公开(公告)号：US20200211947A1

公开(公告)日：2020-07-02

申请号：US16812356

申请日：2020-03-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John Knickerbocker ,  Bing Dang ,  Raymond Horton ,  Joana Maria

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/683 ,  H01L21/48 ,  H01L21/20 ,  H01L21/768

Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

公开(公告)号：US20200185781A1

公开(公告)日：2020-06-11

申请号：US16787167

申请日：2020-02-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  A61B5/00 ,  H01M10/052 ,  H01M10/04

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US10679887B2

公开(公告)日：2020-06-09

申请号：US15935537

申请日：2018-03-26

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/683 ,  H01L21/78

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US10658182B2

公开(公告)日：2020-05-19

申请号：US16551377

申请日：2019-08-26

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/544 ,  H01L23/498 ,  H01L21/56

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10651507B2

公开(公告)日：2020-05-12

申请号：US15802109

申请日：2017-11-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  H01M10/0525 ,  A61B5/00 ,  H01M10/04 ,  H01M10/052

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US20200035651A1

公开(公告)日：2020-01-30

申请号：US16592296

申请日：2019-10-03

Applicant: International Business Machines Corporation

Inventor： Stephen W. Bedell ,  Bing Dang ,  Ning Li ,  Frank R. Libsch ,  Devendra K. Sadana

IPC: H01L25/075 ,  H01L33/30 ,  H01L33/32

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

公开(公告)号：US10396220B2

公开(公告)日：2019-08-27

申请号：US16246637

申请日：2019-01-14

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Steven Lorenz Wright ,  Cornelia Tsang Yang

IPC: H01L31/00 ,  H01L31/024 ,  H01L31/18

Abstract: A semiconductor structure includes a thin-film device layer, an optoelectronic device disposed in the thin-film device layer, and a surrogate substrate permanently attached to the thin film device layer. The optoelectronic device is excitable by light at an application wavelength. The surrogate substrate is optically transparent and has a thermal conductivity of at least 300 W/m-K. The surrogate substrate has a volume of substrate removed therefrom to form a via. Light passes through the via and at least some of the surrogate substrate prior to reaching the optoelectronic device.

公开(公告)号：US10297479B2

公开(公告)日：2019-05-21

申请号：US15403937

申请日：2017-01-11

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/57 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B23K26/36

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

公开(公告)号：US20190088480A1

公开(公告)日：2019-03-21

申请号：US15709876

申请日：2017-09-20

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US10229288B2

公开(公告)日：2019-03-12

申请号：US15156800

申请日：2016-05-17

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu

IPC: G06F21/00 ,  G06F21/62 ,  G06F19/00 ,  G06F21/32 ,  H04L29/06 ,  G06F21/60

Abstract: A method for providing data security comprises operatively connecting sensing elements with a user, sensing characteristics of the user via the sensing elements, wherein each of the sensing elements comprises at least one unique semiconductor identifier. The at least one unique semiconductor identifier and data concerning the sensed characteristics is transmitted from the sensing elements to a data analytics engine, and at least one unique biological identifier associated with the user is attached to the transmission of the at least one unique semiconductor identifier and the data concerning the sensed characteristics. The method further includes verifying by the data analytics engine that the at least one unique semiconductor identifier of the sensing elements and the at least one biological identifier are valid, analyzing by the data analytics engine the data concerning the sensed characteristics, and generating and transmitting a response based on the analysis.