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169 条记录 (耗时 0.058 秒)

    CIRCUIT BOARD FOR BODY FLUID COLLECTION
    52.
    发明申请
    CIRCUIT BOARD FOR BODY FLUID COLLECTION 审中-公开
    电路板身体液收集

    公开(公告)号：US20100292610A1

    公开(公告)日：2010-11-18

    申请号：US12735375

    申请日：2008-03-19

    申请人： Jun Ishii ,  Toshiki Naito ,  Masayuki Kaneto ,  Tetsuya Ohsawa

    发明人： Jun Ishii ,  Toshiki Naito ,  Masayuki Kaneto ,  Tetsuya Ohsawa

    IPC分类号： A61B5/157

    CPC分类号： A61B5/150557 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150358 ,  A61B5/150435 ,  A61B5/150503 ,  A61B5/150618 ,  A61B5/150717 ,  A61B5/15105 ,  A61B5/15142 ,  A61B5/157 ,  A61B2562/0295

    摘要： A circuit board for body fluid collection includes a circuit board portion including an insulating layer and a conductor pattern which is supported by the insulating layer and in which an electrode, a terminal to be connected to a device for measuring the component of a body fluid, and a wire which electrically connects the electrode and the terminal are integrally provided. The circuit board for body fluid collection comprises a puncture needle for extracting the body fluid by performing puncturing, which is formed integrally with the circuit board portion and which is protruded from the circuit board portion, and a guard portion for guarding the tip of the puncture needle, which is arranged in opposition to the puncture needle in the lower flow side in the puncture direction of the puncture needle.

    摘要翻译： 用于体液收集的电路板包括电路板部分，其包括由绝缘层支撑的绝缘层和导体图案，并且其中电极，待连接到用于测量体液成分的装置的端子， 并且电连接电极和端子的导线一体地设置。 用于体液收集的电路板包括穿刺针，该穿刺针通过与电路板部分一体地形成并且从电路板部分突出的穿刺提取体液，以及用于保护穿刺尖端的防护部分 针与穿刺针的穿刺方向的下流侧的穿刺针相对配置。

    Wired circuit board
    53.
    发明授权
    Wired circuit board 失效
    有线电路板

    公开(公告)号：US07737365B2

    公开(公告)日：2010-06-15

    申请号：US11812797

    申请日：2007-06-21

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0259 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K2201/09554 ,  Y10T428/1328 ,  Y10T428/1393 ,  Y10T428/256 ,  Y10T428/257

    摘要： A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.

    摘要翻译： 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。

    Wired circuit board
    57.
    发明授权
    Wired circuit board 失效
    有线电路板

    公开(公告)号：US07629539B2

    公开(公告)日：2009-12-08

    申请号：US11819596

    申请日：2007-06-28

    申请人： Jun Ishii ,  Yasunari Ooyabu

    发明人： Jun Ishii ,  Yasunari Ooyabu

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

    摘要： A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.

    摘要翻译： 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有互相间隔布置的多根导线的导电图案，以及形成在多个半导体层上的多个半导体层 绝缘层并且电连接到金属支撑板和相应的导线。 半导体层相应于相应的导线彼此独立地设置。

    Producing method of wired circuit board
    58.
    发明授权
    Producing method of wired circuit board 失效
    有线电路板的生产方法

    公开(公告)号：US07557049B2

    公开(公告)日：2009-07-07

    申请号：US11976234

    申请日：2007-10-23

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H01L21/31

    CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

    摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。

    Suspension board with circuit
    59.
    发明授权
    Suspension board with circuit 失效
    悬挂板带电路

    公开(公告)号：US07495178B2

    公开(公告)日：2009-02-24

    申请号：US11713053

    申请日：2007-03-02

    申请人： Jun Ishii ,  Yasunari Ooyabu

    发明人： Jun Ishii ,  Yasunari Ooyabu

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28

    摘要： A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal portion for connecting to an external terminal, and an antistatic barrier layer formed on the conductive pattern. The antistatic barrier layer includes a metal thin film and a semiconductive layer having at least one end facing the terminal portion and at least the other end in contact with the metal supporting board.

    摘要翻译： 具有电路的悬挂板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上的导电图案，并且包括用于连接到外部端子的端子部分和形成在导体上的抗静电阻挡层 模式。 抗静电阻挡层包括金属薄膜和半导体层，其具有面向端子部的至少一个端部，并且至少另一端与金属支撑板接触。

    Wired circuit board and producing method thereof
    60.
    发明申请
    Wired circuit board and producing method thereof 失效
    有线电路板及其制造方法

    公开(公告)号：US20080277147A1

    公开(公告)日：2008-11-13

    申请号：US12149975

    申请日：2008-05-12

    申请人： Aya Mizushima ,  Jun Ishii

    发明人： Aya Mizushima ,  Jun Ishii

    IPC分类号： H05K1/03 ,  H05K3/00

    CPC分类号： H05K1/0256 ,  H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/108 ,  H05K3/28 ,  H05K3/388 ,  H05K2203/1184 ,  Y10T29/49155

    摘要： A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying layer is formed with a corroded portion corroded from a side end portion of the conductive layer toward an inner portion thereof. A semiconductive layer is formed on a surface of the insulating layer and on a surface of the conductive pattern. The semiconductive layer is formed so as to come in contact with the metal supporting board and have a cut formed in the corroded portion to interrupt conduction between the semiconductive layer formed on the surface of the insulating layer and the semiconductive layer formed on a surface of the conductive layer.

    摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘层和形成在绝缘层上的导电图案。 导电图案包括形成在绝缘层上的下层和形成在下层上的导电层。 下层形成有从导电层的侧端部朝向其内部被腐蚀的腐蚀部分。 在绝缘层的表面和导电图案的表面上形成半导体层。 半导体层形成为与金属支撑板接触，并且在被腐蚀部分形成切口，以阻断形成在绝缘层表面上的半导体层与形成在绝缘层表面上的半导体层之间的导通 导电层。