摘要:
A method is provided for creating a barrier layer (217) on a substrate comprising a dielectric layer (203) and a metal interconnect (211). In accordance with the method, the substrate is treated with a first plasma comprising helium, thereby forming a treated substrate. The treated substrate is then exposed to a second plasma selected from the group consisting of oxidizing plasmas and reducing plasmas. Next, a barrier layer is created on the treated substrate.
摘要:
A transfer and positioning apparatus includes a positioning assembly located between the tracks of a dual lane conveyor and upstream of a lane changer. The positioning assembly includes a retractable shaft for stopping a carrier along a first conveyor adjacent the assembly. A pair of gripper arms are pivotally mounted to move between an open position permitting the carrier to pass along the conveyor track, and a closed position with forward ends in contact with a specimen container on the carrier to position the container in a reference location for direct processing. The lane changer includes a shuttle depending from an overhead support with a pair of arms for receiving and shifting a specimen carrier from one conveyor to a second conveyor of a dual-conveyor track. The shuttle is operable to retain a specimen carrier along either the first or second conveyor and to release a specimen carrier along either the first or second conveyor. Sensors are located to detect the presence of a specimen carrier at each of the retention locations, and to confirm the release of a specimen carrier from the shuttle along each of the conveyors. A queue is positioned upstream of the positioning assembly and includes retractable shafts, sensors and scanners for selectively retaining, detecting and scanning identification data from a specimen carrier on either conveyor upstream of the shuttle.
摘要:
The combination scooter/backpack is an article carrying device with the capacity to be converted into a wheeled land vehicle, and therefore has two modes of usage. The article carrying device resembles a conventional backpack with two straps positioned to be placed over the user's shoulders, entitled backpack mode. The wheeled land vehicle functions as a popular collapsible scooter, two wheels mounted upon a board member with propulsion means provided by user's contact with the ground, entitled scooter mode. A horizontal handlebar is positioned at the top of the combination and serves to steer the front wheel during scooter mode. Conversion between backpack mode and scooter mode is accomplished with the raising and lowering of said handlebar and the manipulation of releasable fasteners and latches. In both backpack and scooter modes, a cover circumferentially surrounds the combination scooter/backpack to secure and protect components that are not in use.
摘要:
A process can be used to achieve the benefits of corner rounding of a semiconductor layer near an edge of a trench field isolation region without having the bird's beak or stress issues that occur with a conventional SOI device. A trench can be partially etched into a semiconductor layer, and a liner layer may be formed to help round corners of the second semiconductor layer. In one embodiment, the trench can be etched deeper and potentially expose an underlying buried oxide layer. Formation of the trench field isolation region can be completed, and electronic components can be formed within the semiconductor layer. An electronic device, such as an integrated circuit, will have a liner layer that extends only partly, but not completely, along a sidewall of the trench. In another embodiment, the process can be extended to other substrates and is not limited only to SOI substrates.
摘要:
A backend semiconductor fabrication process includes forming an interlevel dielectric (ILD) overlying a wafer substrate by forming a low K dielectric (K
摘要:
A method for forming trench isolation in an SOI substrate begins with a pad oxide followed by an antireflective coating (ARC) over the upper semiconductor layer of the SOI substrate. The pad oxide is kept to a thickness not greater than about 100 Angstroms. An opening is formed for the trench isolation that extends into the oxide below the upper semiconductor layer to expose a surface thereof. The pad oxide is recessed along its sidewall with an isotropic etch. This is followed by a thin, not greater than 50 Angstroms, oxide grown along the sidewall of the opening. This grown oxide avoids forming a recess between the ARC and the pad oxide and also avoids forming a void between the surface of the lower oxide layer and the grown oxide. This results in avoiding polysilicon stringers when the subsequent polysilicon gate layer is formed.
摘要:
The present invention discloses a hand-held body massager having a transverse housing with a massage region. A massage unit is oriented within the housing for parting a massage effect from the massage region. A pair of elongate arms are each pivotally connected to opposed ends of the housing with the massage region oriented therebetween. Each arm includes a handle to be grasped by a user so that the user may urge the massage region against a target surface of the user's body.
摘要:
A method and system for generating power include using a cogeneration power system having a gas turbine. The gas turbine has a compressor section for receiving air to be compressed. The compressed air is fed to a combustor section where it is mixed with fuel and the fuel is burned to produce heated combustion gas. The heated combustion gas is expanded in an expander section to generate shaft work which is used to drive a generator or alternator for producing electric power. The heated combustion gas leaves the expander as turbine exhaust which is cooled by transferring at least part of its heat to the air ahead of the combustor.
摘要:
An inductively-coupled hydrogen plasma (ICP) is used to passivate a plasma-enhanced chemical vapor deposition reactor following an in situ cleaning step. The hydrogen ICP effectively removes the fluorine and hydrogen that typically become impregnated in the walls of the reaction chamber during the in situ clean and thereby reduces the amount of “outgassing” that occurs during subsequent deposition cycles. This outgassing may cause the film of deposition material that normally forms on the walls to flake, significantly reducing the yield of usable devices. The hydrogen ICP passivation process has been found particularly effective in conjunction with the deposition of heavily-doped silicon oxide layers.