公开(公告)号：US09309879B2

公开(公告)日：2016-04-12

申请号：US13368751

申请日：2012-02-08

申请人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

发明人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

IPC分类号： G01N1/28 ,  B32B37/06 ,  B32B37/02 ,  B01L3/00 ,  B23P17/04 ,  F04B43/04 ,  F04B19/00

CPC分类号： F04B43/043 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/0689 ,  B01L2300/0816 ,  B01L2300/123 ,  B01L2400/0481 ,  B01L2400/0655 ,  F04B19/006 ,  Y10T29/494 ,  Y10T436/25

摘要： A microsystem for fluidic applications includes a substrate with a reservoir, a first microchannel, connected to the reservoir, and a second microchannel, separated from the first microchannel by a fixed member. The microsystem furthermore has an elastic film on the substrate, which film has a joint to the substrate around the reservoir and seals the reservoir. Here, the joint has a permanent joining area and, on the fixed member, a fixed member joining area that can be broken open and adjoins the permanent joining area at both ends of the fixed member. Such a microsystem forms a processing chip with reagent receptacle.

摘要翻译： 用于流体应用的微系统包括具有储存器的基板，连接到储存器的第一微通道和通过固定构件与第一微通道分离的第二微通道。 微系统还在衬底上具有弹性膜，该膜具有与储存器周围的基底的接头并且密封贮存器。 这里，接头具有永久接合区域，并且在固定构件上具有能够断开的固定构件接合区域，并且与固定构件的两端的永久接合区域相邻。 这样的微系统形成具有试剂容器的处理芯片。

公开(公告)号：US08520396B2

公开(公告)日：2013-08-27

申请号：US12660066

申请日：2010-02-19

申请人： Manuela Schmidt ,  Axel Franke ,  Sven Zinober

发明人： Manuela Schmidt ,  Axel Franke ,  Sven Zinober

IPC分类号： H05K7/00

CPC分类号： H01L25/0657 ,  B81C1/0023 ,  H01L25/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10T29/49208 ,  H01L2924/00

摘要： A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

摘要翻译： 一种用于制造电子模块的方法，其中提供至少一个第一微电子部件，并通过第一倒装芯片方法步骤电连接到第二微电子部件; 提供至少一个介电元件，其具有至少一个印刷电路迹线，并且所述电介质元件的至少一个印刷电路迹线电连接到所述第二微电子元件; 并且所述第二微电子部件通过第二倒装芯片方法步骤通过所述电介质部件的印刷电路迹线电连接到印刷电路板，以避免通过微电子部件的通孔; 本发明还涉及相应的电子模块。

公开(公告)号：US20120214254A1

公开(公告)日：2012-08-23

申请号：US13368751

申请日：2012-02-08

申请人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

发明人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

IPC分类号： G01N1/28 ,  B32B37/06 ,  B32B37/02 ,  B01L3/00 ,  B23P17/04

CPC分类号： F04B43/043 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/0689 ,  B01L2300/0816 ,  B01L2300/123 ,  B01L2400/0481 ,  B01L2400/0655 ,  F04B19/006 ,  Y10T29/494 ,  Y10T436/25

摘要： A microsystem for fluidic applications includes a substrate with a reservoir, a first microchannel, connected to the reservoir, and a second microchannel, separated from the first microchannel by a web. The microsystem furthermore has an elastic film on the substrate, which film has a joint to the substrate around the reservoir and seals the reservoir. Here, the joint has a permanent joining area and, on the web, a web joining area that can be broken open and adjoins the permanent joining area at both ends of the web. Such a microsystem forms a processing chip with reagent receptacle.

