利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

94 条记录 (耗时 0.052 秒)

    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
    51.
    发明授权
    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge 失效
    使用预图案化桥制造微机电系统（MEMS）装置的方法

    公开(公告)号：US06794271B2

    公开(公告)日：2004-09-21

    申请号：US09967157

    申请日：2001-09-28

    申请人： Richard D. Harris ,  Robert J. Kretschmann

    发明人： Richard D. Harris ,  Robert J. Kretschmann

    IPC分类号： H01L2130

    CPC分类号： B81C1/00357 ,  B81C2201/019 ,  B81C2203/0109

    摘要： A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

    摘要翻译： 一种用于制造MEMS结构的方法包括蚀刻在结合到最终形成MEMS结构的晶片的衬底的上表面中的凹陷，或者蚀刻到结合到衬底的晶片的下表面。 因此，一旦晶片的蚀刻工艺完成，凹陷便于在制造的MEMS结构内释放内部可移动结构，而不使用单独的牺牲材料。 此外，优选绝缘的桥在晶片附着到衬底之前被预蚀刻。

    Input/output devices having re-configurable functionality
    53.
    发明授权
    Input/output devices having re-configurable functionality 有权
    具有可重新配置功能的输入/输出设备

    公开(公告)号：US09106019B2

    公开(公告)日：2015-08-11

    申请号：US13214035

    申请日：2011-08-19

    申请人： Robert J. Kretschmann ,  David S. Wehrle ,  Joseph G. Vazach ,  Gregg M. Sichner

    发明人： Robert J. Kretschmann ,  David S. Wehrle ,  Joseph G. Vazach ,  Gregg M. Sichner

    IPC分类号： H01R13/629 ,  H01R13/635 ,  H01R13/62 ,  H05K7/14

    CPC分类号： H05K7/1468 ,  G05B15/02 ,  G05B19/054 ,  G05B19/056 ,  G05B2219/21092 ,  G05B2219/25314 ,  G05B2219/25452 ,  G06F9/44505 ,  G06F13/10 ,  H01R13/62 ,  H01R13/629 ,  H01R13/635 ,  H05K7/1474 ,  H05K7/1484 ,  Y10T29/49117 ,  Y10T307/937

    摘要： Systems and methods provide re-configurable functionality within components of I/O devices without the need of disconnecting the components from each other. For example, in certain embodiments, when certain types of components are connected to each other, certain functionality sets within the components may be activated to provide combined functionality sets between the components. The combined functionality sets may, for example, be preferred functionality sets to be used when the particular types of components are connected to each other. Furthermore, in certain embodiments, functionality activation keys may be physically inserted into (or electronically communicated to) the components of the I/O device to activate certain functionality sets within the component into which the functionality activation key is inserted (or electronically communicated to), as well as within the other components of the I/O device to which the component is connected.

    摘要翻译： 系统和方法在I / O设备的组件中提供可重新配置的功能，而不需要将组件彼此断开连接。 例如，在某些实施例中，当某些类型的组件彼此连接时，组件内的某些功能集可被激活以在组件之间提供组合功能集。 组合的功能集可以例如是当特定类型的组件彼此连接时要使用的优选功能集。 此外，在某些实施例中，功能激活密钥可以物理地插入（或电子地传送到）I / O设备的组件，以激活功能激活密钥插入（或电子传送到）的组件内的某些功能集， ，以及组件连接到的I / O设备的其他组件内。

    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
    59.
    发明授权
    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge 失效
    使用预先构图的桥制造微机电系统（MEMS）装置的方法

    公开(公告)号：US06846724B2

    公开(公告)日：2005-01-25

    申请号：US10841649

    申请日：2004-05-07

    申请人： Richard D. Harris ,  Robert J. Kretschmann

    发明人： Richard D. Harris ,  Robert J. Kretschmann

    IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L21/30 ,  H01L21/00

    CPC分类号： B81C1/00357 ,  B81C2201/019 ,  B81C2203/0109

    摘要： A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

    摘要翻译： 一种用于制造MEMS结构的方法包括蚀刻在结合到最终形成MEMS结构的晶片的衬底的上表面中的凹陷，或者蚀刻到结合到衬底的晶片的下表面。 因此，一旦晶片的蚀刻工艺完成，凹陷便于在制造的MEMS结构内释放内部可移动结构，而不使用单独的牺牲材料。 此外，优选绝缘的桥在晶片附着到衬底之前被预蚀刻。