公开(公告)号：US20240112968A1

公开(公告)日：2024-04-04

申请号：US18285389

申请日：2022-03-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L23/14 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/142 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L23/49816 ,  H01L2224/13111 ,  H01L2224/16227

Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.

公开(公告)号：US20210302472A1

公开(公告)日：2021-09-30

申请号：US17214785

申请日：2021-03-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01R1/073

Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

公开(公告)号：US20210302471A1

公开(公告)日：2021-09-30

申请号：US17211812

申请日：2021-03-24

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/067 ,  G01R1/073

Abstract: Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.

公开(公告)号：US20210239735A1

公开(公告)日：2021-08-05

申请号：US17161460

申请日：2021-01-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073

Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.

公开(公告)号：US20210221091A1

公开(公告)日：2021-07-22

申请号：US17128758

申请日：2020-12-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B32B3/26 ,  B32B7/12 ,  B32B15/20 ,  B32B15/04 ,  B32B43/00 ,  B32B37/12 ,  C25D11/04

Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.

公开(公告)号：US20210136927A1

公开(公告)日：2021-05-06

申请号：US17087261

申请日：2020-11-02

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H05K3/46 ,  H05K1/03

Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

公开(公告)号：US20210050236A1

公开(公告)日：2021-02-18

申请号：US16989431

申请日：2020-08-10

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  H01L21/683 ,  B65G47/91

Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.

公开(公告)号：US20200220042A1

公开(公告)日：2020-07-09

申请号：US16734175

申请日：2020-01-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/64

Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

公开(公告)号：US20200166161A1

公开(公告)日：2020-05-28

申请号：US16685906

申请日：2019-11-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: F16L13/02 ,  F16L39/00

Abstract: The present invention relates to a joined component used in a semiconductor manufacturing process or a display manufacturing process, in which the joined component is formed by welding parent members by friction stir welding.

公开(公告)号：US20190357395A1

公开(公告)日：2019-11-21

申请号：US16414521

申请日：2019-05-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H05K13/04 ,  H01L27/32 ,  H01L33/36 ,  H01L33/08 ,  H01L33/00

Abstract: The present invention provides a system for transferring a micro LED, the system transferring more efficiently a micro LED dropped in a solution.