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公开(公告)号:US11380661B2
公开(公告)日:2022-07-05
申请号:US16902463
申请日:2020-06-16
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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公开(公告)号:US10820425B2
公开(公告)日:2020-10-27
申请号:US16446653
申请日:2019-06-20
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K1/00 , H05K1/02 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/36 , H01L21/02 , H01L21/44 , H01L23/48 , H01L23/498 , H01J17/02 , H01J17/34 , H05K1/11 , H05K3/06 , H05K1/14 , G02F1/1345 , H05K3/46
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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公开(公告)号:US10720415B2
公开(公告)日:2020-07-21
申请号:US15698777
申请日:2017-09-08
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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公开(公告)号:US11837592B2
公开(公告)日:2023-12-05
申请号:US17827944
申请日:2022-05-30
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
CPC classification number: H01L25/167 , H01L25/0753 , H01L33/58 , H01L33/52 , H01L33/62 , H01L2933/005 , H01L2933/0033 , H01L2933/0066
Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.
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公开(公告)号:US20190306990A1
公开(公告)日:2019-10-03
申请号:US16446653
申请日:2019-06-20
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K3/32 , G02F1/1345 , H05K3/46 , H05K3/06 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/36 , H05K1/18
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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公开(公告)号:US09681545B2
公开(公告)日:2017-06-13
申请号:US15187371
申请日:2016-06-20
Applicant: INNOLUX CORPORATION
Inventor: Chia-Cheng Liu , Chia-Hsiung Chang , An-Chang Wang , Chao-Hsiang Wang , Yang-Chen Chen
IPC: H05K1/11 , H05K1/09 , H01L23/00 , H05K3/32 , G02F1/1345 , H01L23/492
CPC classification number: H05K1/111 , G02F1/1345 , G02F1/13458 , H01L23/4922 , H01L24/06 , H01L24/07 , H01L24/09 , H01L24/26 , H01L24/31 , H01L24/32 , H01L24/33 , H01L24/83 , H01L2225/1041 , H01L2924/13069 , H01L2924/365 , H05K1/092 , H05K1/117 , H05K3/323 , H05K2201/10136
Abstract: A substrate structure includes a first substrate, a plurality of first bonding pads, a second substrate and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is located around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The first bonding pads are located between the first substrate and the second substrate. The connecting layer is located between the first bonding pads and the second substrate. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.
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公开(公告)号:US11510321B2
公开(公告)日:2022-11-22
申请号:US17188554
申请日:2021-03-01
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Ming-Fu Jiang
Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.
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公开(公告)号:US10825787B2
公开(公告)日:2020-11-03
申请号:US16148253
申请日:2018-10-01
Applicant: InnoLux Corporation
Inventor: Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Tong-Jung Wang
Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.
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公开(公告)号:US09398690B2
公开(公告)日:2016-07-19
申请号:US14480260
申请日:2014-09-08
Applicant: INNOLUX CORPORATION
Inventor: Chia-Cheng Liu , Chia-Hsiung Chang , An-Chang Wang , Chao-Hsiang Wang , Yang-Chen Chen
IPC: H01L23/00 , H01L23/492 , H05K1/11 , H05K1/09
CPC classification number: H05K1/111 , G02F1/1345 , G02F1/13458 , H01L23/4922 , H01L24/06 , H01L24/07 , H01L24/09 , H01L24/26 , H01L24/31 , H01L24/32 , H01L24/33 , H01L24/83 , H01L2225/1041 , H01L2924/13069 , H01L2924/365 , H05K1/092 , H05K1/117 , H05K3/323 , H05K2201/10136
Abstract: A substrate structure includes a first substrate, a plurality of first bonding pads and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is disposed around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The connecting layer is disposed on the first substrate and covers the first bonding pads and the gaps. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.
Abstract translation: 衬底结构包括第一衬底,多个第一接合焊盘和连接层。 第一基板具有元件配置区域和外围区域。 周边区域设置在元件配置区域周围。 第一接合焊盘在外围区域被配置为间隔,并且在两个相邻的第一接合焊盘之间提供间隙。 连接层设置在第一基板上并覆盖第一接合焊盘和间隙。 靠近元件配置区域的连接层的部分被配置有多个第一弧形边缘。
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公开(公告)号:US20180270961A1
公开(公告)日:2018-09-20
申请号:US15917860
申请日:2018-03-12
Applicant: Innolux Corporation
Inventor: Wei-Cheng Chu , Chia-Cheng Liu , Chih-Yuan Lee , Chin-Lung Ting , Tong-Jung Wang
IPC: H05K3/32 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/06 , H05K3/46 , H05K3/36 , H05K1/14 , G02F1/1345
CPC classification number: H05K3/32 , G02F1/13452 , G02F1/13458 , H05K1/028 , H05K1/111 , H05K1/14 , H05K1/181 , H05K1/189 , H05K3/06 , H05K3/323 , H05K3/361 , H05K3/4644 , H05K2201/0367 , H05K2201/10378 , H05K2203/0502
Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
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