公开(公告)号：US20150325760A1

公开(公告)日：2015-11-12

申请号：US14274872

申请日：2014-05-12

Applicant: NICHIA CORPORATION

Inventor： Ryoma SUENAGA ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/36

CPC classification number: H01L33/62 ,  H01L24/96 ,  H01L25/167 ,  H01L33/005 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.

Abstract translation: 发光器件包括发光元件，端子基板和固定元件。 发光元件是具有第一半导体层，发光层和第二半导体层的半导体层叠体，其顺序层叠，与第一半导体层连接的第一电极和与第二半导体连接的第二电极 层。 端子基板包括连接到第一电极和第二电极的一对端子和固定端子的绝缘体层。 端子基板的外边缘的至少一部分比半导体层叠体的外边缘更靠近发光器件的中心。 固定构件固定发光元件和端子基板。

公开(公告)号：US20140252582A1

公开(公告)日：2014-09-11

申请号：US14196805

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract translation: 可以承受与半导体元件的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括多个连接的单元，每个单元包括彼此间隔开并相对布置的一对引线部分，用于安装半导体元件并电连接到半导体元件的一对电极。 引线部分分别包括布置在其表面上以安装半导体元件的元件安装区域和从远离端面的方向从一对引线部分的每一个的相对端表面延伸的凹槽，并在周围 方式沿着元件安装区域的外周。

公开(公告)号：US20130257264A1

公开(公告)日：2013-10-03

申请号：US13852332

申请日：2013-03-28

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takayoshi WAKAKI ,  Tadao HAYASHI ,  Yoshiki SATO ,  Daisuke OYAMATSU ,  Takafumi SUGIYAMA ,  Takao KOSUGI

IPC: H01L31/055 ,  H05B33/12 ,  B05D5/06 ,  F21V7/00

CPC classification number: F21V9/30 ,  B05D5/06 ,  C23C16/45525 ,  F21K9/60 ,  F21V7/00 ,  F21V13/08 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L31/055 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05B33/12 ,  Y02E10/52 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/24421 ,  H01L2924/00014

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.