摘要翻译： 用于流体应用的微系统包括具有储存器的基板，连接到储存器的第一微通道和通过网与第一微通道分离的第二微通道。 微系统还在衬底上具有弹性膜，该膜具有与储存器周围的基底的接头并且密封贮存器。 这里，接头具有永久接合区域，并且在腹板上具有能够断开并与腹板两端的永久接合区域相邻的腹板接合区域。 这样的微系统形成具有试剂容器的处理芯片。

公开(公告)号：US20120009006A1

公开(公告)日：2012-01-12

申请号：US13180774

申请日：2011-07-12

申请人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

发明人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

IPC分类号： B32B7/04 ,  B32B37/06 ,  B32B37/12 ,  B23P17/04 ,  B32B37/04

CPC分类号： B29C65/16 ,  B29C65/14 ,  B29C65/1635 ,  B29C65/168 ,  B29C65/4815 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/343 ,  B29C66/43 ,  B29C66/45 ,  B29C66/73366 ,  B29C66/73921 ,  B29K2105/206 ,  B29K2621/003 ,  B29K2995/0026 ,  B29L2031/756 ,  B32B7/045 ,  B32B7/12 ,  B32B25/04 ,  B32B27/08 ,  B32B37/0084 ,  B32B2274/00 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2310/0843 ,  B32B2457/00 ,  B32B2551/00 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T403/27

摘要： A method for producing a multilayer system with at least two joining elements, these being produced in particular from plastic, is disclosed. The method includes applying a compensating means, for at least partially compensating for mechanical stresses, to a first joining element, applying a second joining element to the compensating means, for joining together the first and second joining elements, firstly connecting the first joining element to the compensating means and secondly connecting the second joining element to the compensating means. A corresponding multilayer system and a corresponding use is also disclosed.

摘要翻译： 公开了一种制造具有至少两个连接元件的多层系统的方法，这些连接元件尤其由塑料制成。 该方法包括将用于至少部分地补偿机械应力的补偿装置应用于第一接合元件，将第二接合元件施加到补偿装置，用于将第一和第二接合元件接合在一起，首先将第一接合元件连接到 补偿装置，其次将第二连接元件连接到补偿装置。 还公开了相应的多层系统和相应的用途。

公开(公告)号：US20100232119A1

公开(公告)日：2010-09-16

申请号：US12660066

申请日：2010-02-19

申请人： Manuela Schmidt ,  Axel Franke ,  Sven Zinober

发明人： Manuela Schmidt ,  Axel Franke ,  Sven Zinober

IPC分类号： H05K7/00 ,  H01R43/26

CPC分类号： H01L25/0657 ,  B81C1/0023 ,  H01L25/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10T29/49208 ,  H01L2924/00

摘要： A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

摘要翻译： 一种用于制造电子模块的方法，其中提供至少一个第一微电子部件，并通过第一倒装芯片方法步骤电连接到第二微电子部件; 提供至少一个介电元件，其具有至少一个印刷电路迹线，并且所述电介质元件的至少一个印刷电路迹线电连接到所述第二微电子元件; 并且所述第二微电子部件通过第二倒装芯片方法步骤通过所述电介质部件的印刷电路迹线电连接到印刷电路板，以避免通过微电子部件的通孔; 本发明还涉及相应的电子模块。

公开(公告)号：US08790484B2

公开(公告)日：2014-07-29

申请号：US13180774

申请日：2011-07-12

申请人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

发明人： Manuela Schmidt ,  Martina Daub ,  Jochen Rupp

IPC分类号： B29C65/16

CPC分类号： B29C65/16 ,  B29C65/14 ,  B29C65/1635 ,  B29C65/168 ,  B29C65/4815 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/343 ,  B29C66/43 ,  B29C66/45 ,  B29C66/73366 ,  B29C66/73921 ,  B29K2105/206 ,  B29K2621/003 ,  B29K2995/0026 ,  B29L2031/756 ,  B32B7/045 ,  B32B7/12 ,  B32B25/04 ,  B32B27/08 ,  B32B37/0084 ,  B32B2274/00 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2310/0843 ,  B32B2457/00 ,  B32B2551/00 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T403/27

摘要： A method for producing a multilayer system with at least two joining elements, these being produced in particular from plastic, is disclosed. The method includes applying a compensating means, for at least partially compensating for mechanical stresses, to a first joining element, applying a second joining element to the compensating means, for joining together the first and second joining elements, firstly connecting the first joining element to the compensating means and secondly connecting the second joining element to the compensating means. A corresponding multilayer system and a corresponding use is also disclosed.

