通过在制造期间控制导热层与致动器加热器的接近来控制。

    Method of forming inkjet nozzle chamber
    54.
    发明授权
    Method of forming inkjet nozzle chamber 有权
    形成喷嘴喷嘴的方法

    公开(公告)号:US08608286B2

    公开(公告)日:2013-12-17

    申请号:US13750968

    申请日:2013-01-25

    IPC分类号: B41J2/16 G01D15/00 H01L21/00

    摘要: A method of forming an inkjet nozzle chamber includes the steps of: (a) depositing a layer of chamber material onto a substrate, the layer of chamber material defining a depth of the nozzle chamber; (b) removing a predetermined region of the layer of chamber material to define sidewalls of the nozzle chamber and an internal volume of the nozzle chamber; (c) depositing a sacrificial material to fill the internal volume contained within the sidewalls; (d) depositing a roof layer onto the sacrificial material and the sidewalls; (e) etching the roof layer to define a nozzle opening therein; and (f) removing the sacrificial material contained in the internal volume so as to form the nozzle chamber.

    摘要翻译: 一种形成喷墨喷嘴室的方法包括以下步骤:(a)将一层室材料沉积在基材上,该室材料层限定喷嘴室的深度; (b)去除室材料层的预定区域以限定喷嘴室的侧壁和喷嘴室的内部容积; (c)沉积牺牲材料以填充包含在侧壁内的内部容积; (d)将屋顶层沉积到牺牲材料和侧壁上; (e)蚀刻屋顶层以在其中限定喷嘴开口; 和(f)去除包含在内部容积中的牺牲材料,以形成喷嘴室。

    Thermal bend actuator with conduction pad at bend region
    55.
    发明授权
    Thermal bend actuator with conduction pad at bend region 有权
    热弯曲致动器,带弯曲区域的导电垫

    公开(公告)号:US08491098B2

    公开(公告)日:2013-07-23

    申请号:US13017940

    申请日:2011-01-31

    IPC分类号: B41J2/04

    摘要: A thermal bend actuator includes: a first active cantilever beam for connection to drive circuitry, the first beam having a bent planar beam element; a second passive cantilever beam fused to the first beam; a conduction pad sandwiched between the first and second beams; and first and second adjacent electrode contacts positioned at one side of the actuator. A first end of the beam element is connected to the first contact and a second end of the beam element is connected to the second contact. The conduction pad is positioned at a bend region of the planar beam element so as to facilitate electrical conduction around the bend region.

    摘要翻译: 热弯曲致动器包括:用于连接到驱动电路的第一主动悬臂梁,第一梁具有弯曲的平面梁元件; 与第一光束融合的第二被动悬臂梁; 夹在第一和第二光束之间的导电垫; 以及位于致动器一侧的第一和第二相邻的电极触点。 梁元件的第一端连接到第一触点,并且梁元件的第二端连接到第二触点。 导电垫位于平面光束元件的弯曲区域,以便于围绕弯曲区域的电传导。

    INKJET PRINTHEAD HAVING TITANIUM ALUMINIUM NITRIDE HEATER ELEMENTS
    56.
    发明申请
    INKJET PRINTHEAD HAVING TITANIUM ALUMINIUM NITRIDE HEATER ELEMENTS 有权
    具有氮化钛加热器元件的INKJET PRINTHEAD

    公开(公告)号:US20120314004A1

    公开(公告)日:2012-12-13

    申请号:US13591048

    申请日:2012-08-21

    IPC分类号: B41J2/05

    摘要: Provided is an inkjet printhead integrated circuit that has a wafer substrate that has an ink passage, and a nozzle plate supported on the substrate by side walls to define an ink chamber supplied with ink via the ink passage. The nozzle plate has an ink ejection port corresponding to the ink chamber. A heater element is bonded to the nozzle plate inside the chamber for vaporising ink to generate a vapour bubble that ejects ink through the ejection port. The heater element is bonded to the nozzle plate with a low thermal product layer. The thermal product thermal product is less than 1495 Jm−2K−1s−1/2, the thermal product being (ρCk)1/2, where ρ is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer.

    摘要翻译: 本发明提供了一种喷墨打印头集成电路,其具有具有油墨通道的晶片基板,以及通过侧壁支撑在基板上的喷嘴板,以限定经由油墨通道供给油墨的油墨室。 喷嘴板具有对应于墨水室的喷墨口。 加热器元件结合到腔室内的喷嘴板,用于蒸发墨水以产生通过喷射口喷射墨水的蒸气泡。 加热元件以低热产物层结合到喷嘴板。 热产品热产品小于1495 Jm-2K-1s-1/2,热产品为(&rgr; Ck)1/2,其中& 是层的密度,C是层的比热,k是层的热导率。

    Method of fabricating printhead integrated circuit with backside electrical connections
    59.
    发明授权
    Method of fabricating printhead integrated circuit with backside electrical connections 有权
    制造背面电气连接的打印头集成电路的方法

    公开(公告)号:US08101438B2

    公开(公告)日:2012-01-24

    申请号:US12509491

    申请日:2009-07-27

    IPC分类号: H01L21/30

    摘要: A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads.

    摘要翻译: 一种制造用于背面电连接的打印头集成电路的方法。 该方法包括以下步骤:(a)提供晶片,其包括在晶片的前侧上的多个部分制造的喷嘴组件和从前侧朝向晶片的后侧延伸的穿硅连接器; (b)在所述晶片的前侧沉积导电层并进行蚀刻,以形成用于每个喷嘴组件的致动器和在每个贯穿硅连接器的头部上的前侧触点焊盘; (c)执行进一步的MEMS处理步骤以完成喷嘴组件的供墨通道硅 - 硅连接器的形成; 和(d)将晶片分成单独的打印头集成电路。 如此形成的每个打印头集成电路被配置为经由穿过硅连接器的接触焊盘将背面连接到驱动电路。