摘要:
An exemplary method of processing a polycrystalline diamond element is disclosed. According to the method, a protective layer may be formed over only a selected portion of a polycrystalline diamond element. The polycrystalline diamond element may include a polycrystalline diamond table. At least a portion of the polycrystalline diamond element may be exposed to a leaching solution such that the leaching solution contacts an exposed surface region of the polycrystalline diamond table and at least a portion of the protective layer. The protective layer may be substantially impermeable to the leaching solution. An exemplary method of manufacturing a polycrystalline diamond element is also disclosed.
摘要:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要:
Embodiments of the invention relate to methods of fabricating a polycrystalline diamond compacts and applications for such polycrystalline diamond compacts. In an embodiment, a method of fabricating a polycrystalline diamond compact includes at least saturating a sintering aid material with non-diamond carbon to form a carbon-saturated sintering aid material and sintering a plurality of diamond particles in the presence of the carbon-saturated sintering aid particles to form a polycrystalline diamond table.
摘要:
Embodiments relate to methods of fabricating PCD materials by subjecting a mixture that exhibits a broad diamond particle size distribution to an HPHT process, PCD materials so-formed, and PDCs including a polycrystalline diamond table comprising such PCD materials. In an embodiment, a PCD material includes a plurality of bonded diamond grains that exhibit a substantially unimodal diamond grain size distribution characterized, at least in part, by a parameter θ that is less than about 1.0. θ = x 6 · σ , where x is the average grain size of the substantially unimodal diamond grain size distribution, and σ is the standard deviation of the substantially unimodal diamond grain size distribution.
摘要翻译:实施方案涉及通过使表现出宽金刚石粒度分布的混合物经受HPHT方法,所形成的PCD材料和包括包含这种PCD材料的多晶金刚石台的PDC来制造PCD材料的方法。 在一个实施方案中,PCD材料包括多个结合的金刚石晶粒,其表现出基本上单峰金刚石晶粒尺寸分布,其至少部分地由参数和特征表征; 小于约1.0。 &thetas; = x 6·&sgr ,其中x是基本上单峰金刚石晶粒尺寸分布的平均晶粒尺寸, 是基本上单峰金刚石晶粒尺寸分布的标准偏差。
摘要:
Embodiments relate to polycrystalline diamond compacts (“PDCs”) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (“PCD”) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm3/grams or less.
摘要:
Embodiments relate to rotary drill bits that employ superabrasive cutting elements including a diamond-silicon carbide composite table. In an embodiment, a rotary drill bit includes a bit body configured to engage a subterranean formation. The bit body includes a plurality of blades. The rotary drill bit further includes a plurality of superabrasive cutting elements. Each of the superabrasive cutting elements is attached to a corresponding one of the cutting blades. At least one of the superabrasive cutting elements includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix.
摘要:
Embodiments of the present invention relate to superabrasive materials, superabrasive compacts employing such superabrasive materials, and methods of fabricating such superabrasive materials and compacts. In one embodiment, a superabrasive material includes a matrix comprising a plurality of coarse-sized superabrasive grains, with the coarse-sized superabrasive grains exhibiting a coarse-sized average grain size. The superabrasive material further includes a plurality of superabrasive regions dispersed within the matrix, with each superabrasive region including a plurality of fine-sized superabrasive grains exhibiting a fine-sized average grain size less than the coarse-sized average grain size. In another embodiment, the superabrasive materials may be employed in a superabrasive compact. The superabrasive compact comprises a substrate including a superabrasive table comprising any of the disclosed superabrasive materials. Further embodiments are directed to applications utilizing the disclosed superabrasive articles in applications, such as rotary drill bits.
摘要:
Embodiments of the present invention relate to diamond-silicon carbide composites, superabrasive compacts including such diamond-silicon carbide composites, and methods of fabricating such diamond-silicon carbide composites and superabrasive compacts. In one embodiment, a superabrasive compact includes a substrate and a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including a matrix comprising nanometer-sized silicon carbide grains and micrometer-sized diamond grains dispersed through the matrix. In another embodiment, a method of fabricating a superabrasive compact is disclosed. An assembly comprising a mixture including diamond particles and silicon is formed. The silicon comprises amorphous silicon, crystalline silicon crystallized from amorphous silicon formed by a milling process, or combinations thereof. A substrate is positioned in proximity to the mixture. The assembly is subjected to heat and pressure to form a superabrasive compact comprising a superabrasive table bonded to the substrate. The superabrasive table comprises diamond-silicon carbide composite including diamond grains dispersed through a matrix of silicon carbide grains.