摘要翻译： 公开了一种制造具有至少两个连接元件的多层系统的方法，这些连接元件尤其由塑料制成。 该方法包括将用于至少部分地补偿机械应力的补偿装置应用于第一接合元件，将第二接合元件施加到补偿装置，用于将第一和第二接合元件接合在一起，首先将第一接合元件连接到 补偿装置，其次将第二连接元件连接到补偿装置。 还公开了相应的多层系统和相应的用途。

公开(公告)号：US20110076204A1

公开(公告)日：2011-03-31

申请号：US12994919

申请日：2009-04-23

申请人： Manuela Schmidt ,  Jochen Rupp

发明人： Manuela Schmidt ,  Jochen Rupp

IPC分类号： B01L99/00 ,  F16K7/12 ,  F04B43/12 ,  B21K1/20 ,  B23K26/00

CPC分类号： F16K99/0001 ,  F04B43/12 ,  F16K99/0015 ,  F16K99/0044 ,  F16K99/0057 ,  F16K99/0059 ,  F16K99/0061 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T29/49412 ,  Y10T137/0497 ,  Y10T137/2196 ,  Y10T137/2224 ,  Y10T137/7762

摘要： A pinch valve, a chip including a pinch valve of this type, a peristaltic pump including a pinch valve of this type and a method for manufacturing same. The pinch valve includes a first substrate, a second substrate, and a third substrate, the third substrate being farmed from an elastic material and situated between the first and second substrates, the first substrate adjoining the third substrate and having at least one first recess on the side adjacent to the third substrate, the second substrate adjoining the third substrate and having at least one second recess on the side adjacent to the third substrate, the first recess and the second recess being situated at least partially opposite each other.

摘要翻译： 夹管阀，包括这种夹管阀的芯片，包括这种夹管阀的蠕动泵及其制造方法。 夹管阀包括第一衬底，第二衬底和第三衬底，第三衬底由弹性材料养殖并位于第一和第二衬底之间，第一衬底邻接第三衬底并具有至少一个第一凹部 所述第二基板邻接所述第三基板并且在与所述第三基板相邻的一侧上具有至少一个第二凹部，所述第一凹部和所述第二凹部至少部分地彼此相对。

公开(公告)号：US08869815B2

公开(公告)日：2014-10-28

申请号：US12994919

申请日：2009-04-23

申请人： Manuela Schmidt ,  Jochen Rupp

发明人： Manuela Schmidt ,  Jochen Rupp

IPC分类号： F16K31/12 ,  F16K99/00 ,  F04B43/12

CPC分类号： F16K99/0001 ,  F04B43/12 ,  F16K99/0015 ,  F16K99/0044 ,  F16K99/0057 ,  F16K99/0059 ,  F16K99/0061 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T29/49412 ,  Y10T137/0497 ,  Y10T137/2196 ,  Y10T137/2224 ,  Y10T137/7762

摘要： A pinch valve, a chip including the pinch valve, a peristaltic pump including the pinch valve and a method for manufacturing the pinch valve. The pinch valve includes a first substrate, a second substrate, and a third substrate. The third substrate is formed from an elastic material and situated between the first and second substrates. The first substrate adjoins the third substrate and includes at least one first recess on the side adjacent to the third substrate. The second substrate adjoins the third substrate and includes at least one second recess on the side adjacent to the third substrate. The first recess and the second recess are situated at least partially opposite each other.

摘要翻译： 夹管阀，包括夹紧阀的芯片，包括夹紧阀的蠕动泵和用于制造夹紧阀的方法。 夹管阀包括第一基板，第二基板和第三基板。 第三基板由弹性材料形成并且位于第一和第二基板之间。 第一基板邻接第三基板，并且在与第三基板相邻的一侧包括至少一个第一凹部。 第二基板邻接第三基板并且在与第三基板相邻的一侧上包括至少一个第二凹部。 第一凹部和第二凹部至少部分地彼此相对。