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公开(公告)号:US20160347044A1
公开(公告)日:2016-12-01
申请号:US14911281
申请日:2013-10-23
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEI JEN CHEN , CHALAM KASHYAP , KUAN-TING WU
CPC classification number: B32B37/10 , B23K20/02 , B23K20/2333 , B23K2103/08 , B23K2103/18 , B32B15/01 , B32B15/043 , B32B37/00 , B32B37/06 , B32B37/14 , B32B2307/54 , B32B2311/00 , B32B2457/00 , C22C23/02
Abstract: A multi-layered metal includes a first layer, and a second layer on the first layer. The second layer is bonded to the first layer, by applying at least one of heat and pressure to an assembly including the first layer and the sheet to cause inter-metal diffusion between the first layer and the second layer.
Abstract translation: 多层金属包括第一层和第一层上的第二层。 通过对包括第一层和片材的组件施加热和压力中的至少一种来将第二层结合到第一层,以引起第一层和第二层之间的金属间扩散。
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公开(公告)号:US20160326664A1
公开(公告)日:2016-11-10
申请号:US15030283
申请日:2014-01-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , NING CHANG , YU-CHUAN KANG
CPC classification number: C25D13/22 , B41M5/0058 , C09D5/24 , C09D5/4411 , C09D5/443 , C25D13/12 , H04M1/0283 , H05K5/04
Abstract: A coating of dots is applied to a surface of a metal substrate and an electrophoretic deposition is applied in-between the dots. Either the dots or the electrophoretic deposition are transparent or translucent.
Abstract translation: 将点涂层施加到金属基板的表面上,并且在点之间施加电泳沉积。 点或电泳沉积是透明或半透明的。
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公开(公告)号:US20230262933A1
公开(公告)日:2023-08-17
申请号:US18011484
申请日:2020-07-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: HENDRY HUANG , KUAN-TING WU , CHI HAO CHANG
IPC: H05K7/20
CPC classification number: H05K7/20336 , H05K7/20409 , H05K7/20454 , H05K7/20381
Abstract: The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.
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公开(公告)号:US20230262912A1
公开(公告)日:2023-08-17
申请号:US18013753
申请日:2020-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: CHIEN-CHIH CHIU , HSIN-CHIEN CHU , KUAN-TING WU
CPC classification number: H05K5/03 , G06F1/1656 , C25D11/026 , C25D11/30
Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate including a first surface. A first micro-arc oxidation layer may be on the first surface of the light metal substrate, the first micro-arc oxidation layer can include a cationic dye bonded to the first surface via an anionic inorganic bridging compound.
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公开(公告)号:US20220403528A1
公开(公告)日:2022-12-22
申请号:US17777745
申请日:2019-12-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , CHI HAO CHANG , QINGYONG GUO
IPC: C23C28/00 , C23C22/48 , C23C22/78 , C25D11/30 , C25D11/02 , C25D13/12 , C25D13/20 , C25D13/22 , C09D5/44 , C09D5/02 , C09D133/04 , C09D7/20 , H05K5/04 , G06F1/16
Abstract: A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).
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公开(公告)号:US20220066581A1
公开(公告)日:2022-03-03
申请号:US17418404
申请日:2019-01-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHUNG HUA KU , KUO-CHIH HUANG , CHI HAO CHANG , KUAN-TING WU
Abstract: A panel for a touch screen of an electronic device is described. The panel comprises a substrate having a central area for operating the touch screen and a border area at an edge of the central area. The border area comprises a decorative image on the substrate and an outer surface coating overlying the decorative image. The decorative image comprises a non-conductive metallic coating. The outer surface coating comprises a non-conductive, printed layer. A method for manufacturing the panel and an electronic device comprising a touch screen having the panel are also described.
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公开(公告)号:US20220066515A1
公开(公告)日:2022-03-03
申请号:US17418464
申请日:2019-02-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , YA-TING YEH , CHIH-HSIUNG LIAO
IPC: G06F1/16
Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.
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公开(公告)号:US20210394233A1
公开(公告)日:2021-12-23
申请号:US17418429
申请日:2019-02-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHI HAO CHANG , KUAN-TING WU , CHENG-FENG LIAO
Abstract: The present disclosure is drawn to printed foam panels for electronic devices. In one example, a printed foam panel for an electronic device can include a substrate, a primer layer on the substrate, a foam pattern on the primer layer, and a clear coating layer on the foam pattern. The foam pattern can cover a first portion of the substrate and leave a second portion uncovered. The foam pattern can include a printed pattern of a foaming composition including a photoacid generator compound and a metal carbonate activated to form the foam pattern.
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公开(公告)号:US20200235034A1
公开(公告)日:2020-07-23
申请号:US16617956
申请日:2017-07-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , JAMAL WAKIL , DAVIS CASTILLO
IPC: H01L23/373 , C09D7/20 , C09D7/61 , C09D167/00 , C09D175/04 , C09D169/00 , C09D133/08
Abstract: Described herein in some examples is a heat dissipation coating composition for an electronic device, which can comprise: a transparent coating layer deposited on a surface of the electronic device, wherein the coating layer comprises: a heat absorber selected from the group consisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel, graphene, graphene aerogel, and combinations thereof, a transparent resin selected from the group consisting of a polyacrylic resin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin, a polyester resin, and combinations thereof, and a solvent; and a heat spreader layer deposited at least partially on top of the transparent coating layer or deposited on the surface of the electronic device adjacent to the transparent coating layer, wherein the heat spreader layer comprises: metallic or non-metallic particles selected from the group consisting of copper, aluminum, graphite, carbon nanotube, graphene on a metal, graphene, and combinations thereof.
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公开(公告)号:US20200225712A1
公开(公告)日:2020-07-16
申请号:US16617983
申请日:2017-07-17
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , CHI HAO CHANG , CHUNG HUA KU
IPC: G06F1/16
Abstract: In example implementations, a mobile device enclosure is provided. The mobile device enclosure includes a housing to enclose a computing device and a pull-out kickstand coupled to the housing via a movable hinge. An outer perimeter of the pull-out kickstand includes a surface enhancement to increase an amount of friction on the outer perimeter of the pull-out kickstand.
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