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公开(公告)号:US20170245385A1
公开(公告)日:2017-08-24
申请号:US15518521
申请日:2014-11-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHENG-FENG LIAO , KUAN-TING WU , YAO-WIN FAN , HUI HE
CPC classification number: H05K7/02 , B29C70/46 , B29K2069/00 , B29K2105/0881 , B29K2105/089 , B29K2705/02 , B29L2031/3481 , B32B5/022 , B32B5/024 , B32B5/12 , B32B5/22 , B32B5/26 , B32B7/02 , B32B15/08 , B32B27/12 , B32B27/285 , B32B27/286 , B32B27/288 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/365 , B32B2260/023 , B32B2260/046 , B32B2262/106 , B32B2307/51 , B32B2307/546 , B32B2307/718 , B32B2457/00 , B32B2509/00 , D06M15/513 , D06M15/53 , D06M15/63 , D06M15/693 , D06M2101/40
Abstract: One example provides a composite. The composites includes a core layer comprising a thermoplastic polymer and having a first and a second sides opposite to each other; a first set of two layers disposed over at least a portion of the core layer respectively on the first and the second sides, each layer of the first set including carbon fibers aligned in a first direction in a plane; and a second set of two layers disposed over at least a portion of the first set of two layers respectively on the first and the second sides, each layer of the second set including carbon fibers aligned in a second direction perpendicular to the first direction in the plane In the plane, the composite has a length and a width, the length larger than the width and parallel to the second direction.
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公开(公告)号:US20210394233A1
公开(公告)日:2021-12-23
申请号:US17418429
申请日:2019-02-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHI HAO CHANG , KUAN-TING WU , CHENG-FENG LIAO
Abstract: The present disclosure is drawn to printed foam panels for electronic devices. In one example, a printed foam panel for an electronic device can include a substrate, a primer layer on the substrate, a foam pattern on the primer layer, and a clear coating layer on the foam pattern. The foam pattern can cover a first portion of the substrate and leave a second portion uncovered. The foam pattern can include a printed pattern of a foaming composition including a photoacid generator compound and a metal carbonate activated to form the foam pattern.
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公开(公告)号:US20180136696A1
公开(公告)日:2018-05-17
申请号:US15563967
申请日:2015-05-04
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEI-CHUNG CHEN , WEI-KUANG CHU , CHI-HAO CHANG , KUAN-TING WU , CHENG-FENG LIAO , CHARLIE KU , kUN CHIH WANG
CPC classification number: G06F1/1652 , G06F1/1681 , H04M1/0216 , H04M1/022
Abstract: Examples of a hinge for foldable components are described herein. In an example, the hinge can include a plurality of bracing elements, a bracing element from the plurality of bracing elements can be operably coupled to an adjacent bracing element from the plurality of bracing elements, to fold the plurality of bracing elements into an arcuate shape. Each bracing element can be supported and locked against the adjacent bracing element in the arcuate shape. The hinge can further include an end coupler at each longitudinal end of the hinge to couple the hinge to a flexible element.
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公开(公告)号:US20210126308A1
公开(公告)日:2021-04-29
申请号:US16605923
申请日:2017-06-20
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , CHENG-FENG LIAO , CHI HAO CHANG
IPC: H01M50/121
Abstract: Electronic devices comprising a polymeric material at least partially enclosed by an anodized metal are disclosed herein. The polymeric material can comprise a polymer composite, a carbon fiber composite, or mixtures thereof. The anodized metal can be selected from the group consisting of anodized aluminum, anodized aluminum alloy, anodized titanium, anodized titanium alloy, anodized zinc, anodized zinc alloy, anodized magnesium, anodized magnesium alloy, anodized niobium, anodized niobium alloy, anodized zirconium, anodized zirconium alloy, anodized hafnium, anodized hafnium alloy, anodized tantalum, anodized tantalum alloy, and combinations thereof.
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公开(公告)号:US20170182737A1
公开(公告)日:2017-06-29
申请号:US15309546
申请日:2014-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: KUAN-TING WU , YAO-WEN FAN , CHENG-FENG LIAO
IPC: B32B5/08 , B32B27/20 , B32B27/30 , B32B37/06 , B32B27/36 , B32B37/14 , C23C14/22 , B32B27/12 , B32B27/34
CPC classification number: B32B5/08 , B32B27/12 , B32B27/20 , B32B27/286 , B32B27/302 , B32B27/32 , B32B27/34 , B32B27/365 , B32B37/06 , B32B37/14 , B32B2250/40 , B32B2255/02 , B32B2255/10 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2262/106 , B32B2262/14 , B32B2264/02 , B32B2264/102 , B32B2264/105 , B32B2264/108 , B32B2307/41 , C23C14/22
Abstract: An example composite material having a substrate formed from carbon and/or glass fibers, and an opaque-plastic film positioned onto the substrate, where the opaque-plastic film has a surface roughness of between 0.001 nm and 1 mm.
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