公开(公告)号：US20240284640A1

公开(公告)日：2024-08-22

申请号：US18648845

申请日：2024-04-29

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/26 ,  H01M8/04007 ,  H01M8/04089 ,  H01M8/04119 ,  H05K7/14

CPC classification number: H05K7/208 ,  G06F1/26 ,  H01M8/04052 ,  H01M8/04097 ,  H01M8/04156 ,  H05K7/1485

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, method for operating a datacenter includes receiving a source of gas to a fuel cell to produce electrical power. The method further includes providing the electrical power to one or more electronic components in the datacenter. The method further includes capturing waste heat, generated by the fuel cell in converting the gas to the electrical power, using a heat exchanger. The method further includes providing the waste heat to an absorption chiller to produce cooled liquid to be utilized with a cooling system to remove heat from the one or more electronic components.

公开(公告)号：US20240098945A1

公开(公告)日：2024-03-21

申请号：US17870481

申请日：2022-07-21

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/20 ,  H05K7/208

Abstract: Systems and methods include a first valve that controls a flow rate of a coolant. A processor is configured to set the flow rate of the coolant to a rate that maintains a vapor quality, measured at an outlet of the coolant, within a predetermined quality range.

公开(公告)号：US20240098934A1

公开(公告)日：2024-03-21

申请号：US17864989

申请日：2022-07-14

Applicant: NVIDIA Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20 ,  G01F1/34

CPC classification number: H05K7/20272 ,  G01F1/34 ,  H05K7/20772

Abstract: Systems and methods include pressure sensors that measure a pressure differential of coolant between a first coolant line and a second coolant line. Coolant flow control valves control respective valve flow rates. A processor selects a valve from the flow control valves to provide coolant to a coolant output, responsive to the measured pressure differential.

公开(公告)号：US11895808B2

公开(公告)日：2024-02-06

申请号：US16885105

申请日：2020-05-27

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/00 ,  G05B13/02 ,  G05B19/05 ,  G06N3/04 ,  G06N3/08

CPC classification number: H05K7/20836 ,  G05B13/00 ,  G05B13/0265 ,  G05B19/05 ,  G06N3/04 ,  G06N3/08 ,  H05K7/20827 ,  G05B2219/2614

Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a refrigerant cooling loop to extract heat from a secondary cooling loop that is located within the datacenter or to provide supplemental cooling to one or more components of the datacenter that are coupled to the secondary cooling loop.

公开(公告)号：US11829213B2

公开(公告)日：2023-11-28

申请号：US16925082

申请日：2020-07-09

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G06N20/00 ,  G05B19/02 ,  F25B41/00 ,  F25B41/40

CPC classification number: G06F1/20 ,  F25B41/40 ,  G05B19/02 ,  G06N20/00 ,  G05B2219/2614 ,  G06F2200/201

Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.

公开(公告)号：US20230363116A1

公开(公告)日：2023-11-09

申请号：US18215611

申请日：2023-06-28

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20781 ,  H05K7/1489 ,  H05K7/20281 ,  H05K7/20836 ,  H05K7/20272 ,  G06N3/02

Abstract: A system includes one or more manifolds having at least one fixed flow controller and at least one movable flow controller.

公开(公告)号：US11812589B2

公开(公告)日：2023-11-07

申请号：US17318797

申请日：2021-05-12

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant distribution unit (RDU) distributes first refrigerant from a refrigerant reservoir to one or more cold plates to extract heat from at least one computing device and also interfaces between a first refrigerant cooling loop having a first refrigerant and a second refrigerant cooling loop, so that a second refrigerant cooling loop uses second refrigerant to dissipate at least part of such heat through a second condenser unit to an ambient environment.

公开(公告)号：US20230301034A1

公开(公告)日：2023-09-21

申请号：US18325915

申请日：2023-05-30

Applicant: NVIDIA Corporation

Inventor： Harold Miyamura ,  Jeremy Rodriguez ,  Ali Heydari

IPC: H05K7/20 ,  F16M13/02 ,  H05K7/14

CPC classification number: H05K7/20781 ,  F16M13/02 ,  H05K7/1488 ,  H05K7/20272

Abstract: A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.

公开(公告)号：US11700713B2

公开(公告)日：2023-07-11

申请号：US16923920

申请日：2020-07-08

Applicant: Nvidia Corporation

Inventor： Harold Miyamura ,  Jeremy Rodriguez ,  Ali Heydari

IPC: H05K7/20 ,  F16M13/02 ,  H05K7/14

CPC classification number: H05K7/20781 ,  F16M13/02 ,  H05K7/1488 ,  H05K7/20272

Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.

公开(公告)号：US20230217632A1

公开(公告)日：2023-07-06

申请号：US17568274

申请日：2022-01-04

Applicant: Nvidia Corporation

Inventor： Jeremy Rodriguez ,  Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20272 ,  H05K7/20818

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a plurality of in-rack coolant distribution units (IRCDUs) include a first IRCDU and a second IRCDU that are interchangeable within a rack depending on a type of coolant to be provided to a rack from a coolant distribution unit (CDU), so that a first IRCDU that is calibrated to a first coolant can distribute a first coolant and a second IRCDU that is calibrated to a second coolant can distribute a second coolant to a rack manifold of a rack.