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    LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
    3.
    发明公开
    LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME 审中-公开

    公开(公告)号：US20230221485A1

    公开(公告)日：2023-07-13

    申请号：US18188453

    申请日：2023-03-22

    Applicant: NICHIA CORPORATION

    Inventor： Tadao HAYASHI

    IPC: F21V8/00

    CPC classification number: G02B6/0031 ,  G02B6/0021

    Abstract: A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

    LIGHT-EMITTING MODULE
    4.
    发明申请
    LIGHT-EMITTING MODULE 有权

    公开(公告)号：US20210167048A1

    公开(公告)日：2021-06-03

    申请号：US17151904

    申请日：2021-01-19

    Applicant: NICHIA CORPORATION

    Inventor： Daisuke KASAI ,  Tadao HAYASHI ,  Toru HASHIMOTO

    IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00

    Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.

    METHOD OF MANUFACTURING LIGHT EMITTING MODULE AND LIGHT EMITTING MODULE
    5.
    发明申请
    METHOD OF MANUFACTURING LIGHT EMITTING MODULE AND LIGHT EMITTING MODULE 审中-公开

    公开(公告)号：US20190049649A1

    公开(公告)日：2019-02-14

    申请号：US16024018

    申请日：2018-06-29

    Applicant: NICHIA CORPORATION

    Inventor： Tadao HAYASHI ,  Ryohei YAMASHITA ,  Yusaku ACHI ,  Mamoru IMADA

    IPC: F21V8/00 ,  H01L33/50

    Abstract: A method of manufacturing a light emitting module according to the present disclosure includes: preparing a light guide plate that comprises a first main surface serving as a light-emitting surface and a second main surface opposite to the first main surface; respectively providing light emitting elements on the second main surface so as to correspond to each of a plurality of optically functional portions provided on the first main surface of the light guide plate; and forming wires electrically connecting the plurality of light emitting elements.

    LIGHT EMITTING DEVICE
    6.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20190006568A1

    公开(公告)日：2019-01-03

    申请号：US16022476

    申请日：2018-06-28

    Applicant: NICHIA CORPORATION

    Inventor： Tadao HAYASHI

    IPC: H01L33/60 ,  H01L33/40 ,  H01L33/52 ,  H01L33/38 ,  H01L33/50

    Abstract: A light emitting device includes: a light emitting element comprising: a semiconductor multilayer structure that has an electrode formation surface, a light-emitting surface opposite to the electrode formation surface, and side surfaces between the electrode formation surface and the light-emitting surface, and a pair of electrodes provided on the electrode formation surface; a covering member covering the side surfaces of the light emitting element; and an optical member disposed over the light-emitting surface of the light emitting element and an upper surface of the covering member, the optical member comprising: a light-reflective portion disposed above the light emitting element, and a light-transmissive portion disposed between the light-reflective portion and the covering member and forming a part of an outer side surface of the light emitting device.

    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF FABRICATING THE SAME 有权
    半导体发光装置及其制造方法

    公开(公告)号：US20140097462A1

    公开(公告)日：2014-04-10

    申请号：US14083477

    申请日：2013-11-19

    Applicant: NICHIA CORPORATION

    Inventor： Ryo SUZUKI ,  Tadao HAYASHI

    IPC: H01L33/36

    CPC classification number: H01L33/36 ,  H01L24/80 ,  H01L33/20 ,  H01L33/38 ,  H01L2924/01012 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00

    Abstract: A light-emitting apparatus has a light-emitting device and a supporting board. The light-emitting device has a pair of n-electrodes with a p-electrode therebetween, on the same plane. The supporting board includes an insulating substrate on which positive and negative electrodes are formed, opposing to the p- and n-electrodes of the light-emitting device, respectively. Bonding members bond the p- and n-electrodes with the positive and negative electrodes, respectively. The positive electrode on the supporting board is formed within the width region of the p-electrode and narrower in width than the width of the p-electrode, in a cross-section along a line extending through the pair of n-electrodes. The negative electrodes oppose to the n-electrodes, respectively, with the same widths, or with that side face of each of the negative electrodes which faces the positive electrode being retracted outwardly from that side face of each of the n-electrodes which faces the p-electrode.

    Abstract translation: 发光装置具有发光装置和支撑基板。 发光装置在同一平面上具有一对具有p电极的n电极。 支撑板包括分别与发光器件的p电极和n电极相对形成有正极和负极的绝缘基板。 接合部件分别将p电极和n电极与正电极和负电极接合。 沿着延伸穿过该对n电极的线的横截面，支撑板上的正电极形成在p电极的宽度区域内并且宽度比p电极的宽度窄。 负电极分别以相同的宽度与n电极相对，或者与面对正电极的每个负电极的侧面从面向每个电极的每个n电极的侧面向外缩回 p电极。

    LIGHT-EMITTING MODULE
    9.
    发明申请
    LIGHT-EMITTING MODULE 审中-公开

    公开(公告)号：US20200043903A1

    公开(公告)日：2020-02-06

    申请号：US16529309

    申请日：2019-08-01

    Applicant: NICHIA CORPORATION

    Inventor： Daisuke KASAI ,  Tadao HAYASHI ,  Toru HASHIMOTO

    IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00

    Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
    10.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开

    公开(公告)号：US20190067537A1

    公开(公告)日：2019-02-28

    申请号：US16109177

    申请日：2018-08-22

    Applicant: NICHIA CORPORATION

    Inventor： Tadao HAYASHI

    IPC: H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/50 ,  H01L33/54

    Abstract: A light emitting device including a light emitting element, a light transmissive member, a light guide member, and a light reflective member. The light transmissive member is disposed on an upper surface of the light emitting element, and has a lower surface including a first region facing the light emitting element and a second region positioned outside of the first region. The light guide member covers a lateral surface of the light emitting element and the second region of the lower surface of the light transmissive member. The light reflective member covers the light emitting element, an upper surface of the light transmissive member and the light guide member. One of lateral surfaces of the light transmissive member is exposed from the light reflective member.

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