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80 条记录 (耗时 0.026 秒)

    Method for manufacturing semiconductor chip
    51.
    发明授权
    Method for manufacturing semiconductor chip 有权
    制造半导体芯片的方法

    公开(公告)号：US07335578B2

    公开(公告)日：2008-02-26

    申请号：US10490557

    申请日：2003-04-09

    申请人： Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Yasuhiko Oyama ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

    发明人： Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Yasuhiko Oyama ,  Shigeru Danjo ,  Masahiko Kitamura ,  Koichi Yajima

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6835 ,  B24B7/228 ,  B24B41/068 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10S438/977

    摘要： A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.

    摘要翻译： 在由街道划分的区域中形成电路的半导体晶片（W）被分成具有单独电路的半导体芯片。 通过在半导体晶片（W）和支撑板（13）之间插入粘合剂片（其粘合力被刺激而降低），半导体晶片（W）的前侧被粘附到支撑板（13），由此 暴露半导体晶片（W）的背面（10）。 研磨具有支撑板（13）的半导体晶片（W）的背面（10）。 研磨完成后，将保持有背面（10）的半导体晶片（W）切成半导体芯片（C）。 给予粘合片刺激以降低粘合力，并且将半导体芯片（C）从支撑板（13）移除。 半导体晶片和半导体芯片总是由支撑板支撑，避免损坏和变形。

    TOC component removing apparatus and process for removing TOC components
    53.
    发明申请
    TOC component removing apparatus and process for removing TOC components 失效
    TOC成分除去装置及去除TOC成分的处理

    公开(公告)号：US20060016764A1

    公开(公告)日：2006-01-26

    申请号：US11181896

    申请日：2005-07-15

    申请人： Satoshi Hayashi

    发明人： Satoshi Hayashi

    IPC分类号： C02F1/32

    CPC分类号： C02F1/32 ,  C02F1/42 ,  C02F1/444 ,  C02F1/725 ,  C02F9/00 ,  C02F2103/04 ,  C02F2301/046 ,  C02F2305/10

    摘要： A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.

    摘要翻译： 本发明的TOC成分除去装置是用于除去超纯水或纯水中含有的超纯水或纯水的处理槽2中的TOC成分，多个球状催化剂粒子3，其表面为 光催化剂，将催化剂颗粒3保持在一个表面31a上的片状半透明保持体4和布置在半透明保持体4附近的紫外线光源5，并且辐射波长为254nm的紫外线。

    Piezoelectric type actuator
    56.
    发明授权
    Piezoelectric type actuator 失效
    压电式执行器

    公开(公告)号：US5004945A

    公开(公告)日：1991-04-02

    申请号：US410525

    申请日：1989-09-22

    申请人： Masahiro Tomita ,  Satoshi Hayashi ,  Shinro Oda ,  Akira Fujii ,  Masayoshi Tanigawa

    发明人： Masahiro Tomita ,  Satoshi Hayashi ,  Shinro Oda ,  Akira Fujii ,  Masayoshi Tanigawa

    IPC分类号： H01L41/053 ,  H01L41/083 ,  H02N2/04

    CPC分类号： H01L41/0536 ,  H01L41/083

    摘要： According to the present invention there is provided a piezoelectric type actuator wherein a compressive force is exerted on a piezoelectric laminate, using a coil spring having a relatively small spring constant and a coned disc spring having a relatively large spring constant, the said compressive force being in the range of 4.0 to 50 in terms of the ratio of the spring constant of the coned disc spring to that of the coil spring.Under the above construction, the performance of the piezoelectric laminate is not deteriorated under any conditions during use, and the size of the piezoelectric type actuator can be reduced.

    摘要翻译： 根据本发明，提供了一种压电式致动器，其中使用具有相对小的弹簧常数的螺旋弹簧和具有相对较大的弹簧常数的锥形弹簧将压缩力施加在压电层压板上，所述压缩力为 在盘形弹簧的弹簧常数与螺旋弹簧的弹簧常数之比为4.0〜50的范围内。 在上述结构中，压电层叠体的性能在使用过程中的任何条件下都不会劣化，并且可以减小压电型致动器的尺寸。

    Printing apparatus and printing method
    59.
    发明授权
    Printing apparatus and printing method 有权
    印刷装置和印刷方法

    公开(公告)号：US08950843B2

    公开(公告)日：2015-02-10

    申请号：US12787634

    申请日：2010-05-26

    申请人： Yuhei Oikawa ,  Taku Yokozawa ,  Kazuo Suzuki ,  Satoshi Hayashi

    发明人： Yuhei Oikawa ,  Taku Yokozawa ,  Kazuo Suzuki ,  Satoshi Hayashi

    IPC分类号： B41J29/38

    CPC分类号： B41J29/38 ,  B41J2/0456 ,  B41J2/04563 ,  B41J2/0458

    摘要： There is an object of providing a printing apparatus which can restrict a variation in ejection characteristic of an ink droplet due to a temperature change of a printing head to restrict degradation in an image. The printing apparatus adjusts temperatures of the print head to first and second temperature so as to measure ejection characteristics of the print head at the first and second temperature. Then, a driving condition is generated based on the measured ejection characteristics and a printing is performed based on the measured ejection characteristics.

    摘要翻译： 本发明的目的是提供一种打印装置，其可以限制由于打印头的温度变化引起的墨滴的喷射特性的变化，从而限制图像的劣化。 打印装置将打印头的温度调节到第一和第二温度，以便测量在第一和第二温度下的打印头的喷射特性。 然后，基于测量的喷射特性产生驱动条件，并且基于测量的喷射特性进行打印。