公开(公告)号：US09625770B2

公开(公告)日：2017-04-18

申请号：US15194506

申请日：2016-06-27

Applicant: INNOLUX CORPORATION

Inventor： Ching-Che Yang ,  Tsung-Han Tsai ,  Chao-Hsiang Wang ,  An-Chang Wang

IPC: G02F1/1343

CPC classification number: G02F1/134309 ,  G02F1/134363 ,  G02F1/13439 ,  G02F2001/134345 ,  G02F2001/134372 ,  G02F2201/123

Abstract: A display panel includes a first substrate, a second substrate and an electrode layer. The first substrate and the second substrate are disposed opposite to each other. The electrode layer is disposed on the first substrate and facing the second substrate, and includes at least a first part and a second part adjacent to the first part. The first part includes a plurality of first branch electrodes disposed along a direction and spaced from each other by a first distance (T). The centers of two adjacent ones of the first branch electrodes are separated by a second distance (P). The first part and the second part have a spacing (S) therebetween. The values of S, T and P satisfy the following equation: 1 2 ⁢ a · ( b + P · m 2 + 1 4 · T 2 P ) - 1.5 ≤ S ≤ 1 2 ⁢ a · ( b + P · m 2 + 1 4 · T 2 P ) + 1.5 wherein, a= 1/12, b=¼, m= 1/10, and the units of S, T and P are micrometer.

公开(公告)号：US09398690B2

公开(公告)日：2016-07-19

申请号：US14480260

申请日：2014-09-08

Applicant: INNOLUX CORPORATION

Inventor： Chia-Cheng Liu ,  Chia-Hsiung Chang ,  An-Chang Wang ,  Chao-Hsiang Wang ,  Yang-Chen Chen

IPC: H01L23/00 ,  H01L23/492 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/111 ,  G02F1/1345 ,  G02F1/13458 ,  H01L23/4922 ,  H01L24/06 ,  H01L24/07 ,  H01L24/09 ,  H01L24/26 ,  H01L24/31 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2225/1041 ,  H01L2924/13069 ,  H01L2924/365 ,  H05K1/092 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/10136

Abstract: A substrate structure includes a first substrate, a plurality of first bonding pads and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is disposed around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The connecting layer is disposed on the first substrate and covers the first bonding pads and the gaps. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.

Abstract translation: 衬底结构包括第一衬底，多个第一接合焊盘和连接层。 第一基板具有元件配置区域和外围区域。 周边区域设置在元件配置区域周围。 第一接合焊盘在外围区域被配置为间隔，并且在两个相邻的第一接合焊盘之间提供间隙。 连接层设置在第一基板上并覆盖第一接合焊盘和间隙。 靠近元件配置区域的连接层的部分被配置有多个第一弧形边缘。