摘要:
A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.
摘要:
A measuring element for recording a deflection includes a region which is situated on a semi-conductor substrate and an electrode for influencing a conductivity of the region, the electrode being mounted deflectably in relation to the region, in such a way that an overlap region is formed between the electrode and the region, the overlap region having a dimension that is variable with a deflection of the electrode. A change in the output signal of the measuring element is a function of the conductivity of the region and is controllable by a change in the dimension of the overlap region, the change in the dimension of the overlap region having a non-linear relationship with the deflection of the electrode so that a change in the output signal of the measuring element has a non-linear relationship with the deflection of the electrode.
摘要:
A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.
摘要:
A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass.
摘要:
A micromechanical component and a method for manufacturing such a component, the component having a micromechanical structure and an integrated circuit, the micromechanical structure being monolithically integrated into the circuit, the circuit being provided in a circuit area of the substrate, and the micromechanical structure being provided in a sensor area of the substrate, the material of the substrate being provided in the area of a sacrificial layer as well as in the area of a function layer without a transition.