公开(公告)号：US20230262975A1

公开(公告)日：2023-08-17

申请号：US17745639

申请日：2022-05-16

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H01L27/11546 ,  H01L27/11524 ,  H01L21/28 ,  H01L29/66 ,  H01L27/11529

CPC classification number: H01L27/11546 ,  H01L27/11524 ,  H01L29/40114 ,  H01L29/66825 ,  H01L27/11529 ,  H01L29/42328

Abstract: A method of forming a device on a semiconductor substrate having first, second, third and dummy areas, includes recessing the substrate upper surface in the first, second and dummy areas, forming a first conductive layer over the substrate, removing the first conductive layer from the third area and a second portion of the dummy area, forming a first insulation layer over the substrate, forming first trenches through the first insulation layer and into the substrate in the third area and the second portion of the dummy area, forming second trenches through the first insulation layer, the first conductive layer and into the substrate in the first and second areas and a first portion of the dummy area, and filling the first and second trenches with insulation material. Then, memory cells are formed in the first area, HV devices in the second area and logic devices in the third area.

公开(公告)号：US11621335B2

公开(公告)日：2023-04-04

申请号：US17701840

申请日：2022-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: G11C11/34 ,  H01L29/423 ,  H01L29/788 ,  H01L29/66 ,  G11C16/04

Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

公开(公告)号：US11508442B2

公开(公告)日：2022-11-22

申请号：US17074103

申请日：2020-10-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Leo Xing ,  Chunming Wang ,  Xian Liu ,  Nhan Do ,  Guangming Lin ,  Yaohua Zhu

IPC: G11C16/12 ,  G11C16/26 ,  G11C16/14

Abstract: The present invention relates to a flash memory device that uses strap cells in a memory array of non-volatile memory cells as source line pull down circuits. In one embodiment, the strap cells are erase gate strap cells. In another embodiment, the strap cells are source line strap cells. In another embodiment, the strap cells are control gate strap cells. In another embodiment, the strap cells are word line strap cells.

公开(公告)号：US20220278119A1

公开(公告)日：2022-09-01

申请号：US17339880

申请日：2021-06-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  Chunming Wang ,  Leo Xing ,  Xian Liu ,  Nhan Do

IPC: H01L27/11529

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the three areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in all three areas, forming a protective layer in the first and second areas and then removing the third conductive layer from the third area, then forming blocks of dummy conductive material in the third area, then etching in the first and second areas to form select and HV gates, and then replacing the blocks of dummy conductive material with blocks of metal material.

公开(公告)号：US20220216316A1

公开(公告)日：2022-07-07

申请号：US17701840

申请日：2022-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L29/423 ,  H01L29/66 ,  G11C16/04 ,  H01L29/788

Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

公开(公告)号：US11362100B2

公开(公告)日：2022-06-14

申请号：US17069563

申请日：2020-10-13

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Steven Lemke ,  Hieu Van Tran ,  Nhan Do

IPC: H01L27/11517 ,  H01L27/11529 ,  H01L29/788 ,  H01L29/423 ,  H01L29/66 ,  H01L27/11551

Abstract: Memory cells formed on upwardly extending fins of a semiconductor substrate, each including source and drain regions with a channel region therebetween, a floating gate extending along the channel region and wrapping around the fin, a word line gate extending along the channel region and wrapping around the fin, a control gate over the floating gate, and an erase gate over the source region. The control gates are a continuous conductive strip of material. First and second fins are spaced apart by a first distance. Third and fourth fins are spaced apart by a second distance. The second and third fins are spaced apart by a third distance greater than the first and second distances. The continuous strip includes a portion disposed between the second and third fins, but no portion of the continuous strip is disposed between the first and second fins nor between the third and fourth fins.

公开(公告)号：US11322507B2

公开(公告)日：2022-05-03

申请号：US17185709

申请日：2021-02-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Jack Sun ,  Xian Liu ,  Leo Xing ,  Nhan Do ,  Andy Yang ,  Guo Xiang Song

IPC: H01L21/00 ,  H01L27/11531 ,  H01L27/11521 ,  H01L29/788 ,  H01L29/66 ,  H01L21/28 ,  H01L29/49

Abstract: A method of forming a semiconductor device includes recessing the upper surface of first and second areas of a semiconductor substrate relative to the third area of the substrate, forming a pair of stack structures in the first area each having a control gate over a floating gate, forming a first source region in the substrate between the pair of stack structures, forming an erase gate over the first source region, forming a block of dummy material in the third area, forming select gates adjacent the stack structures, forming high voltage gates in the second area, forming a first blocking layer over at least a portion of one of the high voltage gates, forming silicide on a top surface of the high voltage gates which are not underneath the first blocking layer, and replacing the block of dummy material with a block of metal material.

公开(公告)号：US11315940B2

公开(公告)日：2022-04-26

申请号：US17151944

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Guo Xiang Song ,  Leo Xing ,  Jack Sun ,  Xian Liu ,  Nhan Do

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/78 ,  H01L21/762 ,  H01L29/423 ,  H01L29/66 ,  H01L21/28 ,  H01L21/265 ,  H01L29/788

Abstract: A method of forming memory cells, HV devices and logic devices on a substrate, including recessing the upper surface of the memory cell and HV device areas of the substrate, forming a polysilicon layer in the memory cell and HV device areas, forming first trenches through the first polysilicon layer and into the silicon substrate in the memory cell and HV device areas, filling the first trenches with insulation material, forming second trenches into the substrate in the logic device area to form upwardly extending fins, removing portions of the polysilicon layer in the memory cell area to form floating gates, forming erase and word line gates in the memory cell area, HV gates in the HV device area, and dummy gates in the logic device area from a second polysilicon layer, and replacing the dummy gates with metal gates that wrap around the fins.

公开(公告)号：US20210193671A1

公开(公告)日：2021-06-24

申请号：US16724010

申请日：2019-12-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Serguei Jourba ,  Catherine Decobert ,  Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Nhan Do

IPC: H01L27/11517 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  H01L29/78

Abstract: A method of forming a device on a substrate with recessed first/third areas relative to a second area by forming a fin in the second area, forming first source/drain regions (with first channel region therebetween) by first/second implantations, forming second source/drain regions in the third area (defining second channel region therebetween) by the second implantation, forming third source/drain regions in the fin (defining third channel region therebetween) by third implantation, forming a floating gate over a first portion of the first channel region by first polysilicon deposition, forming a control gate over the floating gate by second polysilicon deposition, forming an erase gate over the first source region and a device gate over the second channel region by third polysilicon deposition, and forming a word line gate over a second portion of the first channel region and a logic gate over the third channel region by metal deposition.

公开(公告)号：US10937794B2

公开(公告)日：2021-03-02

申请号：US16208150

申请日：2018-12-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Serguei Jourba ,  Catherine Decobert ,  Nhan Do

IPC: H01L27/11521 ,  H01L21/28 ,  H01L27/11526 ,  H01L27/11531 ,  H01L29/10 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788

Abstract: A memory device having plurality of upwardly extending semiconductor substrate fins, a memory cell formed on a first fin and a logic device formed on a second fin. The memory cell includes source and drain regions in the first fin with a channel region therebetween, a polysilicon floating gate extending along a first portion of the channel region including the side and top surfaces of the first fin, a metal select gate extending along a second portion of the channel region including the side and top surfaces of the first fin, a polysilicon control gate extending along the floating gate, and a polysilicon erase gate extending along the source region. The logic device includes source and drain regions in the second fin with a second channel region therebetween, and a metal logic gate extending along the second channel region including the side and top surfaces of the second fin.