摘要:
A graphite or silicate plug is coated with a refractory metal and positioned in the cutter pocket of a steel bodied bit as molten hardfacing material is applied to the bit surface under high temperature conditions. The refractory metal cooperates with the hardfacing material to act as a wetting agent that draws the hardfacing material into intimate contact with the body of the displacement plug. The plug is removed leaving a composite pocket opening formed by the steel body and the hardfacing material. A PDC cutter inserted into the composite pocket opening closely adheres to the sides of the opening to reduce the gap between the cutter and the hardfacing material to hereby minimize the effects of erosion in the area of the gap. The wetting material on the displacement plug permits the hardfacing material to flow into and remain in position immediately adjacent the displacement body and in the small surface area between adjacent cutter pockets. The hardfacing material also cooperates with the-steel pocket to increase the surface area of the pocket recess that provides additional structural support to the cutter to improve the stability and retention of the cutter in the bit. The refractory metal may preferably be molybdenum that is applied in a thin layer deposited by a plasma coating technique directly over the body of the graphite displacement body.
摘要:
An exemplary method of processing a polycrystalline diamond element is disclosed. According to the method, a protective layer may be formed over only a selected portion of a polycrystalline diamond element. The polycrystalline diamond element may include a polycrystalline diamond table. At least a portion of the polycrystalline diamond element may be exposed to a leaching solution such that the leaching solution contacts an exposed surface region of the polycrystalline diamond table and at least a portion of the protective layer. The protective layer may be substantially impermeable to the leaching solution. An exemplary method of manufacturing a polycrystalline diamond element is also disclosed.
摘要:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要:
Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond compact includes at least saturating a sintering aid material with non-diamond carbon to form a carbon-saturated sintering aid material and sintering a plurality of diamond particles in the presence of the carbon-saturated sintering aid particles to form a polycrystalline diamond table.
摘要:
Embodiments relate to methods of fabricating PCD materials by subjecting a mixture that exhibits a broad diamond particle size distribution to an HPHT process, PCD materials so-formed, and PDCs including a polycrystalline diamond table comprising such PCD materials. In an embodiment, a PCD material includes a plurality of bonded diamond grains that exhibit a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is less than about 1.0. θ = x 6 · σ , where x is the average grain size of the substantially unimodal diamond grain size distribution, and σ is the standard deviation of the substantially unimodal diamond grain size distribution.
摘要翻译:实施方案涉及通过使表现出宽金刚石粒度分布的混合物经受HPHT方法,所形成的PCD材料和包括包含这种PCD材料的多晶金刚石台的PDC来制造PCD材料的方法。 在一个实施方案中,PCD材料包括多个结合的金刚石晶粒,其表现出基本上单峰金刚石晶粒尺寸分布,其至少部分地由参数和特征表征; 小于约1.0。 &thetas; = x 6·&sgr ,其中x是基本上单峰金刚石晶粒尺寸分布的平均晶粒尺寸, 是基本上单峰金刚石晶粒尺寸分布的标准偏差。
摘要:
Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.
摘要:
Embodiments relate to rotary drill bits that employ superabrasive cutting elements including a diamond-silicon carbide composite table. In an embodiment, a rotary drill bit includes a bit body configured to engage a subterranean formation. The bit body includes a plurality of blades. The rotary drill bit further includes a plurality of superabrasive cutting elements. Each of the superabrasive cutting elements is attached to a corresponding one of the cutting blades. At least one of the superabrasive cutting elements includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix.
摘要:
Embodiments of the present invention relate to superabrasive materials, superabrasive compacts employing such superabrasive materials, and methods of fabricating such superabrasive materials and compacts. In one embodiment, a superabrasive material includes a matrix comprising a plurality of coarse-sized superabrasive grains, with the coarse-sized superabrasive grains exhibiting a coarse-sized average grain size. The superabrasive material further includes a plurality of superabrasive regions dispersed within the matrix, with each superabrasive region including a plurality of fine-sized superabrasive grains exhibiting a fine-sized average grain size less than the coarse-sized average grain size. In another embodiment, the superabrasive materials may be employed in a superabrasive compact. The superabrasive compact comprises a substrate including a superabrasive table comprising any of the disclosed superabrasive materials. Further embodiments are directed to applications utilizing the disclosed superabrasive articles in applications, such as rotary drill bits.
摘要:
Embodiments of the present invention relate to diamond-silicon carbide composites, superabrasive compacts including such diamond-silicon carbide composites, and methods of fabricating such diamond-silicon carbide composites and superabrasive compacts. In one embodiment, a superabrasive compact includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix. In another embodiment, a method of fabricating a superabrasive compact is disclosed. An assembly comprising a mixture including diamond particles and silicon is formed. The silicon comprises amorphous silicon, crystalline silicon crystallized from amorphous silicon formed by a milling process, or combinations thereof. A substrate is positioned in proximity to the mixture. The assembly is subjected to heat and pressure to form a superabrasive compact comprising a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including diamond grains dispersed through a matrix of silicon carbide grains.