摘要:
An integrated circuit system that includes: providing a substrate including a first region and a second region; forming a first device over the first region and a resistance device over the second region; forming a first dielectric layer and a second dielectric layer over the substrate; removing a portion of the second dielectric layer; and annealing the integrated circuit system to remove dopant from the resistance device.
摘要:
A method of forming a semiconductor device is presented. The method includes providing a substrate. The method further includes forming a gate stack having a gate electrode on the substrate, which includes forming a metal gate electrode layer. A buffer gate electrode layer is formed on top of the metal gate electrode layer and a top gate electrode layer having a poly-silicon alloy is formed over the metal gate electrode layer.
摘要:
A hybrid orientation substrate includes a base substrate having a first orientation, a first surface layer having a first orientation disposed on the base substrate in a first region, and a second surface layer disposed on the base substrate in a second region. The second surface layer has an upper sub-layer having a second orientation, and a lower sub-layer between the base substrate and the upper sub-layer. The lower sub-layer having a first stress induces a second stress on the upper sub-layer.
摘要:
A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second structural parameter associated therewith, wherein a value of one of the first and a second structural parameter of each device is selected to provide a value of a performance parameter of the device substantially equal to a predetermined reference value, the predetermined reference value being the same for each device.
摘要:
A hybrid orientation substrate includes a base substrate having a first orientation, a first surface layer having a first orientation disposed on the base substrate in a first region, and a second surface layer disposed on the base substrate in a second region. The second surface layer has an upper sub-layer having a second orientation, and a lower sub-layer between the base substrate and the upper sub-layer. The lower sub-layer having a first stress induces a second stress on the upper sub-layer.
摘要:
A method of making a semiconductor device is disclosed. A semiconductor body, a gate electrode and source/drain regions are provided. A liner is provided that covers the gate electrode and the source/drain regions. Silicide regions are formed on the semiconductor device by etching a contact hole through the liner.
摘要:
Embodiments of the invention provide a method of forming a field-effect-transistor (FET). The method includes implanting one or more n-type dopants to create one or more implanted regions with at least a portion of the implanted regions being designated as regions for forming source and drain extensions of the FET; activating the implanted regions; etching with a chlorine based etchant to create openings in the implanted regions, and forming the source and drain extensions by exptaxially growing embedded silicon germanium in the openings. Structure of a semiconductor field-effect-transistor made thereof is also provided.
摘要:
The invention describes a novel test structure and process to create the structure for performing automatic dynamic stress testing of PMOS devices for Negative Bias Temperature Instability (NBTI). The invention consists of an integrated inverter, two integrated electronic switches for switching from stress mode to device DC characterization measurement mode, and a PMOS FET device under test (DUT). The inverter assures the proper 180 degree phase relationship between the test device source and gate voltage while the imbedded electronic switches provide isolation of the test device during DC characterization testing. Another embodiment of the invention enables the testing of multiple devices under test (DUT's).
摘要:
A method for forming a semiconductor device is disclosed. The method includes providing a substrate prepared with a second gate structure. An inter-gate dielectric is formed on the substrate and over the second gate. A first gate is also formed. The first gate is adjacent to and separated from the second gate by the inter-gate dielectric. The substrate is patterned to form a split gate structure with the first and second adjacent gates. The split gate structure is provided with an e-field equalizer adjacent to the first gate. The e-field equalizer improves uniformity of e-field across the first gate during operation.
摘要:
Embodiments of the invention provide a method of forming a field-effect-transistor (FET). The method includes implanting one or more n-type dopants to create one or more implanted regions with at least a portion of the implanted regions being designated as regions for forming source and drain extensions of the FET; activating the implanted regions; etching with a chlorine based etchant to create openings in the implanted regions, and forming the source and drain extensions by exptaxially growing embedded silicon germanium in the openings. Structure of a semiconductor field-effect-transistor made thereof is also provided.