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    White light emitting device and white light source module using the same
    53.
    发明申请
    White light emitting device and white light source module using the same 有权
    白光发射装置和白光源模块使用相同

    公开(公告)号：US20080265269A1

    公开(公告)日：2008-10-30

    申请号：US12081726

    申请日：2008-04-21

    申请人： Chul Hee Yoo ,  Young June Jeong ,  Young Sam Park ,  Seong Yeon Han ,  Ho Yeon Kim ,  Hun Joo Hahm ,  Hyung Suk Kim

    发明人： Chul Hee Yoo ,  Young June Jeong ,  Young Sam Park ,  Seong Yeon Han ,  Ho Yeon Kim ,  Hun Joo Hahm ,  Hyung Suk Kim

    IPC分类号： H01L33/00

    CPC分类号： H05B33/12 ,  C09K11/0883 ,  C09K11/7731 ,  C09K11/7734 ,  F21K9/00 ,  G02F1/133603 ,  G02F1/133609 ,  H01L33/504 ,  Y02B20/181

    摘要： A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

    摘要翻译： 一种白光发射装置，包括：主波长为443〜455nm的蓝色发光二极管芯片; 配置在蓝色发光二极管芯片周围的红色荧光体，由蓝色发光二极管芯片激发的红色荧光体发射红色光; 以及蓝色发光二极管芯片周围的绿色荧光体，由蓝色发光二极管芯片激发的绿色荧光体发出绿色光，其中，从红色荧光体发出的红色光线具有落在由四个坐标 基于CIE1931色度图的点（0.5448,0.4544），（0.7079,0.2905），（0.6427,0.2905）和（0.4794,0.44633），并且从绿色荧光体发射的绿光具有落在限定的空间内的色坐标 基于CIE 1931色度色彩图，分别为四点坐标（0.1270,0.8037），（0.4117,0.5861），（0.4197,0.5316）和（0.2555,0.5030）。

    LED package and backlight assembly for LCD comprising the same
    54.
    发明授权
    LED package and backlight assembly for LCD comprising the same 失效
    用于LCD的LED封装和背光组件包括相同的

    公开(公告)号：US07385653B2

    公开(公告)日：2008-06-10

    申请号：US10965257

    申请日：2004-10-15

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： G02F1/13357 ,  F21V7/04

    CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An LED package used as a light source in a backlight assembly for an LCD includes a substrate, a plurality of light scattering protrusions on the upper surface of the substrate, LEDs separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, and having an upper surface including two cylindrical surface sections. Each of the cylindrical surface sections has a curvature for totally reflecting light emitted from the LEDs.

    摘要翻译： 在LCD背光组件中用作光源的LED封装包括：衬底，在衬底的上表面上的多个光散射突起，以指定间隔彼此分开并以衬底方式布置的LED， 以及用于密封包括LED的基板的上表面并具有包括两个圆柱形表面部分的上表面的模制部分。 每个圆柱形表面部分具有用于全反射从LED发射的光的曲率。

    Side-emission type LED package
    57.
    发明授权
    Side-emission type LED package 有权
    侧面发射型LED封装

    公开(公告)号：US07473937B2

    公开(公告)日：2009-01-06

    申请号：US11318837

    申请日：2005-12-28

    申请人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    发明人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    IPC分类号： H01L29/22

    CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

    摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

    Vertical light emitting type backlight module
    59.
    发明授权
    Vertical light emitting type backlight module 失效
    垂直发光型背光模组

    公开(公告)号：US07097337B2

    公开(公告)日：2006-08-29

    申请号：US10917383

    申请日：2004-08-13

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： F21V8/00

    CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.

    摘要翻译： 本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。 垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置 基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导 在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于 背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板 在水平方向读取，以将光线的路径改变为垂直方向。

    Light emitting diode device
    60.
    发明授权
    Light emitting diode device 失效
    发光二极管装置

    公开(公告)号：US06972439B1

    公开(公告)日：2005-12-06

    申请号：US10916525

    申请日：2004-08-12

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： G02F1/13357 ,  H01L29/22 ,  H01L33/54 ,  H01L33/60

    CPC分类号： H01L33/54 ,  H01L33/60

    摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.

    摘要翻译： 这里公开了一种发光二极管（LED）装置。 发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜 用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射 镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。