PRINTED FOAM PANELS FOR ELECTRONIC DEVICES

    公开(公告)号:US20210394233A1

    公开(公告)日:2021-12-23

    申请号:US17418429

    申请日:2019-02-01

    Abstract: The present disclosure is drawn to printed foam panels for electronic devices. In one example, a printed foam panel for an electronic device can include a substrate, a primer layer on the substrate, a foam pattern on the primer layer, and a clear coating layer on the foam pattern. The foam pattern can cover a first portion of the substrate and leave a second portion uncovered. The foam pattern can include a printed pattern of a foaming composition including a photoacid generator compound and a metal carbonate activated to form the foam pattern.

    ELECTRONIC DEVICE(S)
    4.
    发明申请

    公开(公告)号:US20210126308A1

    公开(公告)日:2021-04-29

    申请号:US16605923

    申请日:2017-06-20

    Abstract: Electronic devices comprising a polymeric material at least partially enclosed by an anodized metal are disclosed herein. The polymeric material can comprise a polymer composite, a carbon fiber composite, or mixtures thereof. The anodized metal can be selected from the group consisting of anodized aluminum, anodized aluminum alloy, anodized titanium, anodized titanium alloy, anodized zinc, anodized zinc alloy, anodized magnesium, anodized magnesium alloy, anodized niobium, anodized niobium alloy, anodized zirconium, anodized zirconium alloy, anodized hafnium, anodized hafnium alloy, anodized tantalum, anodized tantalum alloy, and combinations thereof.

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